JPS58124948U - wire bonding equipment - Google Patents

wire bonding equipment

Info

Publication number
JPS58124948U
JPS58124948U JP1982021904U JP2190482U JPS58124948U JP S58124948 U JPS58124948 U JP S58124948U JP 1982021904 U JP1982021904 U JP 1982021904U JP 2190482 U JP2190482 U JP 2190482U JP S58124948 U JPS58124948 U JP S58124948U
Authority
JP
Japan
Prior art keywords
bonding part
wire bonding
lead frame
bonding equipment
die bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982021904U
Other languages
Japanese (ja)
Other versions
JPH019158Y2 (en
Inventor
苗村　純一
小島　久彰
正夫 山崎
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP1982021904U priority Critical patent/JPS58124948U/en
Publication of JPS58124948U publication Critical patent/JPS58124948U/en
Application granted granted Critical
Publication of JPH019158Y2 publication Critical patent/JPH019158Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はリードフレームの斜視図、第２図は本考案の＝
実施例を示す斜視図である。 １：リードフレーム、Ａ：ダイボンド部、Ｂ：ワイヤホ
ン下部、Ｃ，Ｄ：外部回路接続用リード端子部、１０珈
体、１１：加熱ブロック、１２：冷却ブロック、１３：
ヒータ。Figure 1 is a perspective view of the lead frame, Figure 2 is the = of the present invention.
It is a perspective view showing an example. 1: Lead frame, A: Die bonding part, B: Lower part of wire phone, C, D: Lead terminal part for external circuit connection, 10 Cord body, 11: Heating block, 12: Cooling block, 13:
heater.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームのチップダイボンド部及び該ダイボンド
部に近接したワイヤボンド部を所望温度に加熱するため
、リードフレームの上記ダイボンド部及びワイヤボンド
部に当接する加熱体が設けられ、該加熱体と熱的に隔離
されたリードフレームの延長部を冷却する冷却体とを備
えてなるワイヤボンディング装置。In order to heat the chip die bonding part of the lead frame and the wire bonding part in the vicinity of the die bonding part to a desired temperature, a heating body that comes into contact with the die bonding part and the wire bonding part of the lead frame is provided, and is thermally connected to the heating body. and a cooling body for cooling an isolated lead frame extension.
JP1982021904U 1982-02-17 1982-02-17 wire bonding equipment Granted JPS58124948U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (en) 1982-02-17 1982-02-17 wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982021904U JPS58124948U (en) 1982-02-17 1982-02-17 wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS58124948U true JPS58124948U (en) 1983-08-25
JPH019158Y2 JPH019158Y2 (en) 1989-03-13

Family

ID=30034011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982021904U Granted JPS58124948U (en) 1982-02-17 1982-02-17 wire bonding equipment

Country Status (1)

Country Link
JP (1) JPS58124948U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286832A (en) * 1985-10-14 1987-04-21 Nec Corp Conveyor for ic lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188185A (en) * 1975-01-31 1976-08-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5188185A (en) * 1975-01-31 1976-08-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286832A (en) * 1985-10-14 1987-04-21 Nec Corp Conveyor for ic lead frame

Also Published As

Publication number Publication date
JPH019158Y2 (en) 1989-03-13

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