JPS58145143A - Probing device and use thereof - Google Patents

Abstract

PURPOSE:To offer the probing device using no optical system and having high positioning precision and the using method thereof by a method wherein positioning of a probe is performed utilizing electromagnetic induction to be generated between transmission lines and a detecting coil. CONSTITUTION:When integrated circuit 3 dipped in a coolant of liquid helium, etc., are to be tested, alternating signals fx0, fx1, fx2... of different frequencies are made to flow in the respective transmission lines X0, X1, X2... through a driver 19 on an wafer 5, and alternating signals fy0, fy1, fy2... of different frequencies are made to flow in the respective transmission lines Y0, Y1, Y2... through a drver 17. Screw shafts 10, 13 are rotated by driving motors 9, 12 in the positive and negative directions in this condition. Thereupon a slider 11 transfers together with the shaft 13 in the direction shown with an arrow mark A, B according to the rotation of the shaft 10, and a slider 15 transfers in the direction shown with an arrow mark C, D together with the positioning probe 15a accoring to the rotation of the shaft 13. Accordingly the detecting coil 15b at the tip of the probe 15a also transfers in the directions shown with the arrow marks A, B and C, D on the wafer 5 in the condition dipped in the coolant.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention is suitable for use in blowing integrated circuits such as LSIs, which are composed of Josephson junction elements operated under extremely low temperatures such as liquid helium. The present invention relates to a preferred probe device and method of using the same.

(2) When analyzing the operation of an integrated circuit consisting of a Josephson junction element, the Toko circuit to be tested is crushed in helium, and >I! It is necessary to cool it to the cryogenic temperature that is the normal operating condition.

However, in order to blowbink the Toka circuit, the integrated 1
It is necessary to position the input/output pad position of the envelope path and the probe at positive (i([.

(3) Conventional technology and problems FIG. 3 is a diagram showing a recently proposed example of a probe device.

As the probe device t, 1, the one shown in FIG. An integrated circuit 3 is detected by an optical position detector 6 made of optical fiber.
Check the position of the 0 input/output pad 3a and position the probe 7. However, in this method, the detector 6
Heat is transferred to the medium 2 through the zero fiber, and the medium 2 boils at the opening 6a of the optical thread, creating bubbles, making it impossible to clearly see the images of the 70-bu 7 and the bad 3a. However, there was an inconvenience in that the positioning hole 1 green was lowered.

(4) Purpose of the Invention The present invention aims to completely eliminate the drawbacks mentioned in h11 by using optical threads.
-+-4 No positioning No further suction valve device white □
The purpose of this paper is to provide instructions on how to use and use the software.

(5) Structure of the invention, that is, the probe device according to the present invention has the following functions:
The MN self-driving hand pin V supports the detection coil 4 and the probe movably on the wafer, and the driver I-4 is attached to the detection coil according to the position signal from the detection coil 1.
9 full drive control Qi+ 111III and 1141 parts are connected to each other, and one method of using it is to provide the above-mentioned probe device with a wafer formed in the form of crossed transmission lines, Detecting the frequency component corresponding to the alternating signal using the detection coil using six electromagnetic conductors using the trR field generated by the alternating signal; The probe is configured to move and position the probe to the F9T foot position on the wafer based on the previous self-position signal.

(6) Embodiments of the Invention The present invention will be concretely celebrated based on the embodiments shown in FIG.

The first figure is an 8+ diagram showing an example of the probe device according to the present invention, and the second figure is a half-view showing the positional relationship between the transmission line and the detection coil.

The probe device 1 has a motor 9 V as shown in FIG.
(Therefore, the rotation of the screwsha 7) is 1n, and the shaft 10 has a large id slot 11
They are screwed together so that they can move freely 60,000 times. Slider 11
In the shaft 101'Ci, a screw shaft 13 which is driven in N rotation by a motor 12 is supported in a rotational direction in a manner that crosses the shaft 101'Ci, and a slider 15 is attached to the shaft 13.
is movably screwed into the arrow C1D, which is perpendicular to the arrows A and 13Fj. A positioning loaf 15a is formed on the slider 15, and a detection coil 15b is installed at the tip of the probe 15a, that is, at the end in the figure.

In addition, a large number of probes 16a formed in the shape of a VcltJ sword are provided on the entire support 16 at positions that move in the vertical direction in the figure, i.e., arrow 1 bow, 1. , a filter 21 is connected to the detection coil 15b via an amplifier 20i, and a motor 9.1 is connected to the filter 21.
City 149111 Department 22 connected to 2 is connected.

- A large number of integrated circuits 3 such as 181 to be tested by the probe device [1] are formed in an array on the wafer 5, and on the wafer 5, a transmission line YO is arranged in the direction of the arrow AXB.
XYl % "2. River... is formed in such a way that it divides three adjacent circuits in parallel.

Each line YOX"1, Y2, . . . is connected to the driver 17, and a transmission line MX is connected in the direction of the arrow CXD.

, Xl, X2... are parallel and the line YO% Y1
% "2..." is the old circuit 3, which is in contact with history.
It is formed in the form of a section, each line X. , Xl, X2...
...Connected to Kedora 1 Bar 19.

