JPS58157152A - Glass sealed type semiconductor device - Google Patents

Glass sealed type semiconductor device

Info

Publication number
JPS58157152A
JPS58157152A JP3955082A JP3955082A JPS58157152A JP S58157152 A JPS58157152 A JP S58157152A JP 3955082 A JP3955082 A JP 3955082A JP 3955082 A JP3955082 A JP 3955082A JP S58157152 A JPS58157152 A JP S58157152A
Authority
JP
Japan
Prior art keywords
glass
concavity
semiconductor element
ceramic
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3955082A
Other languages
Japanese (ja)
Other versions
JPH0221654B2 (en
Inventor
Eiji Yamamoto
英治 山本
Hiroshi Tsuneno
常野　宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3955082A priority Critical patent/JPS58157152A/en
Publication of JPS58157152A publication Critical patent/JPS58157152A/en
Publication of JPH0221654B2 publication Critical patent/JPH0221654B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE:To obtain the glass sealed type semiconductor device having no deterioration in airtightness and the like even when a large-sized pellet is stored therein by a method wherein a part of the glass sealed section of a cap member is protruded toward the direction of an element placing part. CONSTITUTION:On a ceramic base 1, a concavity 2 is formed in large size so that a large semiconductor element can be stored in the concavity which will be used to store the semiconductor element. Also, a ceramic cap has a concavity 8 which is equal to or larger in size than the concavity 2 of the ceramic base 1. Generally, the concavity 8 of the ceramic cap 3 is provided for the purpose of preventing the deterioration of characteristics of the semiconductor element 7 caused by the botton face of the ceramic cap coming in contact with a wire 6 and the like when the semiconductor element 7 is placed on the ceramic base 1, a wire bonding is performed on the prescribed position and the ceramic cap 3 is sealed thereon using sealing glass. A protrusion 9 which is protruding into the concavity 8 from a sealed junction part 4 is provided in such a manner that said protrusion exerts no adverse effect on wires and the like, thereby enabling to obtain the structure in which region retentive of glass can be increased substantially.

Description

【発明の詳細な説明】 本発明は半導体素子を収納したセラミックペースとセラ
ミックキャップとの接合面をガラス封止するとともに、
一端を前記半導体素子に電気的に接続したリードの他膚
を前記接合面を通して外部に導出する構成のガラス封止
型半導体装置の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention seals the bonding surface between a ceramic paste containing a semiconductor element and a ceramic cap with glass, and
The present invention relates to an improvement in a glass-sealed semiconductor device having a structure in which one end of a lead is electrically connected to the semiconductor element and the other end is led out through the bonding surface.

この種のガラス封止蓋半導体装置においては、第１図（
１１のようにセラミックペース１は半導体素子を収納す
るための凹部２と、気密封止な実施する為のセラミック
キャップ３との接合部４とな有している。５はリード、
６はボンディングワイヤ、７は半導体素子である。In this type of glass-sealed lid semiconductor device, FIG.
As shown in 11, the ceramic paste 1 has a recess 2 for accommodating a semiconductor element, and a joint 4 with a ceramic cap 3 for airtight sealing. 5 is lead,
6 is a bonding wire, and 7 is a semiconductor element.

ここで大きな半導体素子を収納する場合は大きな凹ｍな
必要とするが、・しかしながらセラミックペースの外形
寸法は一般にそのパッケージをプリント基板等に実装す
る際の条件により規制をうける為、凹部な大きくするた
めには封止接合部幅を狭くすることにより達成させねば
ならない。When storing a large semiconductor element, a large recess is required.However, the external dimensions of ceramic paste are generally regulated by the conditions when mounting the package on a printed circuit board, etc., so the recess must be large. This must be achieved by narrowing the sealing joint width.

