JPS5815223A - Composite circuit part and method of producing same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite m-circuit component including a coil L, a capacitor tC, etc., and a method for manufacturing the same.

For example, when an LC filter consisting of a plurality of coils L4 and conductors tC1 to C$ as shown in FIG. 111 is constructed on one substrate, the conventional arrangement shown in FIG. This fL prints a rectangular dielectric substrate 110 surface mK plural 0JlI box electrodes 12t, and also prints a plurality of 0jliijK said plurality! Surface electrode 12
The back electrode 1 of jllll has a large area corresponding to
2A' and a small second back electrode 12B't print sheet, and the coils L1 to 18 are placed in the drum-shaped core in the four recesses fl$18 formed on one side IIK of the dielectric substrate 11.
After fitting and arranging the coil devices 13 to 16t formed by winding Lit, the coil terminals 19A and intermediate taps 19B pulled out from each coil device 13 to 16 are then rt-t"nm.
Electrically connect the contact portions of the coil terminals 19 and intermediate taps 19B with each of the surface electrodes 12 by soldering or the like while being wrapped around a plurality of protrusions filIA provided on the other side 0 i11 of the dielectric substrate 11. The lead wire 10A-1 is connected to one front electrode 120 and two back electrodes 12A' and 12B'.
0Ct-N, which are connected by soldering or the like, respectively, so that the front electrode 12 and the back electrode 12A', 1
The part opposite to 2B' is -t'n each condenser tc1~
It is configured as a c-mouth.

However, in the above device, the height dimension 1■ of the large-area l&plane electrode 12A' to ensure the capacitance of the capacitor and the height dimension kltm required to fixedly support the coil devices 13 to 16 are limited. Therefore, the dimension S in the height direction of the dielectric substrate 110 must be extremely large, which hinders miniaturization of composite circuit components.
! 8! There is a problem. Furthermore, as the height dimension increases, the lengths of the coil terminals 19A and intermediate taps 19B drawn out from the coil devices 13 to 16 also increase, causing problems such as wire breakage accidents occurring during assembly work. In addition, the number of companion protrusions 11A to which the coil terminals 19A and the like are tied increases as the number of elements increases, resulting in the inconvenience of frequent breakage accidents, or The recess 18 and the protrusion 11 that hold the
Various inconveniences have occurred, such as the necessity of providing a plurality of At-types, complicating the manufacturing process, increasing the number of man-hours, and causing KFi connection failures.

The present invention was made in view of the above circumstances, and provides a composite m-circuit component and a method for manufacturing the same, which can reduce the size and improve the packaging density, as well as simplify the manufacturing process and reduce the number of man-hours. The present invention will be specifically explained below with reference to Examples.

Figure JllE5 is a perspective view showing an embodiment of the composite circuit component of the present invention. In the same figure, reference numeral 1 denotes a rectangular dielectric substrate.
Al~2As is formed. Of this surface electrode,
The inverted-shaped electrodes 2A and 2A at both ends and the T-shaped electrodes 2A2 to 2A4 in the middle are coil lid connection electrodes and capacitor electrodes], and the remaining three electrodes [2A- to 2A, In particular, the second electrode 2A4 from the right end in the figure is located at the lower side of the dielectric substrate 1, and its side sK has an appropriate shape (the one shown is V A notch s7- (in the shape of a letter) is provided, and a conductor on the back surface, which will be described later, is electrically connected to the electrode through a conductive layer formed on the end face of this notch. Here, the lower side 1iIKtj of the dielectric substrate 1 and the other V-shaped notches 8S7α
7d and 7f are provided, but no conductive layer is formed on the end faces of these. Coil devices 3 to 6 each having a coil wound around the drum-shaped core of the plurality of coil device connection electrodes 2A to 2A are mounted. Each of the coil devices 3 to 6 has a concave portion formed in the end face of the collar portion at both ends, and conductive layers 3B to 6 provided in the concave portion.
B K A plate-shaped lead that is attached so that each coil terminal 3A to 6A is pulled out and the coil terminal is pressed from the outside! Each of the electrodes 2A1 via 113c to 6C
~ This plate-shaped lead with standing legs placed on hi! 30~6C
The coil terminals 5A to 6 and each electrode 2 to 2 are electrically connected through soldering or the like. In addition, three coil devices 5 to 5 among these coil devices are those in which coils are wound around the drum m:1A among the three, and the intermediate tag 3MD is derived from each of the three coil devices 5 to 5. It is connected to the intermediate tap connecting electrode 2 Ac=2 As by solder bias. The electrodes 2Al-2AIK at both ends of the dielectric substrate 1 are connected to external connection lead wires 10A and 10C.
However, external S connection lead wires 10B are formed on the back surface of the dielectric substrate 1 and connected to the common electrodes for capacitors, which will be described later, respectively. It continues, and in this way the above! ! An LC coupling filter as shown in Figure 1 is constructed.
ing. Note that the tips of the external lead wires 10A to 10C that contact the substrate are crushed into a plate shape.

