JPS5813274B2 - Ginro - Google Patents
GinroInfo
- Publication number
- JPS5813274B2 JPS5813274B2 JP49081873A JP8187374A JPS5813274B2 JP S5813274 B2 JPS5813274 B2 JP S5813274B2 JP 49081873 A JP49081873 A JP 49081873A JP 8187374 A JP8187374 A JP 8187374A JP S5813274 B2 JPS5813274 B2 JP S5813274B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- silver solder
- present
- spreadability
- bag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 本発明は銀ろうの改良に％るものである。[Detailed description of the invention] The present invention is an improvement in silver solder.
従来の銀ろうはＡｇ−Ｃｕ−Ｚｎ基にＣｄを合金してな
るもので、これの特性は液相線温度が低く、広がり性が
良好な点にある。Conventional silver solder is made by alloying Cd with an Ag-Cu-Zn base, and its characteristics include a low liquidus temperature and good spreadability.
しかしながら近年Ｃｄ公害が大きな社会問題として取り
上げられるようになったためＣｄ並びにＣｄに準じる環
境汚染源となる元素を含まない銀ろうが要望されている
。However, in recent years, as Cd pollution has become a major social problem, there is a demand for silver solder that does not contain Cd or elements that are sources of environmental pollution similar to Cd.
一方銀ろうとしては次の三条件を満足するものでなけれ
ばならない。On the other hand, silver metal must satisfy the following three conditions.
（１）液相線温度が７００℃を越えないこと。(1) Liquidus temperature should not exceed 700°C.
つまり溶融温度が低いこと。In other words, the melting temperature is low.
（２）広がり性がよいこと。(2) Good spreadability.
つまり流動性に富みぬれ性が良いこと。In other words, it has good fluidity and good wettability.
（３）安価であること。(3) It should be inexpensive.
換言すればＡｇが高価であるためＡｇの含有量が５０重
量％を越えないこと。In other words, since Ag is expensive, the Ag content should not exceed 50% by weight.
ところでＣｄを含まない銀ろうとしては従来ＪＩＳ規格
のＢＡｇ−７が最も良いものとして推奨されているが、
これは前記（１）項の条項を満足するもののＡｇの含有
量が比較的多く、しかも広がり性については満足できる
程のものではなかった。By the way, BAg-7 according to the JIS standard is conventionally recommended as the best silver solder that does not contain Cd.
Although this satisfied the conditions of item (1) above, the Ag content was relatively high, and the spreadability was not satisfactory.
そこで本発明者等はこのＢＡｇ−７の銀ろうと略同等に
融点が低く、しかもＡｇの含有量が少く、広がり性の良
好なＣｄを含まない銀ろうを開発すべく鋭意攻究の結果
Ａｇ−Ｃｕ−Ｚｎ基にＳｎとＩｎを同時に少量添加する
ことにより満足できる銀ろうの作成に成功した。Therefore, the inventors of the present invention have conducted intensive research to develop a Cd-free silver solder that has a melting point as low as that of BAg-7, has a low Ag content, and has good spreadability. By simultaneously adding a small amount of Sn and In to the Cu--Zn group, a satisfactory silver solder was successfully created.
本発明の銀ろうはＡｇ ３ ７〜５０重量％、Ｃｕｌ７
〜３０重量％、Ｚｎ １ ’７−２ ７重量％、Ｓｎ１
〜５重量％、Ｉｎ０．５〜５重量％よりなるものである
。The silver solder of the present invention contains 7 to 50% by weight of Ag3, Cul7
~30% by weight, Zn1'7-2 7% by weight, Sn1
~5% by weight, and In 0.5~5% by weight.
然して本発明の銀ろうの成分組成範囲を上述の如く限定
した理由について説明すると、Ａｇの上限５０重量％は
前述（３）項の条件を満足させる為であり、下限３７重
量％は液相線温度を低く維持し、且つ耐蝕性をそこなわ
ないようにする為である。However, to explain the reason why the component composition range of the silver solder of the present invention is limited as described above, the upper limit of 50% by weight of Ag is to satisfy the condition of item (3) above, and the lower limit of 37% by weight is to satisfy the condition of the liquidus line. This is to maintain the temperature low and not to damage the corrosion resistance.
Ｃｕの上限３０重量％は液相線温度があまり上昇せず、
且つ流動性を減じないようにする為であり、下限１７重
量％は機械的強さを減じないようにする為である。When the upper limit of Cu is 30% by weight, the liquidus temperature does not rise much,
This is to avoid reducing fluidity, and the lower limit of 17% by weight is to avoid reducing mechanical strength.
Ｚｎの上限２７重量％は機械的強さおよび耐蝕性をそこ
なわないようにする為であり、下限１７重量％は液相線
温度を低く維持できるようにするためである。The upper limit of 27% by weight of Zn is to prevent damage to mechanical strength and corrosion resistance, and the lower limit of 17% by weight is to maintain a low liquidus temperature.
