JPS58166053U - 整流ダイオ−ドブリツジ - Google Patents

整流ダイオ−ドブリツジ

Info

Publication number
JPS58166053U
JPS58166053U JP1982063103U JP6310382U JPS58166053U JP S58166053 U JPS58166053 U JP S58166053U JP 1982063103 U JP1982063103 U JP 1982063103U JP 6310382 U JP6310382 U JP 6310382U JP S58166053 U JPS58166053 U JP S58166053U
Authority
JP
Japan
Prior art keywords
cathode
common
connect
anode
rectifier diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982063103U
Other languages
English (en)
Inventor
岩崎　明徳
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982063103U priority Critical patent/JPS58166053U/ja
Publication of JPS58166053U publication Critical patent/JPS58166053U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Landscapes

  • Protection Of Static Devices (AREA)
  • Rectifiers (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は、従来の最もポピユラーなダイオード整流ブリ
ッジの内部構成図、第２図は、第１図の整流ブリッジの
交流入力端子及び直流出力端子を各方向に整えた場合の
ダイオード整流ブリッジの内部構成図、第３図は本考案
のダイオード整流ブリッジの内部構成図、第４図は第３
図の回路図である。 なお図において、１．　２．　１０．　１１．　１７゜
１８・・・・・・直流出力端子ミ３．　４．　８．　９
．　１５゜１６・・・・・・交流入力端子、５．６．　
１２．　１３゜１９．２（・・・・・・整流ダイオード
チップ、２１・・・・・・サージ吸収素子、？、　　１
４．　２２・・・・・・外装樹脂、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. アノード及びカソード共通のそれぞれ対をなすダイオー
    ド整流チップを直流出力端子のそれぞれ（−）側、（＋
    ）側のフレーム上に有し２つめカソード共通チップのア
    ノード側と２つのアノード共通チップのカソード側とを
    、それぞれを交流入力端子フレームに朶ンデイング線で
    接続する整流ダイオードブリッジにおいて一方の交流入
    力端子フレーム上にサージ吸収素子の電極の一方を接続
    し、該サージ吸収素子の他方電極面上と他方の交流入力
    端子及びアノード共通チップの片方のカソードをボンデ
    ィング線で接続し、カソード共通整流ダイオードチップ
    のアノード′と該他方の交流入力端子をホンディング線
    で接続し該一方の交流入力端子とカソード共通及びカソ
    ード共通の他方の整流ダイオードチップのそれぞれアノ
    ード及びカソードをボンディング線で接続し、直流出力
    端子と交流入力端子とをそれぞれ同一方向に対として配
    置することを特徴とする整流ダイオードブリッジ。
JP1982063103U 1982-04-28 1982-04-28 整流ダイオ−ドブリツジ Pending JPS58166053U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982063103U JPS58166053U (ja) 1982-04-28 1982-04-28 整流ダイオ−ドブリツジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982063103U JPS58166053U (ja) 1982-04-28 1982-04-28 整流ダイオ−ドブリツジ

Publications (1)

Publication Number Publication Date
JPS58166053U true JPS58166053U (ja) 1983-11-05

Family

ID=30073221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982063103U Pending JPS58166053U (ja) 1982-04-28 1982-04-28 整流ダイオ−ドブリツジ

Country Status (1)

Country Link
JP (1) JPS58166053U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015186409A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 電力変換装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015186409A (ja) * 2014-03-26 2015-10-22 株式会社デンソー 電力変換装置

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