JPS58140383A - Gold ceramic - Google Patents
Gold ceramicInfo
- Publication number
- JPS58140383A JPS58140383A JP2198582A JP2198582A JPS58140383A JP S58140383 A JPS58140383 A JP S58140383A JP 2198582 A JP2198582 A JP 2198582A JP 2198582 A JP2198582 A JP 2198582A JP S58140383 A JPS58140383 A JP S58140383A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- ceramic
- fine powder
- powder
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Inorganic Insulating Materials (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はセラミック微粉粒に係わるものである。セラミ
ックの微粉体の表面に金、金合金被覆した微粉体は、そ
の表面には金、金合金の特性として通電、耐蝕を兼ねた
粒体を製作できるものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to ceramic fine powder particles. Fine ceramic powder coated with gold or gold alloy on its surface can be made into particles that are electrically conductive and corrosion resistant due to the characteristics of gold and gold alloy.
金等は通電性と耐蝕性のすぐれ、美麗なる表面を有する
ものであるが、全自体の価格が非常に高価であるがため
、金粉を被覆することは底置価格はできない。Gold and the like have excellent electrical conductivity and corrosion resistance, and a beautiful surface, but the price of the whole material itself is very high, so coating it with gold powder cannot be done at a bottom-line price.
したがって金箔、金粉を厚く肉盛りすることは可成りの
高額に至るものである。Therefore, applying a thick layer of gold leaf or gold powder is quite expensive.
鼓に本発明の金、金合金被覆セラミックを提供する理由
である。本発明のものは、従来のものと異り、金、金合
金等を厚みを増して被覆して金、金合金線を製作した場
合は芯にセラミックがあるので強い線ができ価格も底置
(=なり得るものである。This is the reason why the gold or gold alloy coated ceramic of the present invention is provided for the drum. Unlike conventional wires, the wire of the present invention is made by increasing the thickness of gold, gold alloy, etc. and coating it with a ceramic core, which makes the wire strong and the price low. (= something that can happen.
本発明の詳細な説明する。第1図は本発明に係わる一実
施例の形状図である。1はセラミックの微粒体であって
、2はそこに付着せる金。The present invention will be described in detail. FIG. 1 is a shape diagram of an embodiment according to the present invention. 1 is ceramic fine particles, and 2 is gold to be attached to them.
金合金の微粉体である。この付着の方法としては表面溶
着、例えば金、金合金の湯の中にセラミックの微粉粒を
混入するなど、または蒸着。It is a fine powder of gold alloy. Methods for this attachment include surface welding, such as mixing fine ceramic particles into gold or gold alloy hot water, or vapor deposition.
電着、接着材1′−よるものなどの方法によってもでき
る。七′ラミックの微粉粒は非常に硬く、その上に通電
性があり、耐蝕性のすぐれた金、金合金の被覆がさ2t
ているので、装飾用品、工業用圧粉材料、通電用、通信
用材料などに使用できるものである。It can also be done by methods such as electrodeposition or using an adhesive 1'. The fine powder of 7'ramic is very hard, and on top of it is a coating of gold or gold alloy, which is electrically conductive and has excellent corrosion resistance.
Therefore, it can be used for decorative items, industrial powder materials, electrical conductors, communication materials, etc.
第1図は本発明に係わる一実施例の形状図である。
1・・・セラミック微粉粒体。2・・・金、金合金の微
粉体。
(勤1名)
士lI!l
494−FIG. 1 is a shape diagram of an embodiment according to the present invention. 1... Ceramic fine powder. 2... Fine powder of gold and gold alloy. (1 person) Officer! l 494-
Claims (1)
熱してセラミックの微粉体の表面に金で被覆してなるセ
ラミック微粉体。Ceramic fine powder is made by mixing ceramic fine particles with gold or gold alloy fine powder, heating the mixture, and coating the surface of the ceramic fine powder with gold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2198582A JPS58140383A (en) | 1982-02-16 | 1982-02-16 | Gold ceramic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2198582A JPS58140383A (en) | 1982-02-16 | 1982-02-16 | Gold ceramic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58140383A true JPS58140383A (en) | 1983-08-20 |
Family
ID=12070313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2198582A Pending JPS58140383A (en) | 1982-02-16 | 1982-02-16 | Gold ceramic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58140383A (en) |
-
1982
- 1982-02-16 JP JP2198582A patent/JPS58140383A/en active Pending
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