JPS58127340A - Carrier jig moving mechanism for handler - Google Patents

Abstract

PURPOSE:To improve loading efficiency of semiconductor device, reduce a number of units of handler and realize reduction in size by providing plurality of test heads on a single unit of handler. CONSTITUTION:For the test of semiconductor device, an XY table 12 is positioned for two units of test heads 40, 42 by means of an X direction driving motor 14 and a Y direction driving motor 18 so that a carrier jig 26 on the table 2 is positioned opposing to the test head 40. At this time, the X direction moving table 30 is located at the position indicated by a solid line. Under this condition, a semiconductor device to be tested is inserted to sockets 28, 38 of the carrier jigs 26, 36. After a semiconductor device is inserted, the X direction moving table 30 moves to the position indicated by a broken line from the position indicated by a solid line along a guide bar 34 so that the carrier jig 36 on the X direction moving table 30 is positioned opposing to the test head 42.

Description

[Detailed description of the invention] The present invention relates to a carrier jig moving mechanism for a handler.

Conventionally, in the manufacturing process of semiconductor devices such as transistors, integrated circuits (zero engineering), large-scale integrated circuits (LS engineering), etc., tester handlers used to test the characteristics of manufactured conductor devices. I'm getting beaten up.

By the way, the conventional test handler sets the test head to 1
It's structured so that it can be placed on a stand.

In the case of a tester to which two test heads can be connected per tester, two handlers are required, resulting in a considerable cost increase.

In particular, since the main body of a tester is expensive, it is desired to be able to test a large number of semiconductor devices simultaneously.

On the other hand, it is also desired to be able to simultaneously set a large number of semiconductor devices on a test head using a carrier jig so that a single test head can simultaneously test a large number of semiconductor devices.

The present invention has been developed in view of the above-mentioned problems, and by providing a plurality of test heads in one handler, it is possible to improve the mounting OwA rate of semiconductor devices and reduce the number of handlers. Another object of the present invention is to provide a carrier jig moving mechanism for a 71 driver, which can accommodate the deaf.

Hereinafter, the present invention will be further explained according to an embodiment shown in the drawings.

FIG. 1 and FIG. 2 are a schematic front view and a schematic plan view, respectively, showing an embodiment of the handler carrier jig moving mechanism according to the present invention.

This example Kj? An XY table 12 movable in the FiXY directions is installed above the base IO. A motor 14 for moving the XY table 12 in the X direction is provided, and the motor 14 for moving the X direction is connected to its rotating shaft and rotates a screw shaft 16 to move the entire It can be moved in the X direction. On the other hand, the ninth KY direction movement motor 18, which moves the entire XY table 12 in the Y direction, can move the entire XY table 12 in the KY direction via the Y direction movement mechanism 20.

The XY table 12 is supported on the screw shaft 16 via a support block 22 and has a large movement table 24. A carrier jig 26 having a socket 28 for a semiconductor device is placed on the moving table 24.

Further, an X-direction moving table 3G is attached to the moving table 24 so as to be movable in the X-direction by a cylinder 32 along a guide bar 34.

A carrier jig 36 provided with a socket 38 for a KFi and a cow conductor device is placed above the X-direction moving table 30. By installing such an X-direction moving table 30, the stroke of the IY table 120 can be reduced even if the two test heads 40 and 42 are separated from each other. Namely.

Two test heads 4 installed in this example
0 and 42 are separated by a predetermined distance, and one test head 4G is arranged at a position facing the carrier jig 26. The X-direction moving table 30 is movable in the X-direction to a position facing the test head 42.
It reciprocates along the guide bar 34 from the solid line position 2g in the figure to the two-dot chain line position on the left side in the X direction.

When testing a semiconductor device in this embodiment.

X-direction movement motor 14 and X-direction movement motor 18
XY table 1z with two test heads 40.4
2, and as shown in FIG. 2, move the carrier jig 26 on the moving table 24 to a position facing the test head 40. At this time, the X-direction moving table 30 is placed at the position shown by the solid line in FIGS. 1 and 2. In this state, a semiconductor device such as an IC to be tested is inserted into the sockets 28 and 38 of the carrier jigs 26 and 36. After the semiconductor device has been inserted, the X-direction moving table 30 is moved from the solid line position in FIGS. Carrier jig 3
6 is placed in a position facing the test head 42.

Therefore, according to this embodiment, two test heads 4G and 42 can be installed for one test handler in a multi-head structure, and these test heads 40 and 42 can be separated. By moving the X-direction moving table 30, one side 36 of the carrier jig can be moved to a position opposite to the other side 42 of the test head, even if the sockets 28
．． A large number of semiconductor devices are inserted into 38 and each carrier jig 2
6, 28 can be carried onto each test head 40, 42, electrically connected, and tested. the result.

The two test heads 40 and 42 allow a large number of semiconductor devices to be tested at the same time, which is extremely efficient and also reduces the number of rows of the XY table 12.

The entire mechanism can also be downsized.

As explained above, according to the single-shot qK, it is possible to simultaneously mount a large number of semiconductor devices and perform an efficient table test, and the stroke of the front mechanism can be made small, making it possible to downsize the device. Moreover, since a plurality of test heads can be attached to one nozzle, it is possible to reduce costs.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view showing an embodiment of a handler carrier jig moving mechanism according to the present invention, and FIG. 2 is a schematic plan view thereof. 10...Base, 12...XY table , 14...
・Motor for moving in the X direction, 16...screw shaft, 18...Y
Direction movement motor, 20...Y direction movement mechanism, 22.
...Support block, 24...Movement table, 26...
・Carrier jig, 28...Socket, 30...X direction moving table, 32...Cylinder %34...Guide bar, 36...Carrier jig, 38...Socket, 40.42 ...Test head.

Claims (1)

[Claims] 1. A carrier jig moving mechanism for a handler that performs a test by inserting a semiconductor device into a socket on a carrier jig, the mechanism comprising: A carrier jig moving mechanism for a handler, characterized in that a predetermined carrier jig among the carrier jigs is configured to be able to move by a predetermined amount depending on the interval between test heads. 2. Each carrier jig is supported δ on the XY table,
A patent claim in which both carrier jigs can be moved in the X and Y directions by a motor for moving in the X and Y directions, and one carrier jig can be moved in the X direction (by a predetermined amount) by a cylinder depending on the interval between the test heads. The handler carrier jig moving mechanism according to item 1.