Ｓｎは添加量を増すことによって急激に液相線温度を下
げる効果があるが、添加量が５重量％以上になると急激
に機械的強さおよび加工性を悪くするので５重量％を上
限とし、また液相線温度を有効に低下せしめる為に必要
な１重量％を下限とした。Sn has the effect of rapidly lowering the liquidus temperature by increasing the amount added, but if the amount added exceeds 5% by weight, the mechanical strength and workability deteriorate rapidly, so the upper limit is set at 5% by weight. The lower limit was set at 1% by weight, which is necessary to effectively lower the liquidus temperature.
Ｉｎは広がり性を向上させるのに優れた効果があるが、
添加量が５重量％以上になると急激に機械的強さおよび
加工性が悪くなるので５重量％を上限とし、広がり性を
向上せしめる為に必要な０．５重量％を下限とした。In has an excellent effect on improving spreadability, but
If the amount added exceeds 5% by weight, the mechanical strength and workability deteriorate rapidly, so the upper limit was set at 5% by weight, and the lower limit was set at 0.5% by weight, which is necessary to improve spreadability.
次に本発明の銀ろうの特性をより明瞭にする為に具体的
な実施例をもって説明する。Next, in order to clarify the characteristics of the silver solder of the present invention, specific examples will be described.
下表に示す本発明の実施品１，２，３．４を各々溶解、
鋳造、圧延によって０．５ｍｍ厚の板を作成した。Dissolving each of the products 1, 2, and 3.4 of the present invention shown in the table below,
A plate with a thickness of 0.5 mm was produced by casting and rolling.
かくして得た銀ろうと従来品であるＢＡｇ−７とを融点
測定、広がり試験（ＪＩＳ法による）、並びに引張り強
さ試験（母材は軟鉄棒ＪＩＳ２号試験片使用、ＪＩＳ法
による）をしたら下表の右欄に示すような結果を得た。The silver solder obtained in this way and the conventional product BAg-7 were subjected to melting point measurement, spread test (according to JIS method), and tensile strength test (base material was a soft iron bar JIS No. 2 test piece, according to JIS method), and the following table was obtained. The results shown in the right column were obtained.
上記表で明らかなように本発明の実施品１，２，３，４
はいずれもＢＡｇ−７よりも広がり性が向上しており、
特にＩｎの添加量の増加にしたがって広がり性が著しく
向上している。As is clear from the table above, products 1, 2, 3, and 4 of the present invention
Both have improved spreadability than BAg-7,
In particular, as the amount of In added increases, the spreadability is significantly improved.
また本発明の実施品は液相線温度がすべて７００℃以下
であって、前述の（３）項の条件を満足しており、ＢＡ
ｇ−７と比較しても見劣りする程のこともなく、実施品
１にあってはむしろＢＡｇ−７よりも低下している。In addition, the liquidus temperature of all the products according to the present invention is 700°C or lower, satisfying the condition (3) above, and achieving BA
Even when compared with BAg-7, it is not so bad that it is not inferior, and in fact, in Example 1, it is lower than BAg-7.
さらにろう付の接合強さは、本発明の実施品のすベてが
ＢＡｇ−７よりも強く、しかも本発明の実施品はすべて
破断個所が母材におきるのに対しＢＡｇ−７はろう付部
におきていて、明らかに本発明の銀ろうが強いろう付強
さを有することが判る。Furthermore, the brazing joint strength of all of the products of the present invention is stronger than BAg-7, and in contrast to all of the products of the present invention that break at the base metal, BAg-7 It can be clearly seen that the silver solder of the present invention has strong brazing strength.
以上の説明でわかるように、本発明の銀ろうは従来のＢ
Ａｇ−７と略同等の低い液相線温度を有し、しかもＢＡ
ｇ−７よりも一段と優れた広がり性と強い接合強さを有
するので、作業性を一段と改善せしめることのできる優
れた効果がある。As can be seen from the above explanation, the silver solder of the present invention is a conventional B solder.
It has a low liquidus temperature almost equivalent to Ag-7, and has a BA
Since it has much better spreadability and stronger bonding strength than g-7, it has the excellent effect of further improving workability.
Claims (1)
７〜２７％、錫１〜５％、インジウム０．５〜５％より
なる銀ろう。1 Weight ratio: 37-50% silver, 17-30% copper, 1% zinc
A silver solder consisting of 7-27% tin, 1-5% tin, and 0.5-5% indium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49081873A JPS5813274B2 (en) | 1974-07-17 | 1974-07-17 | Ginro |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49081873A JPS5813274B2 (en) | 1974-07-17 | 1974-07-17 | Ginro |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5110158A JPS5110158A (en) | 1976-01-27 |
| JPS5813274B2 true JPS5813274B2 (en) | 1983-03-12 |
Family
ID=13758568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49081873A Expired JPS5813274B2 (en) | 1974-07-17 | 1974-07-17 | Ginro |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5813274B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0349873U (en) * | 1989-09-21 | 1991-05-15 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834494A (en) * | 1971-09-06 | 1973-05-18 | ||
| JPS4834748A (en) * | 1971-09-08 | 1973-05-22 |
-
1974
- 1974-07-17 JP JP49081873A patent/JPS5813274B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4834494A (en) * | 1971-09-06 | 1973-05-18 | ||
| JPS4834748A (en) * | 1971-09-08 | 1973-05-22 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0349873U (en) * | 1989-09-21 | 1991-05-15 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5110158A (en) | 1976-01-27 |
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