JPS58124948U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS58124948U
JPS58124948U JP1982021904U JP2190482U JPS58124948U JP S58124948 U JPS58124948 U JP S58124948U JP 1982021904 U JP1982021904 U JP 1982021904U JP 2190482 U JP2190482 U JP 2190482U JP S58124948 U JPS58124948 U JP S58124948U
Authority
JP
Japan
Prior art keywords
bonding part
wire bonding
lead frame
bonding equipment
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982021904U
Other languages
English (en)
Japanese (ja)
Other versions
JPH019158Y2 (enFirst
Inventor
苗村　純一
小島　久彰
正夫 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1982021904U priority Critical patent/JPS58124948U/ja
Publication of JPS58124948U publication Critical patent/JPS58124948U/ja
Application granted granted Critical
Publication of JPH019158Y2 publication Critical patent/JPH019158Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1982021904U 1982-02-17 1982-02-17 ワイヤボンデイング装置 Granted JPS58124948U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58124948U true JPS58124948U (ja) 1983-08-25
JPH019158Y2 JPH019158Y2 (enFirst) 1989-03-13

Family

ID=30034011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982021904U Granted JPS58124948U (ja) 1982-02-17 1982-02-17 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58124948U (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286832A (ja) * 1985-10-14 1987-04-21 Nec Corp Ｉｃリ−ドフレ−ム搬送装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188185A (enFirst) * 1975-01-31 1976-08-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188185A (enFirst) * 1975-01-31 1976-08-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286832A (ja) * 1985-10-14 1987-04-21 Nec Corp Ｉｃリ−ドフレ−ム搬送装置

Also Published As

Publication number Publication date
JPH019158Y2 (enFirst) 1989-03-13

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