JPS58148406A - Method of connecting axial lead terminal - Google Patents
Method of connecting axial lead terminalInfo
- Publication number
- JPS58148406A JPS58148406A JP3269882A JP3269882A JPS58148406A JP S58148406 A JPS58148406 A JP S58148406A JP 3269882 A JP3269882 A JP 3269882A JP 3269882 A JP3269882 A JP 3269882A JP S58148406 A JPS58148406 A JP S58148406A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead terminal
- solder
- lead terminals
- axial lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、円板状また。ま角板状をした抵抗、コンデン
サ、バリスタ等の電子部品におけるアキシャル型リード
端子の接続方法に関するものであり、リード端子付けの
作業性を同上させ、しかも半田付けによる電子部品とリ
ード端子接続の信頼性の同上を目的とする。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a disc-shaped or This relates to a method for connecting axial lead terminals for square plate-shaped electronic components such as resistors, capacitors, and varistors, which improves the workability of attaching lead terminals, and also improves the reliability of connecting electronic components and lead terminals by soldering. Aiming at sexual ditto.
以下、本発明を実施例を示す図面と共に説明する。まず
、第１図に示すように円板状または角板状をした抵抗、
コンデンサ、バリスタ等の電子部品素体１の電極部２，
２′にクリーム半田３，３′を塗布するか、または第２
図に示すようにリード端子４，４′の接続部分にクリー
ム半田３，３′を塗布しておく。次に、上記リード端子
４，４′で上記電子部品素体１をはさみ込み、その状態
でそれらを加熱してリード端子４，４′を電子部品素体
１に半田付けする。このようにして電子部品素体１ヘア
キシヤル型にリード端子付けを行った完成品を第３図に
示している。Hereinafter, the present invention will be explained with reference to drawings showing embodiments. First, as shown in Figure 1, a disc-shaped or square plate-shaped resistor,
Electrode part 2 of electronic component element 1 such as a capacitor or varistor,
Apply cream solder 3, 3' to 2' or
As shown in the figure, cream solder 3, 3' is applied to the connecting portions of lead terminals 4, 4'. Next, the electronic component body 1 is sandwiched between the lead terminals 4, 4', and in this state they are heated to solder the lead terminals 4, 4' to the electronic component body 1. FIG. 3 shows a completed product in which lead terminals are attached to the electronic component body 1 in the hair axial shape.
ここに用いるクリーム半田は、低温半田、共晶点半日ま
たは高温半田のいずれでもよく、予めフラックスを含有
するものが望ましい。また、半田付けの方法としては、
両方向からリード端子で電子部品素体を押え加熱バス中
に入れるかまたはホットジェットによる加熱空気を吹き
つけて半田を溶融させ、リード端子を電子部品素体と接
続させる方法がある。The cream solder used here may be a low-temperature solder, a eutectic point half-day solder, or a high-temperature solder, and preferably contains flux in advance. Also, as a method of soldering,
There is a method of connecting the lead terminals to the electronic component body by holding the electronic component body from both directions and placing it in a heating bath, or by blowing heated air using a hot jet to melt the solder.
以上のような本発明による効果は、フラックス入りのク
リーム半田を使用するため、半田のぬれ性が非常によく
、またリード端子を押える加重のコントロールによって
溶融半田層の厚みのコントロールが可能であり、こうし
たことから半田付は強度の向上が得られる利点を有する
ものである。The effects of the present invention as described above are that since flux-containing cream solder is used, solder wettability is very good, and the thickness of the molten solder layer can be controlled by controlling the weight that presses the lead terminal. For these reasons, soldering has the advantage of improving strength.
第１図および第２図はそれぞれ本発明方法の実施例を示
す製造途中の断面図、第３図は同方法により得られたア
キシャル型電子部品の断面図である。
１・・・・・・電子部品（電子部品索体）、２．２′・
・・・・・電極部、３，３′・・・・・・クリーム半田
、４，４′・・・・・・リード端子。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
３３′
３３′1 and 2 are sectional views showing an example of the method of the present invention during manufacture, respectively, and FIG. 3 is a sectional view of an axial type electronic component obtained by the same method. 1...Electronic component (electronic component cable), 2.2'.
...Electrode part, 3,3'...Cream solder, 4,4'...Lead terminal. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 33'33'
Claims (1)
ム半田を塗布しておき、上記電子部品を上記リード端子
ではさみ込み、これらを加熱して上記電子部品に上記リ
ード端子を半田付けすることを特徴とするアキシャル型
リード端子の接続方法。[Claims] A connection part of a lead terminal, a resistor, or a capacitor. Apply cream solder to either one of the electrodes of an electronic component such as a varistor, sandwich the electronic component between the lead terminals, heat them, and solder the lead terminal to the electronic component. Features a connection method for axial type lead terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3269882A JPS58148406A (en) | 1982-03-01 | 1982-03-01 | Method of connecting axial lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3269882A JPS58148406A (en) | 1982-03-01 | 1982-03-01 | Method of connecting axial lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58148406A true JPS58148406A (en) | 1983-09-03 |
Family
ID=12366066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3269882A Pending JPS58148406A (en) | 1982-03-01 | 1982-03-01 | Method of connecting axial lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58148406A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956168A (en) * | 1972-09-30 | 1974-05-31 | ||
| JPS5622362A (en) * | 1979-07-31 | 1981-03-02 | Asahi Chem Ind Co Ltd | Improving initial drying property of polyurethane resin coating material |
-
1982
- 1982-03-01 JP JP3269882A patent/JPS58148406A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4956168A (en) * | 1972-09-30 | 1974-05-31 | ||
| JPS5622362A (en) * | 1979-07-31 | 1981-03-02 | Asahi Chem Ind Co Ltd | Improving initial drying property of polyurethane resin coating material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0543462Y2 (en) | ||
| JPS58148406A (en) | Method of connecting axial lead terminal | |
| JPH05319946A (en) | Ceramic substrate joined to metallic plate | |
| JPS62260350A (en) | Hybrid integrated circuit device | |
| JPS59993A (en) | Method of bonding metal plate electrode | |
| JPS608602B2 (en) | Manufacturing method of resistor element | |
| JPH02192792A (en) | Method of soldering electronic component with low thermal resistance | |
| JPS61180402A (en) | Manufacture of voltage non-linear resistor | |
| JP2839308B2 (en) | Multilayer wiring board | |
| JP3352823B2 (en) | Joining method between silicon carbide ceramics and silicon | |
| JPS58190013A (en) | Chip part and method of soldering chip part | |
| JPS6316846B2 (en) | ||
| JPS60261122A (en) | Method of producing electronic part | |
| JPS5969906A (en) | Method of forming terminal electrode of laminated ceramic condenser | |
| JPS58148405A (en) | Method of connecting lead terminal | |
| JPS60177611A (en) | Method of producing electronic part | |
| JPS61240620A (en) | Manufacture of electronic component | |
| JPH02244607A (en) | Manufacture of electronic part | |
| JPH01157469A (en) | Bonding of oxide superconducting material | |
| JPH08293406A (en) | Manufacture of electronic part | |
| JPS6146233B2 (en) | ||
| JPS62145803A (en) | Manufacture of thin film thermistor | |
| JPH0744199B2 (en) | Semiconductor device mounting body and mounting method thereof | |
| JPS5992511A (en) | Method of producing glass-sealed laminated porcelain condenser | |
| JPS5972747A (en) | Semiconductor package and sealing method thereof |