JP5042146B2 - Flip chip bonder - Google Patents

Description

The present invention relates to a flip chip bonder device that adsorbs, picks up, inverts and connects an electronic component that is attached to an adhesive sheet and cut out from a wafer to a substrate.

A wafer is a disk-shaped plate made by thinly slicing an ingot, which is a material for manufacturing a semiconductor element, and in which a crystal of a semiconductor material such as silicon is grown in a cylindrical shape. The thickness of the plate is about 0.03 mm to 1 mm.

  This plate is provided with an electronic component (hereinafter referred to as a chip) in which an integrated circuit is formed in a state where the surface is developed / etched, adhered to an adhesive sheet in a state where the resist is removed, and finely diced.

The chip is a square having a side of about 1 mm to 30 mm square, and is sucked and conveyed by a nozzle or the like and mounted on a substrate or the like.
The present application relates to a device used when a chip is connected to a substrate using a bump, which is also called a flip chip bonder device.

As shown in FIG. 2, the bump 201 refers to a hump-shaped metal formed on the silicon wafer 19 and is formed in a die of the wafer 19 (a region that is cut out as a single block of an integrated circuit to become one semiconductor chip 20). This means a protruding metal terminal connected to an integrated circuit.
The bump 201 formed on the wafer 19 is a part of the wiring of the integrated circuit, and serves as a terminal for connecting the semiconductor chip 20 in which the integrated circuit is configured to the circuit of the circuit board 18. Dozens to thousands of bumps 201 are required for one semiconductor chip 20.

The semiconductor chip 20 on which the bump 201 is formed is inverted and faced down so that the bump 201 is directly connected to the circuit board 18. The bump 201 has a height of 10 to 100 μm and a diameter of 10 to 125 μm. When the bump 201 is heated to 200 ° C. or higher and pressurized, the bump 201 is melted and the circuit board 18 and the semiconductor chip 20 are connected.
Therefore, the flip chip bonder must be accurately positioned and pressed with an error within a few μm, and the heated part becomes high temperature, so that accurate positioning is achieved with minimal changes due to thermal countermeasures and thermal expansion. This is very important.

  As a countermeasure against heat, a conventional example as shown in FIG. 8, Japanese Patent Laid-Open No. 2003-264358 is shown. In the conventional example, in order to accurately heat and pressure bond the chip 92 to a predetermined position of the substrate 93, the camera 94 (upper and lower view camera) is inserted between the chip 92 and the substrate 93 immediately before the chip 92 is bonded to the substrate 93. After making corrections so that both are positioned accurately, the bonding head 91 is moved down to bond the chip 92 to the substrate 93 by heating and pressing.

First, the camera 94 advances between the substrate 93 installed on the bonding stage 90 and the chip 92 attached to the bonding head 91 to perform image recognition, and position adjustment for bonding and angle adjustment of the chip 92 are performed. .
Thereafter, the camera 94 moves backward, the bonding head 91 descends, and the chip 92 is heated and pressed to a predetermined position on the substrate 93. Since the chip 92 is pressed and bonded while being heated, the vicinity of the bonding head 91 and the bonding stage 90 is in a high temperature atmosphere.

The camera 94 that moves into a high-temperature atmosphere and recognizes an image will eventually become hot if such work is repeated many times, and thermal deformation will occur, making accurate image recognition impossible. Therefore, the air cooled from the supply path 95 is blown in as indicated by an arrow to prevent the temperature of the camera 94 from rising and allow accurate image recognition.
JP2003-264358

In the above-described conventional example, cold temperature or the like is blown into the camera 94 to adjust the temperature. However, the two-field camera 30 is used as the camera used in this apparatus. As shown in FIGS. 6 and 7, the two-field camera 30 is configured so that two CCD cameras 31.32 can photograph both the upper and lower objects from the photographing hole 33 using prisms and lenses.
Therefore, the upper focal point 35 and the lower focal point 36 are captured at a point connected by a focal axis 37 parallel to the photographing hole, so that the distance between the semiconductor chip 20 and the circuit board 18 is measured and accurate at a high magnification. The position is adjusted.

In the conventional example, cool air is blown from the supply path 95 to cool the camera 94, but the two-field camera 30 is connected to the positions of the upper and lower focal points 35 and 36 connected by the focal axis 37 and the circuit board. This is the part where the final confirmation that the positions of both are corrected and combined by photographing 18 is performed. After being imaged by the two-field camera 30 and the position is corrected, the bonding head unit 50 is moved downward by a predetermined distance while adsorbing and holding the semiconductor chip 20 and is bonded to the circuit board 18 by heat and pressure.

What is important here is that a temperature difference occurs inside the two-field camera 30 to prevent changes in the focal axis 37 and changes in the distance between the upper and lower focal points 35 and 36 caused by prism and lens deformation and thermal expansion of components. To achieve this, just by blowing cool air from the supply path 95 and cooling the camera 94 from one direction as in the conventional example, a temperature difference occurs inside the camera 94, and the distance between the focal axis 37 and the vertical focal points 35, 36. There was a possibility that an error would occur in h.