Next, the specific structure and manufacturing method of each part of the device will be specifically explained with reference to FIGS. 4 to 14.

First, an example of the process for obtaining each of the above-mentioned coil devices 3 to 6 yen will be fully explained.
).

(The following shows the steps of the device bodies 6' and 3' when manufacturing the two-piece coil device 6 and the three-piece coil device t3t.

First, as shown in Figure 84 (a) and (b>K), both ends of the tsuba g.

Drum-shaped core 6 with circular recesses 6E and 6Et formed on the end face
After preparing a warehouse F and applying, for example, a thermosetting adhesive to the curved surface of the recess, cut out a steel foil 6B into an appropriate shape (circular shape).
After that, the core 6PK coil is wound a predetermined number of times, and a 6kt outer 8
After pulling out the SK and bending it at the end face of the flange, the copper foil 6B,
Place it in contact with 6B.

Regarding the three-piece coil device body 3', Fi Fig. 5 (
g) , (J) As shown in K, there are concave ll3g, 5K similar to the above-mentioned two-piece flange coil electric manufacturing, and steel foils 3B, 3 on their surfaces.
Bt-glued and pulled out coil terminal 3A on both end faces,
3A on the copper foil 38.3B, and further 4)f
Pull out the middle tap of the coil 3Dt downwards to 80
Next, prepare a clip-shaped lead wire member 8' having an open free part as shown in Figure 6 (g) and (A) K, and twist it in a parallel shape. The free end St is crushed to form a plate shape to form two plate-shaped leads s8 that face each other.Then, the base ends 8B and 8Bt of both are bent inwardly and both The tip portions 8A, 8A are further folded so as to face inward toward each other.
8 is the concave S of the coil devices 3 to 6 (6B in Fig. 5.6).
, 6g) is important.

Note that this clip-shaped lead wire member 8' is attached to Kl! for convenient transportation. A sandwich between the edge seam) 9A and the adhesive seam) 9B.
rt to be handled as KF.
i Conveyance conveyance lath 10 hole 9C is cut out.

This clip-shaped lead wire member 8' is made of a metal material having elasticity, and is itself equipped with a spring axillon, and the elasticity is enhanced by adhering the KfII sheets 9A and 9B. It has become.

After preparing such a lead wire member 8', as shown in FIG.
l), (b) Plate-shaped lead wire 811 as shown in K
When the coil device 6' in which the coil is wound around the drum-shaped core obtained in the above step is held between the coil device 6' and the coil device 6', the pair of curved tips 118A and 8A are attached to the concave fi16EK on both end faces of the coil device 6'. Then, make contact with the steel foil 6B. As a result, the clip-shaped lead wire member 8'
The spring action of the coil device 6' causes the pair of curved tips 8A and 8At that are in contact with both ends of the coil device 6' to be pressed inward, so that the coil device 6' is securely clamped. After that, the coil device 6'
As mentioned above, while holding the lead wire 8 between the tips 8A and 8 of the plate-shaped lead wire 8, turn it upside down and immerse only the held part in a solder bath for a predetermined period of time to apply solder (solder dip).
0 The solder used at this time is high solder so that the plate-shaped lead wire does not come off the end surface of the drum in the subsequent process.

