JPS5816180Y2 - Component mounting structure of multilayer printed wiring board - Google Patents
Component mounting structure of multilayer printed wiring boardInfo
- Publication number
- JPS5816180Y2 JPS5816180Y2 JP1978139076U JP13907678U JPS5816180Y2 JP S5816180 Y2 JPS5816180 Y2 JP S5816180Y2 JP 1978139076 U JP1978139076 U JP 1978139076U JP 13907678 U JP13907678 U JP 13907678U JP S5816180 Y2 JPS5816180 Y2 JP S5816180Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- mounting structure
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案は多層プリント配線板の部品実装構造の改良に関
する。[Detailed Description of the Invention] The present invention relates to an improvement in the component mounting structure of a multilayer printed wiring board.
従来、電子計算装置を始めとする電子機器に用いられて
いるプリント配線板は、部品の搭載と部品間の電気的接
続を行なうものであり、電子機器設計上で必要欠くべか
らざる部品である。Printed wiring boards conventionally used in electronic devices such as electronic computing devices are used to mount components and make electrical connections between the components, and are indispensable components in the design of electronic devices.
而して最近はＩＣ，ＬＳＩなどの高密度集積口路が出現
するにおよびプリント配線板に対する配線密度の飛躍的
増大の要求が強くなり、そのためプリント板を多数積層
して多層化して多層プリント配線板が用いられるように
なって来ている。Recently, with the emergence of high-density integration routes for ICs, LSIs, etc., there has been a strong demand for a dramatic increase in wiring density for printed wiring boards. Boards are coming into use.
これに従い部品の実装も高密度化され多層プリント配線
板の表裏両面を使用する実装構造がとられている。Accordingly, component mounting has become more dense, and a mounting structure that uses both the front and back sides of a multilayer printed wiring board has been adopted.
ところがプリント配線板の両面を使用する場合に、従来
ば１方の面に部品を取付け、次に他方の面に部品を取付
けるとき、先に取付けた部品が半田が溶けて脱落するこ
とがある。However, when using both sides of a printed wiring board, conventionally, when parts are attached to one side and then parts are attached to the other side, the solder of the previously attached parts may melt and fall off.
本考案はこの欠点を改良するために案出されたものであ
る。The present invention was devised to improve this drawback.
このため本考案においては、多層プリント配線板の表裏
両崩よ０同一スルーホールに部品を実装した実装構造に
釦いて、プリント配線板の表裏両面の部品とスルーホー
ルのランドとの間に夫々半田を挿入し、該表裏両面の部
品を同時に加熱して半田を溶融し、２個の部品を同時に
実装したことな特徴とするものである。For this reason, in the present invention, both the front and back sides of the multilayer printed wiring board have a mounting structure in which components are mounted in the same through hole, and solder is applied between the components on both the front and back sides of the printed wiring board and the land of the through hole. is inserted, the front and back parts are simultaneously heated to melt the solder, and the two parts are mounted at the same time.
以下、添付図面に基づいて本考案の実施例につき詳細に
説明する。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
第１図に実施例の断面を示す。FIG. 1 shows a cross section of the embodiment.
図に訣いて１は多層プリント配線板、２はスルーホール
、３および３′は座金状の部品である。In the figure, 1 is a multilayer printed wiring board, 2 is a through hole, and 3 and 3' are washer-like parts.
この部品３，３′は半田４にてスルーホール２に接合さ
れているが、これば同時に接合されたものである。These parts 3, 3' are joined to the through-hole 2 with solder 4, but they are joined at the same time.
この同時接合は第２図に示す如き方法で行なわれる。This simultaneous bonding is performed by the method shown in FIG.
即ち、多層プリント配線板１０表裏両面の部品３，３′
とスルーホールのランド５との間に夫々リング状をした
半田６を挾み、部品抑えＴおよび７′にて部品３゜３′
を押圧しながら保持し、加熱治具８及び８′を発熱させ
ながら同時に部品３，３′を押圧して加熱し、これによ
り半田６を溶融して部品３，３′をスルーホール２に接
合するのである。That is, components 3, 3' on both the front and back sides of the multilayer printed wiring board 10
A ring-shaped solder 6 is sandwiched between the land 5 of the through hole and the through hole, and the component 3° 3' is held down with component holders T and 7'.
While pressing and holding the parts 3 and 3', the heating jigs 8 and 8' generate heat while simultaneously pressing and heating the parts 3 and 3', thereby melting the solder 6 and joining the parts 3 and 3' to the through hole 2. That's what I do.
このときプリント配線板の表裏両面の部品は同時にスル
ーホールに接合されるため一方の部品が脱落するような
ことばない。At this time, the components on both the front and back sides of the printed wiring board are bonded to the through holes at the same time, so there is no chance of one component falling off.
以上、説明したように本考案にかかる多層プリント配線
板の部品実装構造は２個の部品をプリント配線板の表裏
両面より同時に接合し、その接合時に一方の部品が脱落
することを防止したものである。As explained above, the component mounting structure of the multilayer printed wiring board according to the present invention is such that two components are simultaneously joined from both the front and back sides of the printed wiring board, and one component is prevented from falling off during the joining. be.
第１図は本考案にかかる実施例の多層プリント配線板の
部品実装構造の断面図、第２図はその製造工程中の断面
図である。
１・・・多層プリント配線板、２・・・スルーホール３
．３′・・・部品、５・・・ランド、４，６・・・半田
。FIG. 1 is a cross-sectional view of a component mounting structure of a multilayer printed wiring board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view during the manufacturing process thereof. 1...Multilayer printed wiring board, 2...Through hole 3
．． 3'...Parts, 5...Land, 4, 6...Solder.
Claims (1)
部品を実装した実装構造において、部品とスルーホール
のランド間に半田を置き、表裏両面の部品を同時に加熱
して半田を溶融し、２個の□部品を同時に実装したこと
を特徴とする多層プリント配線板の部品実装構造。In a mounting structure in which components are mounted in uniform through holes from both the front and back sides of a multilayer printed wiring board, solder is placed between the lands of the components and the through holes, and the components on both the front and back sides are heated simultaneously to melt the solder and form two □A multilayer printed wiring board component mounting structure characterized by simultaneous mounting of components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978139076U JPS5816180Y2 (en) | 1978-10-12 | 1978-10-12 | Component mounting structure of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978139076U JPS5816180Y2 (en) | 1978-10-12 | 1978-10-12 | Component mounting structure of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5555978U JPS5555978U (en) | 1980-04-16 |
| JPS5816180Y2 true JPS5816180Y2 (en) | 1983-04-01 |
Family
ID=29112823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978139076U Expired JPS5816180Y2 (en) | 1978-10-12 | 1978-10-12 | Component mounting structure of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5816180Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5817966U (en) * | 1981-07-29 | 1983-02-03 | 大阪瓦斯株式会社 | Torque Wrench |
| JPS58125373U (en) * | 1982-02-18 | 1983-08-25 | 富士通株式会社 | printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528470A (en) * | 1975-07-09 | 1977-01-22 | Nippon Electric Co | Integrated circuit device |
-
1978
- 1978-10-12 JP JP1978139076U patent/JPS5816180Y2/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS528470A (en) * | 1975-07-09 | 1977-01-22 | Nippon Electric Co | Integrated circuit device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5555978U (en) | 1980-04-16 |
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