JPS5815528B2 - sex - Google Patents

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Publication number
JPS5815528B2
JPS5815528B2 JP8191775A JP8191775A JPS5815528B2 JP S5815528 B2 JPS5815528 B2 JP S5815528B2 JP 8191775 A JP8191775 A JP 8191775A JP 8191775 A JP8191775 A JP 8191775A JP S5815528 B2 JPS5815528 B2 JP S5815528B2
Authority
JP
Japan
Prior art keywords
alloy
strength
crystal grains
present
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8191775A
Other languages
Japanese (ja)
Other versions
JPS526334A (en
Inventor
待鳥晴香
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP8191775A priority Critical patent/JPS5815528B2/en
Publication of JPS526334A publication Critical patent/JPS526334A/en
Publication of JPS5815528B2 publication Critical patent/JPS5815528B2/en
Expired legal-status Critical Current

Links

Description

【発明の詳細な説明】 本発明はN1−P−Cu合金の改良に関する。[Detailed description of the invention] The present invention relates to improvements in N1-P-Cu alloys.

Ni −P−Cu合金は耐食性が優れかつ高導電性高熱
伝導性を兼ね備えており、極超短波用受信管のグリッド
等の構造部材に主に使用されている。
Ni-P-Cu alloys have excellent corrosion resistance, high electrical conductivity, and high thermal conductivity, and are mainly used for structural members such as grids of extremely high frequency receiver tubes.

この合金においては通常Ni とPの含有量が含量で1
,25〜1.5%のものが用いられており、更にNi
とPの比率が約5:1のものが最良の機械的強度を示す
ことが知られている。
In this alloy, the content of Ni and P is usually 1
, 25 to 1.5% is used, and further Ni
It is known that a ratio of P and P of about 5:1 exhibits the best mechanical strength.

しかしながらこの合金は600℃以七の高温では結晶粒
が粗大化しもろ(なるという難点があった。
However, this alloy has the disadvantage that the crystal grains become coarse at high temperatures of 600° C. or higher.

このN1−P−Cu合金は700〜800で溶体化処理
を行ない。
This N1-P-Cu alloy was subjected to solution treatment at a temperature of 700-800.

急冷後500〜550°Cで析出硬化処理を行ない強度
を得るものであるが、この場合、溶体化処理時に結晶粒
が粗大化し、加工時の肌荒れをきたしていた。
After rapid cooling, precipitation hardening treatment is performed at 500 to 550°C to obtain strength, but in this case, crystal grains become coarse during solution treatment, resulting in rough surface during processing.

さらに、前述の超音波受信管のグリッドは放電加工で加
工されるのが通常である。
Furthermore, the grid of the ultrasonic receiving tube mentioned above is usually machined by electric discharge machining.

したがって、加工の際さらに高温に加熱されるため、加
−[部付近の結晶粒が著しく粗大化し、強度の低F及び
加工性を劣化させていた。
Therefore, since the steel is heated to a higher temperature during processing, the crystal grains near the processed portion become significantly coarser, resulting in a low F strength and poor workability.

本発明はこのような難点を改良したもので、高温での結
晶粒の粗大化を抑制することにより、溶体化処理、析出
硬化処理後、微細な結晶粒を有するN1−P−Cu系合
金を提供するものである。
The present invention improves on these difficulties, and by suppressing the coarsening of crystal grains at high temperatures, N1-P-Cu alloys with fine crystal grains can be made into N1-P-Cu alloys after solution treatment and precipitation hardening. This is what we provide.

即ち重量%でNiO,5〜1.5%、P 0.1〜0.
4%、Si0.005〜01%を含み残部が実質的にC
11よりなることを特徴とするものである。
That is, NiO, 5-1.5%, P 0.1-0.
4%, Si 0.005-01%, and the remainder is substantially C.
It is characterized by consisting of 11 parts.

ここで各成分を上記の範囲に限定した理由は、Ni及び
Pは機械的強度を与えるものであるが、上記範囲をこえ
て、添加しても、強度の向−トは少なく、導電率を劣化
させるので好ましくなく、また少ないと、その効果がな
い。
The reason why each component is limited to the above range is that Ni and P provide mechanical strength, but even if added beyond the above range, the strength will not increase much and the electrical conductivity will decrease. It is not preferable because it causes deterioration, and if it is too small, it will not be effective.

Siは高温における結晶粒の粗大化を防ぐ効果を持ち同
時に強度を向上させしかも延性に富んだ性質を与えるも
のである。
Si has the effect of preventing coarsening of crystal grains at high temperatures, and at the same time improves strength and provides properties rich in ductility.