As a result, the coil end 6 is inserted through the steel foil 6Bt in the recess 1l16B formed on the end face of the flange at both ends of the coil assembly Q10.
This ensures that A and the plate-like lead l118 are electrically connected reliably. Note that the soldering method is not limited to the solder dip method described above, but may also be a jet method in which solder is sprayed from both sides. At this stage, the proximal end connection st of the clip-shaped lead wire member is
After cutting, the wire characteristics are tested and measured, and if the product passes the test, the plate-shaped lead wire 8 portion is cut at or near the base s8B, and the flat portion is separated to obtain a two-piece coil device 6. The other coil devices 3 to 5 are manufactured by almost the same process, but the preliminary soldering of the tip of the intermediate tap is performed separately.Next, with reference to FIGS. 9 and 10, the dielectric body substrate 10
An embodiment in which electrodes are formed on the front and back sides will be described.0 As shown in FIG.
Three electrodes 2Ar=2A4 having a substantially T-shape are formed with a predetermined interval between the two electrodes, and three intermediate tap connection electrodes 2A@ to 2A are formed as a tube between each electrode. Here, s#i below the T-shaped electrode 2A4 second from the right side in the figure.
A V-shaped notch 1l17- is formed at the intersection of the cutouts 117a to 7d and 7f, which are formed to extend to reach the lower side of the substrate 1. However, a conductive layer t-, which communicates with the back surface, is provided on the end surface of the cut s7C. Also, on the back side of this dielectric substrate 1 are a large-area capacitor electrode 281 and a small-area capacitor electrode 2B! form. Among these, the lower end S of the capacitor electrode 2B having a small area is the V-shaped notch 7# on the lower side of the board.
The electrodes 2A4 are electrically connected to the surface electrode 2A4 through a conductive layer provided on the end face of the notch f@17g. It can be formed using a variety of methods, such as a method of partially plating with silver or a method of partially printing a conductive layer. In this way, the desired electrode is formed f'. A solder layer 21 as shown in FIG. 10 is formed on the surface of the dielectric substrate 1N10 in preparation for the next step. This solder layer 21 is formed by applying, for example, paste-like solder (solder cream) to the entire surface of each electrode on the surface of the TW electric board 10 (full surface printing method); in this case, the composition of the O solder cream is An example is 2-degree silver and 1
0%l! It is preferred to use a tube containing fO flux material and about 63 ml of tin.

Note that the lower end of the front electrode 2A4 and the lower end of the back electrode 2Bm, which are connected to the V-shaped notch s7# on the lower side of the substrate 1, are connected to each other before forming the solder layer 21. Since the solder layer 21 is not formed in the above-mentioned portion, this is to prevent the connection electrode from being eaten by the solder (and to improve reliability).

Next, outside! An embodiment of the I-continuation lead wires IQA to 10CO will be described with reference to FIGS. 11(a) and 11(h). External connection lead wires 10A to 10C1 - Appropriate spacing t
After fixing with adhesive between the conveying fan sheet 220 made of the insulating sheet 22A and the adhesive sheet 22B, the protruding tip part is crushed using a jig to form a plate-like tip 1111110g~1o.
c and lightly bend the base s' of the plate-like tip.

Then, preliminary solder is applied to the plate-like tips 11101 to 100. Incidentally, the intermediate portion 11 of the conveying sheet 22 has a longitudinal direction Kf8. A sprocket hole 22G is provided for convenient transportation during automatic assembly.

Thereafter, as shown in FIG. 12, solder cream is applied to the entire surface of the dielectric substrate 1tI/iI as described in KIII.
It is held by the recording external lead M fOA~10C.
When connected, external connection lead #10A on both ends.

10COfj-shaped tip l110g, 10c#i sont'
The plate-shaped tip of the central external connection lead wire 10B contacts the solder layer on the both-end terminals 1i2At-2Ai on the n surface! 1.1
0j is placed and held so as to be in contact with the solder layer on the capacitor electrode 2B on the back side.

, and then, as shown in FIG. 13, each of the coil devices 3
-6 are mounted on the solder layer for connecting the coil devices via plate-shaped lead wires 3C-6Ct attached to both end faces of each coil device and soldered. At this time, each coil device is lightly fixed by the solder cream, so that it will not fall off even if the entire mounting is tilted or a slight impact is applied.

