JPS58148941U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS58148941U
JPS58148941U JP4473682U JP4473682U JPS58148941U JP S58148941 U JPS58148941 U JP S58148941U JP 4473682 U JP4473682 U JP 4473682U JP 4473682 U JP4473682 U JP 4473682U JP S58148941 U JPS58148941 U JP S58148941U
Authority
JP
Japan
Prior art keywords
product type
determined
chip
semiconductor equipment
marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4473682U
Other languages
Japanese (ja)
Inventor
塚越 厚生
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP4473682U priority Critical patent/JPS58148941U/en
Publication of JPS58148941U publication Critical patent/JPS58148941U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による半導体装置の一実施例の主要部の
概略構成図、第2図は本考案の第2実施例の主要部の概
略構成図である。 1・・・・・・チップ、2・・・・・・マスク位置合せ
用パッド、3・・・・・・通常ハツト、4・・・・・・
マーキングバンド。
FIG. 1 is a schematic diagram of the main parts of an embodiment of a semiconductor device according to the present invention, and FIG. 2 is a schematic diagram of the main parts of a second embodiment of the invention. 1... Chip, 2... Mask positioning pad, 3... Normal hat, 4...
marking band.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ上に形成された複数のトランジスタの閾値を選択
的に変えることにより品種型路が定められる半導体装置
において、ウェーハ処理工程中に予め各チップにマーキ
ングパッドを形成しておき、品種型格決定後に前記マー
キングパッドに品種地格識別マークを付けられるように
構成したことを特徴とする半導体装置。
In semiconductor devices where the product type is determined by selectively changing the threshold values of multiple transistors formed on the chip, marking pads are formed on each chip in advance during the wafer processing process, and the product type is determined after the product type is determined. A semiconductor device characterized in that the marking pad is configured so that a product type identification mark can be attached thereto.
JP4473682U 1982-03-31 1982-03-31 semiconductor equipment Pending JPS58148941U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4473682U JPS58148941U (en) 1982-03-31 1982-03-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4473682U JPS58148941U (en) 1982-03-31 1982-03-31 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS58148941U true JPS58148941U (en) 1983-10-06

Family

ID=30055784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4473682U Pending JPS58148941U (en) 1982-03-31 1982-03-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS58148941U (en)

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