JPS6286832A - Conveyor for ic lead frame - Google Patents
Conveyor for ic lead frameInfo
- Publication number
- JPS6286832A JPS6286832A JP22809785A JP22809785A JPS6286832A JP S6286832 A JPS6286832 A JP S6286832A JP 22809785 A JP22809785 A JP 22809785A JP 22809785 A JP22809785 A JP 22809785A JP S6286832 A JPS6286832 A JP S6286832A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- frame
- lead frame
- heater block
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣ，ＬＳＩのリードフレームの搬送装置に関
し、特にＩＣ，ＬＳＩの組立工程で使われるグイデンダ
ー、ワイヤーボンダー等における搬送装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transport device for lead frames of ICs and LSIs, and more particularly to a transport device for a guider, wire bonder, etc. used in the assembly process of ICs and LSIs.
従来の搬送装置は第５図、第６図に示す。熱圧着ポンデ
ィングでのＩＣＩＪ−ドフレーム６の加熱はヒーターブ
ロック４で行なわれ、そのＩＣチップ１３の搭載部屋゛
びインナーリード部１６はワーク押え１４によシヒータ
ーブロック４の表面に押圧された後ワイヤーボンディン
グ１５が行なわれる。ワイヤーボンディングを完了する
と、ワーク押え１４は矢印Ａの向きに上昇し次のＩＣベ
レント部が矢印Ｂの向きに送られ、上記動作が繰り返さ
れていた。５はカートリッジヒーターである。A conventional conveying device is shown in FIGS. 5 and 6. Heating of the ICIJ-hard frame 6 during thermocompression bonding was performed by the heater block 4, and the mounting chamber for the IC chip 13 and the inner lead portion 16 were pressed against the surface of the heater block 4 by the work holder 14. After that, wire bonding 15 is performed. When wire bonding is completed, the workpiece holder 14 is raised in the direction of arrow A, and the next IC berent section is sent in the direction of arrow B, and the above operation is repeated. 5 is a cartridge heater.
ＬＳＩの市場では多ピン化、低価格が要求され、リード
先端部の巾のＪ・型化ならびに銅製リードフレームが出
現してきた。一方、従来のリードフレームの加熱搬送方
法ではリードフレームの一部だけが加熱されているため
、リードフレーム上での温度が場所によって異なシ、従
って、場所による熱膨張の差が発生していた。特に多ピ
ンあるいは銅リードフレームのリード部は熱ひずみによ
る変形のためにヒーターブロック上で位置がバッノき、
ワーク押えで押えた時に大きくずれ込み、リード側のボ
ンディングが不可能となるかあるいはデンディング完了
品がワーク押え上昇時にそのリード部が上下方向に動く
ことによシ接続細線が切断するなどの欠点があった。In the LSI market, higher pin counts and lower prices are required, and lead tips with J-shaped widths and copper lead frames have appeared. On the other hand, in the conventional method of heating and transporting a lead frame, only a portion of the lead frame is heated, so the temperature on the lead frame varies depending on the location, and therefore, differences in thermal expansion occur depending on the location. In particular, the lead parts of multi-pin or copper lead frames may become distorted on the heater block due to deformation due to thermal strain.
When the workpiece is held down by the workpiece presser, it may shift significantly, making it impossible to bond the lead side, or when the workpiece presser is raised, the lead portion of the dending-completed product may move up and down, causing the fine connecting wire to break. there were.
本発明は前記問題点を解消し、加熱によりＩＣＩＪＩＣ
リ−ドフレーム障害をなくすＩＣリードフレームの搬送
装置を提供するものである。The present invention solves the above-mentioned problems, and by heating ICIJIC.
An object of the present invention is to provide an IC lead frame transport device that eliminates lead frame failures.
本発明はＩＣリードフレームの搬送ラインに該リードフ
レームを加熱させるヒーターブロックを備えた搬送装置
において、前記ヒーターブロックによる加熱と同時にリ
ードフレームの一部を冷却する冷却部を前記搬送ライン
に設けたことを特徴とするＩＣリードフレーム搬送装置
である。The present invention provides a transport device including a heater block for heating the lead frame on a transport line of an IC lead frame, in which a cooling unit is provided in the transport line for cooling a part of the lead frame at the same time as the heater block heats the lead frame. This is an IC lead frame transport device characterized by:
以下、本発明の一実施例を図によって説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図、第２図に本発明の一実施例を示す。冷却用パイ
プ１，１′はヒーターブロック４をはさんでその両側に
ヒーターブロック４と平行に置かれている。又冷却用パ
イｆ１とヒーターブロック４の上面とは第２図に示すよ
うにそのノ’？イブ１の最上部がヒーターブロック上面
よシ下方に位置している。バイア′１にはその上方部に
上方に向って吹き出し孔２が定ピツチで多数個設けられ
ている。パイプ１の中には矢印Ｃの向きで乾燥空気又は
Ｎ２などの冷却用気体３が導ひかれ吹き出し孔２から吹
き出す構造になっている。吹き出した冷却用気体は第４
図に示すリードフレーム６のＸ方向タイバ一部８を冷却
し、Ｘ方向フレーム部７と温度差が出ないようにその流
量が図示しない制御部によりコントロールされている。An embodiment of the present invention is shown in FIGS. 1 and 2. FIG. The cooling pipes 1, 1' are placed parallel to the heater block 4 on both sides thereof. Also, the cooling pie f1 and the top surface of the heater block 4 are connected to each other as shown in FIG. The top of Eve 1 is located below the top surface of the heater block. A large number of blow holes 2 are provided in the upper part of the via '1 in an upward direction at regular intervals. A cooling gas 3 such as dry air or N2 is guided into the pipe 1 in the direction of arrow C and is blown out from the blow-off holes 2. The cooling gas blown out is the fourth
The flow rate is controlled by a control section (not shown) to cool the X-direction tie bar part 8 of the lead frame 6 shown in the figure, and to prevent a temperature difference from the X-direction frame part 7.