Soldering is carried out as follows. That is, as described above, the dielectric substrate 1 [1] is held in a substantially horizontal state and held in a substantially horizontal state while being held by 10 to 100 lead wires for external connection and on which the coil devices 3 to 6 are mounted via the solder layer 21. For example, when using a hot plate heating method and gradually increasing the heating temperature, the heating conditions are preheating for the first 30 seconds,
It is desirable to carry out the main heating by holding the tube at a constant temperature for the last 5 to 5 seconds. At this time, the solder pre-soldered in advance on the outer sII lead wire 10B is melted and soldered to the electrode.

In addition, the external connection leads 1110 and 10C are melted at the same time as the pre-soldered solder is melted, and the solder cream is simultaneously melted and soldered to the electrodes. By the above heating, all parts of the dielectric substrate 1 are melted in the above process.
The solder cream applied to the cloth will be concentrated on the electrodes. That is, for example, as shown in FIG. 5114, the substrate 1
Placement WJK of plate-shaped lead wires 6C and 6C at both ends of the coil device 60 placed across the connection with the upper electrodes 2A4-2AI
In this case, a large amount of solder 21 concentrates on the mound 9, and furthermore, the solder accumulates in the gap between the plate-shaped lead wires 6C, 6C and the end face of the coil device due to capillary action, so that the electrical connection is ensured. It is done. Similarly, the connections between the plate-like lead wires and electrodes of other coil devices, the connections between the intermediate taps and the electrodes, and the connections between the external connection lead wires and the electrodes are ensured. When a composite circuit component as shown in FIG. 3 is assembled, the present invention is not limited to the above-mentioned embodiment, and various modifications can be made. For example, in the above embodiment, the connection between the coil device and the electrode and the connection between the external connection lead wire and the electrode are explained after printing solder cream on the entire surface. method (local printing method) may also be used. That is, as shown in Figure gjL15, for example, after arranging a screen with a partially opened window, paste solder (solder cream) is applied as a mask to form the coil device connection solder layer 21A.
~21D1 To the solder layer 21 for external lead wire connection, 21F
In this case, the method of applying the solder cream is also a method of locally squirting it through a screen (a method using a dispenser). , 21 is formed to include the opposing ends of the electrodes 2As and 2As and the upper end S of the electrode peak for connection to the intermediate tap, and 21B is formed to include the opposing ends of the electrodes 2 and 2 and the upper end of the electrode 2Ay for connecting the intermediate tap. 21C is formed to include the opposing ends of the electrodes 2 and 2A4 and the upper end of the intermediate tag connection electrode 2As. At this time, it goes without saying that it is necessary to align the screen with the window opened (maskon). Afterwards, as shown in Figure 16, solder cream was locally applied to the dielectric. The board 1 is connected to the external S connection lead wire 10A.
~10. After being clamped by C, the coil devices 3 to 6
is placed between each electrode, heated and soldered as described above. As a result, the connection of each part is made securely as in the case described above.Also, although the soldering described above was done using a cream soldering method, instead of soldering cream, a heat curing machine adhesive was applied to the end of the electrode for mounting the coil device. After applying the adhesive, the coil device is mounted on that part, and the coil device is clamped to the lead wire for external connection.Then, the adhesive is preheated to harden and the coil device is temporarily fixed.Then, the entire device is turned upside down. By immersing the solder in a solder bath for a predetermined period of time and then cooling it, the same effect as described above can be obtained.

In the above embodiments, a drum-shaped core was used as the coil device, but any other core shape may be used, such as a square core or a molded core. Needless to say, it can also be used.