しかしながら、この種の構造の如く封止接合部の狭い部
分を有するパッケージ構造においては、封止接合部の狭
い部分での封止ガラスの保持量が広い部品に比べ著しく
少なくなり、封止ガラスの絶対量不足を生じて気密性が
そこなわれるという問題が生じている。However, in a package structure with a narrow sealing joint such as this type of structure, the amount of sealing glass held in the narrow part of the sealing joint is significantly smaller than that of a wide part, and A problem has arisen in which an absolute shortage occurs and airtightness is compromised.

したがって、本発明の目的はキャップ部材のガラス封着
部の一部を素子載置部に向がっ℃突出させることにより
、これら従来技術の欠点を解消し、大型ペレットを収納
する場合にも気密性の低下等のないガラス封止型の半導
体装置を提供することにある。Therefore, an object of the present invention is to eliminate these drawbacks of the prior art by making a part of the glass sealing part of the cap member protrude toward the element mounting part, and to provide an airtight seal even when storing large pellets. It is an object of the present invention to provide a glass-sealed semiconductor device without deterioration in performance.

以下、本発明な図面に示す例にしたがって説明する。Hereinafter, the present invention will be explained according to an example shown in the drawings.

第２図（ａ）、　（ｂ）は本発明による半導体装置の断
面図およびキャップの斜視図である。図示のように、セ
ラミックベース１は半導体素子を収納する為の凹部２が
大型半導体素子を収納できるように十分大きく形成され
℃いる。また、セラミックキャップ３も前記セラミック
ベース１の凹部２と同等またはそれ以上の大きさの凹部
８を有しており、単にこのままでは封止接合部４の狭い
部分においては封止ガラスの不足が生じる。FIGS. 2(a) and 2(b) are a cross-sectional view of a semiconductor device and a perspective view of a cap according to the present invention. As shown in the figure, the ceramic base 1 has a recess 2 for accommodating a semiconductor element, which is formed sufficiently large to accommodate a large semiconductor element. Further, the ceramic cap 3 also has a recess 8 that is equal to or larger in size than the recess 2 of the ceramic base 1, and if left as is, there will be a shortage of sealing glass in the narrow part of the sealing joint 4. .

ところで、セラミックキャップ３の凹部８は一般に半導
体素子７をセラミックベースｌ＃ＩＣ載置し、その後所
定の位置にワイヤボンディングされたものにセラミック
キャップ３４を封止ガラスにより封止した時に、セラミ
ツクキャップ３底面が前記ワイヤＩＩＫ当って半導体素
子７の特性をそこなわない様にする為設けられている。Incidentally, the recess 8 of the ceramic cap 3 is generally formed when the semiconductor element 7 is mounted on the ceramic base l#IC and then the ceramic cap 34 is sealed with a sealing glass to the ceramic cap 34 which is wire-bonded to a predetermined position. This is provided to prevent the bottom surface from touching the wire IIK and damaging the characteristics of the semiconductor element 7.

そこで本発明ではワイヤ等のない部分には凹部８な形成
する必要がないことに注目し、このワイヤ等に影４１す
及ぼさない範囲で封止接合部４より凹ｓ８への突出部９
を設け、これによりガラス保持可能領域な実質的に増す
構造とする。したがって、凹部８の有効性は失なわずに
封止に必要なガラス量が確保できる構造となり大型ペレ
ットの収納が可能となる。Therefore, in the present invention, it is noted that there is no need to form a recess 8 in a portion where there is no wire, etc., and a protrusion 9 from the sealing joint 4 to the recess s8 is formed within a range that does not cast a shadow 41 on the wire, etc.
This structure substantially increases the area in which the glass can be held. Therefore, the structure is such that the amount of glass necessary for sealing can be secured without losing the effectiveness of the recess 8, and it is possible to store large pellets.

なお突出部９は両側から内方へ向かって形成しているが
、第３図のように両側のものを連結した突出部９人とし
て構成してもよい。Although the protrusions 9 are formed inward from both sides, they may be formed as nine protrusions by connecting the protrusions on both sides as shown in FIG.

