JPS5972731U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5972731U
JPS5972731U JP16910382U JP16910382U JPS5972731U JP S5972731 U JPS5972731 U JP S5972731U JP 16910382 U JP16910382 U JP 16910382U JP 16910382 U JP16910382 U JP 16910382U JP S5972731 U JPS5972731 U JP S5972731U
Authority
JP
Japan
Prior art keywords
lead
semiconductor equipment
island
semiconductor device
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16910382U
Other languages
Japanese (ja)
Inventor
岡留 哲朗
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP16910382U priority Critical patent/JPS5972731U/en
Publication of JPS5972731U publication Critical patent/JPS5972731U/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のリードフレームの部分平面図、第2図は
本考案の一実施例に係るす、ドフレームの部分平面図で
ある。 1・・・・・・アイランド、2.3・・・・・・リード
、2a。 3a・・・・・・リードステッチ部。
FIG. 1 is a partial plan view of a conventional lead frame, and FIG. 2 is a partial plan view of a lead frame according to an embodiment of the present invention. 1... Island, 2.3... Lead, 2a. 3a...Lead stitch part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ベレットを固着するアイランドと、このアイラン
ドの周囲にリードステッチ部が集るように配置されたリ
ードとを有するリードフレームを用いて組立てた半導体
装置において、前記リードステッチ部が千鳥に配置され
ていることを特徴とする半導体装置。
In a semiconductor device assembled using a lead frame having an island to which a semiconductor pellet is fixed and a lead arranged so that the lead stitch parts are gathered around the island, the lead stitch parts are arranged in a staggered manner. A semiconductor device characterized by:
JP16910382U 1982-11-08 1982-11-08 semiconductor equipment Pending JPS5972731U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16910382U JPS5972731U (en) 1982-11-08 1982-11-08 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16910382U JPS5972731U (en) 1982-11-08 1982-11-08 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5972731U true JPS5972731U (en) 1984-05-17

Family

ID=30369516

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16910382U Pending JPS5972731U (en) 1982-11-08 1982-11-08 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5972731U (en)

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