According to the present invention described in detail above, since the coil device can be easily mounted and connected to the upper side of the surface of the dielectric substrate, the coil device mounting area can be, for example, a part of the contact surface in the circumferential direction of the drum-shaped core, and Since it takes a lot of time just to secure the width in the height direction, a significantly smaller area is sufficient compared to the case of providing a fitting recess St for inserting the entire section of the drum-shaped core as in the conventional device O. The size of the coil can be shortened, and the device can be made more compact.In addition, the coil terminal can be made extremely short since there is no need for a central spring S for connecting the coil terminal to the recess for placing and fitting the coil. It can prevent breakage and disconnection accidents, and it also ensures reliable connection between coil terminals and electrodes, making it possible to provide highly reliable products!
This makes the soldering work extremely easy, and automatic soldering is possible, making manufacturing easier and reducing man-hours.
0

[Brief explanation of the drawing]

Figure 1 is the circuit diagram of the LC composite filter, and Figure 2 is the circuit diagram of the LC composite filter.
FIG. 3 is a front view of a conventional device made into a composite component, and FIG. 3 is a perspective view showing an embodiment of the composite circuit component of the present invention. FIGS. 4 to 14 are diagrams for explaining an example of the specific configuration of the device according to the embodiment and its manufacturing method, and FIGS. Cross-sectional view and side view, Figures 5(a) and (A) are cross-sectional views and side views of other coil device main bodies, and Figure 6(α>, <b)
＞ is a front view and a side view of the plate-shaped lead wire, Fig. 7(a)
, (b) is a cross-sectional view and side view showing the state where the coil device main body is held between plate-shaped lead wires, Fig. 8 (α), (A)F
Figure 9 is a surface view with electrodes formed on the Fi dielectric substrate, Figure 10 is a surface view with a solder layer formed on the dielectric substrate, Figure 11 (g), (
A) is a front view and a side view showing an example of the lead wire for external sII wire, Fig. 12 is a front view showing the combination of the board and the lead wire for external connection, and Fig. 13 is a front view showing a coil device mounted on the board. Figure 1IIt-shows front view, wJ14 figure shows soldering style mt
The sectional view, FIGS. 15 and 16, are front views for explaining electrical connections using other soldering methods. 1...Dielectric substrate, 2 people 1-2A, 2B1 #2B
ri... Electrode, 3-6... Coil device, 5A-6k.
...Coil terminal, 3B-6B...Conductive layer, 30-6
C...Plate lead wire, 3D~5D...Intermediate tap,
3E to 6E... recess, 7.1 to 7f... notch,
8'... Lead & 1 member, 9, 22... 1.1 conveyor sheets -..., \ ・',
Outside game Q! m + J = do line, 2' 1,
(Hi,＼,!゛田...Handa layer. ,)I -・；Yo・1・、、－、;": Agent H4" - Do Higashi Hitoshi 5,・5. Sen 1!ゞ・21. Child ・Figure 4 2F6B Figure 5 (G) (b) Figure 6 Figure 7 Figure 13 Figure 14

Claims (2)

[Claims] (1) A dielectric substrate with a coil device connection electrode and a capacitor electrode formed on the front surface and a capacitor electrode formed on the back surface, and a dielectric substrate mounted and connected on the coil device connection electrode on the surface of the dielectric substrate. The coil device consists of a coil device and a lead wire for external S connection.A coil device is a coil in which a conductive layer is formed on both end surfaces of a core formed by winding a coil, and a coil is placed on the conductive layer. A composite W circuit characterized in that the terminals are arranged along the conductive layer so as to sandwich the terminals, and the end portions are mounted and connected to the substrate via plate-shaped lead wires that stand on the coil device connection electrodes. parts. (2) At least a step of winding a coil around a core with a conductive layer formed on both end faces and pulling out the coil end 1 m above the conductive layer to obtain a coil device body, and a clip-shaped structure having plate-shaped leads S facing each other. A step of sandwiching the coil device main body between the opposing plate-shaped lead parts of the lead wire member and electrically connecting the plate-shaped lead part and the coil terminal, and connecting the plate-shaped lead S connected to the coil mounting. Leave it to 0
A step of cutting the 9-wire member, and a plate-shaped lead of the coil device is placed on the coil device connecting electrode of the dielectric substrate on which electrodes for connecting the coil device and electrodes for connecting the coil device are formed on the front and back surfaces. 1. A method for manufacturing a composite layer circuit component, comprising the steps of: mounting the plate-shaped lead portion and a coil mounting connection electrode by electrical distance Km.