しかしてSiは0.005%以上であればその効果を表
わすが0.10%をこえて添加すると導電性を劣化させ
る等の悪影響を及ぼし添加量の削合にしては効果がない
However, if Si is added in an amount of 0.005% or more, it exhibits its effect, but if it is added in an amount exceeding 0.10%, it has an adverse effect such as deteriorating the conductivity, and there is no effect in reducing the amount added.

以下本発明を実施例により詳述する。The present invention will be explained in detail below with reference to Examples.

Ni 、P、およびCuを第1表に示すような組成で配
合して真空中にて溶解してなる合金を試料とした。
An alloy prepared by blending Ni, P, and Cu in the composition shown in Table 1 and melting the mixture in a vacuum was used as a sample.

次いでこれ等の試料を熱間及び冷間圧延で0.5tの板
とした。
These samples were then hot- and cold-rolled into 0.5t plates.

これを800℃で約30分の溶体化処理を行ない、急冷
後500℃で3時間析出硬化処理を行った。
This was subjected to solution treatment at 800°C for about 30 minutes, and after rapid cooling, precipitation hardening treatment was performed at 500°C for 3 hours.

こうして得られた試料の結晶粒度及び引張り特性を測定
した。
The grain size and tensile properties of the sample thus obtained were measured.

また引張試験時の材料の表面状態を調べた。The surface condition of the material during the tensile test was also investigated.

その結果を第2表に示す。The results are shown in Table 2.

第2表から明らかなように本発明合金(試料屋2.3.
4)は上記の処理を施こした状態でも結晶粒は粗大化し
ていない。
As is clear from Table 2, the alloy of the present invention (Sample Shop 2.3.
In case 4), the crystal grains were not coarsened even after the above treatment.

そのため引張り強さが向上しその伸び率も優れている。Therefore, the tensile strength is improved and the elongation rate is also excellent.

また引張り試験時の肌荒れもな(従来例(試料JI6.
1 )と比較して加工性に優れている。
Also, there is no rough skin during the tensile test (conventional example (sample JI6.
It has superior workability compared to 1).

なお本発明合金はSiを添加することによりSiの金属
間化合物が微細に分散しておりこのことが引張り強さ等
の特性向上の要因と考えられる。
In the alloy of the present invention, Si intermetallic compounds are finely dispersed by adding Si, and this is considered to be a factor in improving properties such as tensile strength.

以上記載したように本発明合金は通常の溶体化処理及び
時効処理を施こした後も結晶粒が粗大化することな(強
度および延性の優れたものである。
As described above, the alloy of the present invention does not have coarse grains even after being subjected to ordinary solution treatment and aging treatment (it has excellent strength and ductility).

したがって極超短波用受信管のり゛リッドに好適するの
はいうまでもなく、更にこの系の合金の用途を拡げるこ
とが出来る。
Therefore, it goes without saying that it is suitable for receiving tube solids for extremely high frequency waves, and the applications of this type of alloy can be further expanded.

Claims (1)

【特許請求の範囲】[Claims] 1 重量%でニッケル(Ni ) 0.5〜1.5%、
燐(P ) 0.1〜0.4%、硅素(Si ) 0.
005〜0.1%を含み残部が実質的に銅(Cu)から
なる析出硬化銅合金。
Nickel (Ni) 0.5-1.5% at 1% by weight,
Phosphorus (P) 0.1-0.4%, silicon (Si) 0.
A precipitation hardened copper alloy containing 0.005 to 0.1% and the remainder substantially consisting of copper (Cu).
JP8191775A 1975-07-04 1975-07-04 sex Expired JPS5815528B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8191775A JPS5815528B2 (en) 1975-07-04 1975-07-04 sex

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8191775A JPS5815528B2 (en) 1975-07-04 1975-07-04 sex

Publications (2)

Publication Number Publication Date
JPS526334A JPS526334A (en) 1977-01-18
JPS5815528B2 true JPS5815528B2 (en) 1983-03-26

Family

ID=13759794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8191775A Expired JPS5815528B2 (en) 1975-07-04 1975-07-04 sex

Country Status (1)

Country Link
JP (1) JPS5815528B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056178Y2 (en) * 1987-02-04 1993-02-17

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2751990B1 (en) * 1996-07-30 1998-10-02 Griset Ets COPPER-BASED ALLOY WITH HIGH ELECTRICAL CONDUCTIVITY AND SOFTENING TEMPERATURE FOR ELECTRONIC APPLICATIONS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH056178Y2 (en) * 1987-02-04 1993-02-17

Also Published As

Publication number Publication date
JPS526334A (en) 1977-01-18

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