Since the probe device w1 has m&' as described above,
When testing an integrated circuit 3 immersed in a cooling medium such as liquid helium, each transmission line X is connected via a driver 19 on the wafer 5. 、
2... Intersection with different number of cycles yoXy+, duck 2
...to flow. In this state - C1 A symbol ff The motor 9.12 is driven to rotate in the forward and reverse directions to rotate the screw shaft 10.13 times. Then, slider 11
moves along with the shaft 13 in the direction of arrow 11A1B as the shaft 13 rotates 100 times, and the slider 15 moves in the direction of arrows JC', 1-)71 together with the positioning probe 15a as the shaft 13 rotates. . By this,
The probe 15a is arranged in two directions perpendicular to each other, indicated by the arrow IA.
SB and e, +) direction, therefore 10-bu 15a
The detection coil 15b at the tip thereof is also immersed in the cold medium and moves over the wafer 5 in the directions of arrows NXB, e, and l). The coil 15b is a transmission line X, as shown in FIG. XX1, X2,..."0XY1, Y2...
.
When you move in the directions of arrows A, 13, and C11), you will notice that the communication lines flowing along each track are ff X0) XI X8□, , . 1, 1, f, 2, . . . The magnetic field f... ff crosses the field, and the position signal SS flows through the coil 15bK electric & i induction. Valley line alternating signal fXO”
XI, fx21. , , , − f,. ,f,,fy2,
...°°.

Since the frequencies of the coil 1 are different, the natural position signal 88 has a different frequency.
51) appears in the form of superimposed frequency components of cross-grain signals flowing on opposing or adjacent lines. Therefore, the signal SS is amplified by the amplifier 20, and the superimposed frequency components are separated by the filter 21 and output to the control section 22. The coil 15b is, for example, a line X. When reaching the top of XYo, the electromagnetic induction of the signal ff becomes the strongest
y.

Therefore, the control unit 22 controls the positioning probe 15.
When positioning a at the intersection of glands %Xo1Yo,
Signal in position signal 88 +'3'' XO%f, .Round rB/
, the VC and motor 9.12'e are driven so that the number components are maximized. Thus, orthogonal transmission imhil. XX1,
. . . Yo, Yl . . . When the unlocated probe 15a is positioned at an arbitrary intersection point,
Set the support 16 at position 1 in the F direction and press the probe 15 a V
When lowered, the valley blob 16a can accurately and reliably come into contact with the input/output pad 3a of the predetermined integrated circuit 30 formed on the wafer 5. When the test for road 3 is completed, raise the support in the direction of 16klJ, and drive the AI° motor 9.12.
61/, the alternating signal fXO% fXI,
・・・・・・f. , f, 1, . . . , the positioning operation for the integrated circuit 3 to be tested next begins in the same manner as described above.

Note that in the above embodiment, the transmission lines XO, Xl, X21 .
・・・Yo, Yl, Y2, ・・・・・・ Interchange m signal 'XO' with different frequencies XI, fX21., ,,,, f
, o, f, ,, f..., etc. have been described, but it is not necessary to send the AC y2 dissemination signal to all the lines, but only to the special line X to be positioned. , Y2. The throat alternating signal ff
Of course, it is also possible to position the probe 16a at the HT foot position by detecting the signals fxn'' and ``yn'' by the coil 1511.

Further, the detection coil 15b is also connected to the orthogonal lines XII and Yo.
Is there a dedicated coil that corresponds to this? 1[Ke, 211^1 coil 15t+ valley signal f , f intervening peak °tIX
rl yn another 1 fixed V (also to detect river fit: c''
, 1! -ru.

(7) As described in detail of the invention, the transmission to the wafer 5 is as follows: XX1,...Yll, Yl
・・・・・・As well as forming a purple color, the detection coil 5b has a movement position e (crotch 0, Joseph non-contact element cut,
'7't for the test of integrated circuit 3 made by
The position of J-no 16a is determined by the transmission line Xo, <
, ・°°゛Yo, Yl,... and detection coil 1
Let's do it using the 5b song and the 9th electric 1st magnetic visit (/
This [2-C1υτ゛It is l'I11]1 to eliminate the decrease in positioning accuracy due to the boiling of the medium 2 that occurs when using a wooden thread, and the reliability is improved. The 11 j + 4 method of loading and f- is used 1] and force.

[Brief explanation of the drawing]

FIG. 1 shows an example of the "Norono loading box" according to the present invention.
[Congratulations, Figure 2 shows 1 bar feed, engraving and detection coil position f
Half-view of M l'A Howapo, Fig. 3 (Gobrobe device 1
The most important thing in the world? It is a picture of ll Shifusu. 1...Probe drawing 3...Multiplication circuit 3a...Input/output pad 5...Wafer 9.12...Driver 19 (7 -ta)151)・
...Detection coil 16a...Probe 22...City 11 Deposit 11 units 1≦S8...
...Position 4g Xo, Xl, X2, -, ...Yo, Y,, Y2,
...Transmission footway "xo" x engineering, fx□, ...duck. , duck 1, f
,,...Counsel No. Applicant Shinajutoku Co., Ltd. (11) ) 2 182-72 Ward D Jiku 3M

Claims (2)

[Claims] (1) Moving over the wafer on which integrated circuits are formed
' In a probe device that performs all tests by bringing an o-b into contact with an input/output pad of the integrated circuit, a driving means is provided,
The detection coil and the probe are movably supported on the wafer by the driving means, and the detection coil is provided with:
A probe device configured by connecting a control section for driving and controlling the driving means according to a position signal from a detection coil. (2) In a probe device that performs a test by moving the probe over a wafer on which an integrated circuit is formed and bringing the probe into contact with the input/output pad of the integrated circuit, a driving means is provided, and the driving means drives the detection coil and the probe. The wafer is supported in a movable manner on the wafer, and the drive means is connected to the drive side 9 to the detection coil in response to a position signal from the detection coil.
A wafer with a transmission route or a cross-shaped wafer is provided to the probe device to which the j part of the ItI11 side is connected.
An alternating signal is applied to the line at tAt, t-, and a frequency component corresponding to the alternating signal is detected by the detection coil by using the magnetic field generated by the father signal. 1. A method of using a 10-probe device configured to detect the presence of a wafer and to move and position the probe to a predetermined position on a wafer based on the position signal.