この場合、吹き出し気体は常時であっても間欠的であっ
てもよい。一方、Ｙ方向タイバ一部９はＹ方向フレーム
部１０とは同時に加熱されるので、温度はほぼ同一とな
る。In this case, the gas may be blown out constantly or intermittently. On the other hand, since the Y-direction tie bar portion 9 and the Y-direction frame portion 10 are heated at the same time, their temperatures are approximately the same.
Ｘ方向タイバ一部８とＸ方向フレーム部７とが同一温度
となり、又Ｙ方向タイバ一部９とＸ方向フレーム部１０
とが同一温度となるので、第３図に示すようにリード部
１１．１２の先端部は上下方向に大きな変位を起さない
。The X-direction tie bar part 8 and the X-direction frame part 7 are at the same temperature, and the Y-direction tie bar part 9 and the X-direction frame part 10 are at the same temperature.
Since both are at the same temperature, the tips of the lead portions 11 and 12 do not undergo large displacements in the vertical direction, as shown in FIG.
更に、リードフレーム品種が変更になった時でも・母イ
ブの位置が容易に変更できるようにスライド機構を設け
ておくことも可能である。この方式はダイボングーにて
も効果が認められる。又、冷却吹き出し・ぐイブの代り
に冷却用の接触ノやイブ（内部に流体を通した）を使用
しても同じ効果が得られる。Furthermore, it is also possible to provide a slide mechanism so that the position of the mother eve can be easily changed even when the type of lead frame is changed. This method is also effective for Daibongoo. Also, the same effect can be obtained by using a cooling contact hole or tube (with a fluid passed inside) instead of the cooling tube or tube.
以上説明したように本発明は、リードフレームの一部を
冷却することにより、リード部先端のボンディング時の
位置ズレを抑えるとともに、デンディング後の搬送時に
もボンディングワイヤーにダメージを与えずに正常に搬
送させることができる効果がある。As explained above, the present invention cools a part of the lead frame to suppress the positional shift of the tip of the lead part during bonding, and also allows the bonding wire to be properly transported without damaging the bonding wire during transportation after bonding. It has the effect of being able to be transported.
第１図は本発明の一実施例を示す斜視図、第２図は同断
面図、第３図は本発明の作用を示す説明図、第４図はリ
ードフレームの平面図、第５図はある。
１・・・冷却用Ａ’イブ、２・・・吹き出し孔、３・・
・吹き出しガス、４・・・ヒーターブロック、５・・・
カートリッジヒーター、６・・・リードフレーム、７・
・・Ｘ方向フレーム部゛、８・・・Ｘ方向タイバ一部、
９・・・Ｙ方向タイバ一部、１０・・・Ｙ方向フレーム
部、１１・・・リード部、１２・・・リード部、１３・
・・ＩＣＣタッグ１４・・・ワーク押え。
Ｃ
第１図
第２図
第３図
第５図Fig. 1 is a perspective view showing one embodiment of the present invention, Fig. 2 is a sectional view thereof, Fig. 3 is an explanatory view showing the operation of the present invention, Fig. 4 is a plan view of the lead frame, and Fig. 5 is a sectional view of the same. be. 1...A've for cooling, 2...Blowout hole, 3...
・Blowout gas, 4... Heater block, 5...
Cartridge heater, 6...Lead frame, 7.
・・X-direction frame part ゛, 8...X-direction tie bar part,
9... Part of Y direction tie bar, 10... Y direction frame part, 11... Lead part, 12... Lead part, 13...
...ICC tag 14...Work clamp. C Figure 1 Figure 2 Figure 3 Figure 5
Claims (1)
ームを加熱するヒーターブロックを備えた搬送装置にお
いて、前記ヒーターブロックによる加熱と同時にリード
フレームの一部を冷却する冷却部を前記搬送ラインに設
けたことを特徴とするＩＣリードフレーム搬送装置。(1) In a transport device including a heater block for heating the lead frame on a transport line for IC lead frames, the transport line is provided with a cooling section that cools a part of the lead frame at the same time as the heater block heats the lead frame. An IC lead frame transport device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22809785A JPS6286832A (en) | 1985-10-14 | 1985-10-14 | Conveyor for ic lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22809785A JPS6286832A (en) | 1985-10-14 | 1985-10-14 | Conveyor for ic lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6286832A true JPS6286832A (en) | 1987-04-21 |
| JPH0511421B2 JPH0511421B2 (en) | 1993-02-15 |
Family
ID=16871139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22809785A Granted JPS6286832A (en) | 1985-10-14 | 1985-10-14 | Conveyor for ic lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6286832A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100421776B1 (en) * | 1999-12-30 | 2004-03-10 | 앰코 테크놀로지 코리아 주식회사 | Transducer cooling system of wire bonder for manufacturing semiconductor and its method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124948U (en) * | 1982-02-17 | 1983-08-25 | シャープ株式会社 | wire bonding equipment |
-
1985
- 1985-10-14 JP JP22809785A patent/JPS6286832A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124948U (en) * | 1982-02-17 | 1983-08-25 | シャープ株式会社 | wire bonding equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100421776B1 (en) * | 1999-12-30 | 2004-03-10 | 앰코 테크놀로지 코리아 주식회사 | Transducer cooling system of wire bonder for manufacturing semiconductor and its method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0511421B2 (en) | 1993-02-15 |
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