JPS58162538U - Temperature-sensing protection device - Google Patents
Temperature-sensing protection deviceInfo
- Publication number
- JPS58162538U JPS58162538U JP6025882U JP6025882U JPS58162538U JP S58162538 U JPS58162538 U JP S58162538U JP 6025882 U JP6025882 U JP 6025882U JP 6025882 U JP6025882 U JP 6025882U JP S58162538 U JPS58162538 U JP S58162538U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- protection device
- temperature
- generating electronic
- power source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第３図はそれぞれ従来の電流検知型保護回路
図、第４図は本考案による温度検知型保護回路図、第５
図乃至第１０図は本考案の保護装置の具体的構成図を示
す。
１：絶縁性基板、２． ２’ ：配線導体、３．３′
：導電性接着材、４，４０：導電接続体、５：発熱性
電子部品。Figures 1 to 3 are conventional current detection type protection circuit diagrams, Figure 4 is a temperature detection type protection circuit diagram according to the present invention, and Figure 5 is a diagram of a conventional current detection type protection circuit.
Figures 1 to 10 show specific configuration diagrams of the protection device of the present invention. 1: Insulating substrate, 2. 2': Wiring conductor, 3.3'
: conductive adhesive, 4, 40: conductive connection body, 5: heat generating electronic component.
Claims (1)
性電子部品にそれぞれ接続される配線導体を形成し、上
記両配線導体間＆と介在される基板実装形の導電接続体
を設け、該接続体を上記基板に固着し、かつ上記発熱性
電子部品の安全温度領域を越えたとき溶解する導電性接
着材を上記配線導体に形成し、上記発熱性電子部品が安
全温度領域を越えたときに上記接続体を上記配線導体か
ら離反して上記発熱性電子部品を電源から開放する構成
としたことを特徴とする温度検知型保護装置。Wiring conductors each connected to at least a power source and a heat generating electronic component such as a semiconductor element are formed on an insulating substrate, and a board-mounted conductive connecting body is provided between and intervening between the two wiring conductors. A conductive adhesive is formed on the wiring conductor that melts when the temperature exceeds the safe temperature range of the heat-generating electronic component. A temperature sensing type protection device characterized in that the connecting body is separated from the wiring conductor to disconnect the heat generating electronic component from the power source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6025882U JPS58162538U (en) | 1982-04-23 | 1982-04-23 | Temperature-sensing protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6025882U JPS58162538U (en) | 1982-04-23 | 1982-04-23 | Temperature-sensing protection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58162538U true JPS58162538U (en) | 1983-10-29 |
Family
ID=30070512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6025882U Pending JPS58162538U (en) | 1982-04-23 | 1982-04-23 | Temperature-sensing protection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58162538U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023137U (en) * | 1988-06-15 | 1990-01-10 | ||
| WO2013051201A1 (en) * | 2011-10-04 | 2013-04-11 | 富士電機株式会社 | Three-level power conversion circuit system |
-
1982
- 1982-04-23 JP JP6025882U patent/JPS58162538U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023137U (en) * | 1988-06-15 | 1990-01-10 | ||
| WO2013051201A1 (en) * | 2011-10-04 | 2013-04-11 | 富士電機株式会社 | Three-level power conversion circuit system |
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