JPS58147189A - Circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] (U Technical Field of the Invention The present invention provides a first infrared Sefson device that operates at low temperatures!!
The present invention relates to a circuit board for mounting.

(2) 6 Background of the Invention Conventionally, circuit boards used in electronic computer units are usually used at room temperature or a temperature relatively close to this temperature. In order to match the increased operating speed of elements mounted on the circuit board INK, O-IS with a low dielectric constant is adopted for the circuit board.

And, as an element mounted on such a single board,
If the circuit board is placed in an extremely low-temperature concentration circle using a dithering element, etc., and the above-mentioned element is operated successfully, the circuit board will be free from heat shrinkage, which does not need to be heated to 11EK for almost no time at room temperature. It is emerging as an indispensable technical IIQ.

(3) Prior art and fusion: The materials commonly used for conventional circuit boards are epoxy resin, ceramic (alumina), and glass. When a circuit board using these materials is heated to the extremely low temperature used to operate a Josephson device, the heat shrinkage reaches 1 to 2'L at that temperature, causing cracks in the board,
Peeling occurs between the circuit board and the circuit pattern, which significantly impedes the function of the electrical path formed on the circuit board or gives a catastrophic blow to the function. Furthermore, the circuit board itself has no grounding means, and the dielectric constants of the above-mentioned materials are as high as, for example, epoxy resin, which has a dielectric constant of 4 to 5, and alumina, which has a dielectric constant of 6 to 7. This gives a delay to signal propagation, making it impossible to match well with the high-speed performance of the nine elements described above.

(4) 9 Purpose of the Invention The present invention was devised in view of the above-mentioned drawbacks of conventional circuit boards, and its purpose is to avoid problems caused by thermal shrinkage even if the Kt is extremely low. It is an object of the present invention to provide a circuit board which has improved signal propagation properties and also has a grounding means.

(5) 0 Structure of the invention And this purpose is to form a 4-fluoroethylene layer with a thickness of 0.5 W or less on an aluminum plate whose 11 sides have been made porous, and to form a layer of wrinkled 4-fluoroethylene. This is accomplished by forming a circuit pattern on the layer.

(6) Example of 0 invention Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The attached drawings illustrate the present invention! An example of koji is shown. In the figure, 1
is an aluminum plate, and a resin layer (insulating layer), for example, a 4-fluoroethylene layer 3 is applied to the porous surface 2 so that the thickness is 0.5 m or less to form the circuit board 4- of the present invention. ing. The heat shrinkability of the metal plate 1 is similar to that of the resin layer 3. For example, 30 of 4-fluoroethylene
The thermal contraction from 0K to 4Kt is 2 tatami, and the thermal contraction of aluminum is larger than that of other metals.
．． There are 5 sounds.

The surface 2 of the aluminum plate 1 is made porous by anodic oxidation, and the above-mentioned 4-fluoroethylene layer 3 having heat shrinkability is applied to the porous surface 2 to form a relatively thin layer. Therefore, the thermal contraction of the aluminum plate 1 and the thermal contraction of the 4-fluoroethylene layer 3 match. Therefore, a circuit pattern 5 is formed on the 4-fluoroethylene layer 3 (6 is a protective Sg layer (4
- ethylene fluoride), which is 4.2KsI!
Even when operated at an extremely low temperature of I:, the board cracks, the board and the circuit pattern separate, and the circuit pattern becomes detached, which has a serious adverse effect on circuit function. In addition, the fact that the 4-7 chemically modified ethylene layer 3 is bonded to the porous surface of the aluminum plate 1 and the above-mentioned heat yield property combine to cause thermal contraction of the 4-7 fluoroethylene layer 3. The absorbency of the material has been further improved, and the above-mentioned disadvantages have been further alleviated. This is also 4
It is possible to prevent the occurrence of warpage that would occur if the circuit board was manufactured using only the monofluoroethylene layer 3 itself.

In addition, since the dipole moment of 4-fluoroethylene is small, and therefore the dielectric constant is small, it is possible to increase the propagation speed of the signal propagating through the circuit pattern 5 formed thereon. , damping can also be alleviated.

The aluminum plate of the circuit board 1 [4] can be used as a grounding means.

(7) Effects of the Invention As is clear from the above explanation, the invention provides the following effects.

(1) It is possible to avoid distortion of the circuit board, which conventionally occurs due to thermal contraction.

(2) Grounding means for tracing the circuit pattern can be provided on the circuit board itself.

(3) Signal propagation can be improved.

[Brief explanation of the drawing]

The accompanying drawings illustrate embodiments of the invention. In the figure, l is a metal plate, 2 is a porous surface, 3 is a 4-7 polyethylene layer, 5 is a circuit pattern, and 6 is a protective film. Patent applicant Fujitsu Co., Ltd.

Claims (1)

[Claims] 0.5 cm of rhinoceros on an aluminum plate whose surface has been made porous
A circuit board characterized in that a 4-7 fluorinated ethylene layer having a thickness of 4-7 m or less is formed, and a circuit pattern is formed on the 4-7 fluorinated ethylene layer.