JPS58137289A - Hybrid integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to an Fi hybrid integrated circuit. [Technical Background of the Invention] In order to make electronic devices more complex and multifunctional, OL! In response to the need for resource conservation, hybrid integrated circuits are rapidly becoming smaller and more densely packed. Tsukuchipuki laria type package is an improved method of IC chip packaging.

It is already known that when mounting a ceramic chip carrier on a substrate, electrical conduction between the chip carrier electrode and the conductive layer on the substrate is achieved using anisotropically conductive rubber or Fi pressure-sensitive conductive rubber. The circuit component arrangement tube in the mounting process using this method is shown in Figure 1A, and the cross-sectional view of the finished circuit obtained after the process is shown in Figure 1A. First, place an anisotropic conductive rubber or pressure-sensitive conductive rubber (AAT) at the planned position where the ceramic chip carrier is to be mounted. Place the pressurizing cover (5) from above,
Anisotropic conductive rubber or pressure-sensitive conductive rubber is pressurized and the whole is integrated into a ceramic chip carrier to form a four-circuit circuit. [Problems in background technology] This technique is applicable to various types of IC chips. It is easy to assemble, has relatively low contact resistance, and is highly reliable.
possible, but requires a cover for pressurization,
It is expensive and heavy, the mounting thickness is too thick, and a part to fix the cover 1 is required! l! Packing density can only be increased to 172°C for a dual-in-twin package with the same number of bins.In addition, heat dissipation from the KIC chip is achieved through pressure-sensitive conductive rubber sandwiched between the chip and the board. The thermal conductivity of these rubbers is 1.3 to 1.6 x 10 W/m, which is small, so the heat dissipation of the circuit is poor with this manual method.

[Purpose of the invention]

An object of the present invention is to provide an improved hybrid integrated circuit in which the connecting tube between a chip carrier electrode and a circuit board conductor is inexpensive, lightweight, has a thin mounting thickness, has a high mounting density, and has good heat dissipation. KotoK is 0 [from @011! That is, this invention sandwiches a rubber material such as anisotropically conductive rubber or pressure-sensitive conductive rubber between the conductor on the circuit board and the chip carrier electrode, and forms a box facing the circuit board and the chip carrier. A cross-sectional view of the finished circuit obtained after the process is shown in Figure 2. This circuit is a chip carrier. Between the electrode (11) of (6) and the conductor (3) on the substrate (4) to which this electrode tube is to be connected, a frame-shaped anisotropically conductive rubber tube is sandwiched. The central part of the back surface of the ceramic chip carrier (6) and the substrate are bonded together using an adhesive (7). ◎During this bonding, the conductive direction of the anisotropically conductive rubber or pressure-sensitive conductive rubber is Pressure is applied so that the thickness is reduced by about 10 - and then the adhesive is completely cured. By doing this, the chip carrier itself becomes a pressurizing device, and the pressurizing cover provided in the example in Figure 1 becomes unnecessary. [Effects of the Invention] In the circuit of this invention, the chip carrier mounting is as follows.
It can be made inexpensive, light and thin, and the mounting density can be increased by more than 30 inches compared to conventional technology.
Heat dissipation from the C chip to the substrate is carried out through the adhesive that adheres the central part of the back surface of the chip carrier and the substrate, and the thermal conductivity of the adhesive is approximately tsxto W/cla-K, and is made of anisotropic conductive rubber or Since it is about 10 times that of pressure-sensitive conductive rubber, it also improves heat dissipation by more than 5 times as much as the 111 circuit.

[Brief explanation of the drawing]

Figure 111A and Figure 2A and Figure 2A and Figure 2A and Figure 2A and 2B are circuit component layout diagrams and cross-sectional views of finished circuits of actual ironworks relating to conventional and present hybrid integrated circuits.11)...Chip carrier electrode , a2. (2'3...
・Anisotropic conductive rubber or pressure-sensitive conductive rubber, (3)...
・Conductor on circuit board, (4)...Circuit board, (5)・
... Pressure cup <-1 (6) ... Chip carrier, (
7)...Adhesive. Agent Patent Attorney Inoue - Male 1st person 2nd cause

Claims (1)

[Claims] A rubber material, either anisotropically conductive rubber or pressure-sensitive conductive rubber, is sandwiched between the conductor on the circuit board and the chip carrier electrode, and is adhered to a part of the facing surface of the circuit board and chip carrier. A hybrid integrated circuit that is integrally formed in a layer t.