JPS58155777U - Terminal board structure - Google Patents

Terminal board structure

Info

Publication number
JPS58155777U
JPS58155777U JP5408482U JP5408482U JPS58155777U JP S58155777 U JPS58155777 U JP S58155777U JP 5408482 U JP5408482 U JP 5408482U JP 5408482 U JP5408482 U JP 5408482U JP S58155777 U JPS58155777 U JP S58155777U
Authority
JP
Japan
Prior art keywords
terminal board
parallel
terminal
board structure
molded substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5408482U
Other languages
Japanese (ja)
Inventor
白井 守
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP5408482U priority Critical patent/JPS58155777U/en
Publication of JPS58155777U publication Critical patent/JPS58155777U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の端子板構造を示すイは装置の斜視図口は
イの点線枠M部分の詳細図、第2図は本考案の一実施例
を分離した形で示す斜視図である。 図中1はモールド基板、2はボビン、3はコイル、4.
9は端末、5,10は端子、6,15は端子板本体、8
はラッピング端子、13.14は突起、16.17は孔
を示す。
FIG. 1 is a perspective view of the device showing a conventional terminal plate structure, and FIG. 2 is a detailed perspective view of the dotted line frame M in FIG. In the figure, 1 is a mold substrate, 2 is a bobbin, 3 is a coil, 4.
9 is a terminal, 5 and 10 are terminals, 6 and 15 are terminal board bodies, 8
indicates a wrapping terminal, 13.14 indicates a protrusion, and 16.17 indicates a hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] モールド基板に並列して植立された端子と該モールド基
板に並行して装着される端子板の端子とがそれぞれ接続
される装置において、端子が圧入される孔が並設された
モールド基板と、該モールド基板の孔にそれぞれ圧入さ
れる下部の位置および上部の所望の位置に、潰し成形さ
れた突起が形成された端子と、該端子の上部に圧入され
る孔が並列して設けられ、該モールド基板に装着される
端子板本体とで構成されてなることを特徴とする端子板
構造。
In a device in which terminals planted in parallel on a molded substrate and terminals of a terminal board mounted in parallel on the molded substrate are connected, a molded substrate in which holes into which the terminals are press-fitted are arranged in parallel; A terminal having a crushed protrusion formed therein and a hole to be press-fitted into the upper part of the terminal are provided in parallel at a lower position to be press-fitted into the hole of the molded substrate and a desired upper part position, respectively. A terminal board structure comprising a terminal board body attached to a molded board.
JP5408482U 1982-04-14 1982-04-14 Terminal board structure Pending JPS58155777U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5408482U JPS58155777U (en) 1982-04-14 1982-04-14 Terminal board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5408482U JPS58155777U (en) 1982-04-14 1982-04-14 Terminal board structure

Publications (1)

Publication Number Publication Date
JPS58155777U true JPS58155777U (en) 1983-10-18

Family

ID=30064716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5408482U Pending JPS58155777U (en) 1982-04-14 1982-04-14 Terminal board structure

Country Status (1)

Country Link
JP (1) JPS58155777U (en)

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