以上のように本発明の半導体装置によれば、セラミック
キャップに突出部な設けてガラス封着部の実質的面積の
増大を図っているので、大型ペレットを収納するにもか
かわらずパッケージの小型化を図りかつ一方では封止性
能の向上を達成することができるという効果を奏する。As described above, according to the semiconductor device of the present invention, the ceramic cap is provided with a protruding part to increase the substantial area of the glass sealing part, so the package can be made smaller despite storing large pellets. At the same time, it is possible to achieve an improvement in sealing performance.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（１）は従来の半導体装置の断面図、（ｂ）はセ
ラミックキャップの斜視図、鎮２図（ａ）は本発明の半
導体装置の断面図、（ｂ）はそのセラミックキャップの
斜視図、第３図は本発明の他の実施例を示すセラミック
キャップの斜視図である。 １・・・セラεツクベース、２・・・凹部、３・・・セ
ラミックキャップ、４・・・封止接合部（ガラス封着部
）、５・・・リード、６・・・ワイヤ、７・・・半導体
素子、８・・・凹部、９，９人・・・突出部。 第　　１　　図 （ｔａ） と・σ）Figure 1 (1) is a sectional view of a conventional semiconductor device, (b) is a perspective view of a ceramic cap, Figure 2 (a) is a sectional view of a semiconductor device of the present invention, and (b) is a perspective view of the ceramic cap. 3 are perspective views of a ceramic cap showing another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Ceramic base, 2... Recessed part, 3... Ceramic cap, 4... Sealing joint (glass sealing part), 5... Lead, 6... Wire, 7... ...Semiconductor element, 8...Concave part, 9,9 person...Protrusion part. Figure 1 (ta) and σ)

Claims (1)

【特許請求の範囲】[Claims] １、半導体素子を載置するため凹部な一生面に有するセ
ラミックペースと、前記素子載量部をおおって配置され
るキャップ部材と、前記ベースの素子載置部の周辺部に
設けられキャップ部材を固着して素子載置部な気密封止
するためのガラス封着部と、前記半導体素子の各電極に
それぞれ接続され、それらの電極を前記ガラス封着部を
介して外部に引き出す複数の外部導出リードとをそなえ
た半導体装置において、前記キャップ部材のペースとの
ガラス封着部の一郁を素子載置部に向かって突出させ、
前記ガラス層の実質面積の増大を図ったことを特徴とす
るガラス封止蓋半導体装置。1. A ceramic paste provided on a recessed surface for mounting a semiconductor element, a cap member disposed to cover the element mounting part, and a cap member provided around the element mounting part of the base. A glass sealing part for fixing and airtightly sealing the element mounting part, and a plurality of external leads connected to each electrode of the semiconductor element and drawing out those electrodes to the outside through the glass sealing part. In a semiconductor device equipped with a lead, a portion of the glass sealing portion of the cap member with the paste is protruded toward the element mounting portion;
A semiconductor device with a glass sealing lid, characterized in that the substantial area of the glass layer is increased.
JP3955082A 1982-03-15 1982-03-15 Glass sealed type semiconductor device Granted JPS58157152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3955082A JPS58157152A (en) 1982-03-15 1982-03-15 Glass sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3955082A JPS58157152A (en) 1982-03-15 1982-03-15 Glass sealed type semiconductor device

Publications (2)

Publication Number Publication Date
JPS58157152A true JPS58157152A (en) 1983-09-19
JPH0221654B2 JPH0221654B2 (en) 1990-05-15

Family

ID=12556161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3955082A Granted JPS58157152A (en) 1982-03-15 1982-03-15 Glass sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS58157152A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773937U (en) * 1980-10-24 1982-05-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773937U (en) * 1980-10-24 1982-05-07

Also Published As

Publication number Publication date
JPH0221654B2 (en) 1990-05-15

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