Further, the substrate 93 is heated by the bonding stage 90 of the conventional example of FIG. 8 so that the bumps 201 are easily melted and connected, so that the upper part of the bonding stage 90 is in a heated atmosphere.
Further, a heater is attached to the tip of the bonding head 91, and the temperature of the chip 92 is raised to 200 ° C. or more and bonded to the substrate 93 by heat and pressure, so that the upper part of the bonding stage 90 gradually becomes high temperature. End up. The camera 94 that advances into such a high-temperature atmosphere eventually becomes high temperature, and an error due to thermal expansion occurs. Therefore, it is desirable to keep the upper part of the bonding stage 90 at room temperature as much as possible.

The bonding stage 90 is heated to a certain temperature, but if the heat is transmitted to the lower part of the bonding stage 90, an error due to thermal expansion occurs in the entire body, so that heat is insulated so that the heat is not transmitted to the lower part of the bonding stage 90. It is desirable that

Furthermore, it is desirable to circulate air so that the atmospheric temperature above the bonding stage 90 does not become high. However, when air is blown out, it is preferable that dust or the like adheres to the chip 92 or the substrate 93 and does not lower the conductivity by discharging the air purified by a filter or the like.

Therefore, a substrate mounting part that precisely places the circuit board and manages the temperature by a constant temperature means, a semiconductor chip transfer bonding means that heats and heat-bonds the semiconductor chip to the circuit board by the heating means, and the semiconductor A two-field camera for recognizing the correlation between the circuit board and the semiconductor chip by moving so as to be positioned between the substrate mounting portion and the semiconductor chip transfer bonding means when the chip transfer bonding means is located at the mounting position; In the provided flip chip bonding apparatus,
A plurality of temperature sensors provided in the two-field camera; an air circuit for air-cooling the two-field camera; and a cooling means including a plurality of forced cooling air inlets and outlets for air-cooling the two-field camera; Cooling air control means for controlling forced cooling of the cooling means is provided, the cooling control means from the cooling air inlet in the vicinity of the temperature sensor having a high sensing temperature to the cooling air outlet in the vicinity of the temperature sensor having a low sensing temperature. The flip-chip bonder apparatus is characterized in that the temperature of the entire two-field camera is made uniform by controlling so that the cooling air flow is generated.

The air blown into the semiconductor chip transfer joining means passes through the vicinity of the heating portion of the heating means of the semiconductor chip transfer joining means and is discharged from the vicinity of the lower end of the semiconductor chip transfer joining means. A cooling air passage, and a heat insulating air chamber that is attached to the semiconductor chip adsorbing portion and is blown to block the heat generated by the heating means of the semiconductor chip transfer joining means by the blown air, and the heating means While cooling the heating part overheated by the heating means by the cooling passage, the heat generated by the heating means by the heat insulating air chamber is prevented from thermally conducting to the other part of the semiconductor chip transfer joining means and thermally expanding. The air blown into the heating means cooling air passage and the heat insulating air chamber is discharged from the semiconductor chip transfer joining means. Accordingly there is provided a flip-chip bonder, characterized in that so as to wind flow to diffuse the heat generated from the heating means and the substrate mounting portion.
Furthermore, the board mounting part is heat-insulated so that heat is not conducted to the lower part, and the flip-chip bonder device is characterized in that the air cleaned by the filter is supplied to the heating means cooling air passage. And blowing into the adiabatic air chamber and discharging it from the semiconductor chip transfer joining means to form an air flow, thereby preventing dust from adhering to the circuit board and the semiconductor chip. A flip chip bonder device is provided.

In the invention according to the present application, an air supply path 38 that is not released to the outside is provided inside the two-field camera 30, and the air blown from the P port can be blown from both ends 38a and 38b of the air supply path 38. . The air blown from the air supply path end 38a is blown from the air supply path end 38b, and the air blown from the air supply path end 38b is blown from the air supply path end 38a. The air was blown out and released to the atmosphere via the control valve 39. That is, the air supply path 38 provided in the two-field camera 30 is configured to be a closed circuit.
Furthermore, a plurality of temperature sensors 40a and 40b are provided inside the two-field camera 30.

For example, when the value of the temperature sensor 40a is higher than that of the temperature sensor 40b, the air is blown from the air supply path end 38a piped in the vicinity of the temperature sensor 40a, and the air is controlled from the air supply path end 38b. An air pressure control unit that is controlled by the control unit 3 so as to be released to the atmosphere via
As a result, the air that has passed through the vicinity of the high temperature sensor 40a quickly cools the vicinity of the temperature sensor 40a and passes through the vicinity of the temperature sensor 40b in a slightly heated state, so the temperature difference between the temperature sensor 40a and the temperature sensor 40b. Can be made difficult to occur.

With such a configuration, the prism inside the photographing circuit 34 attached to the CCD cameras 31 and 32 or the optical system parts inside the two-field camera 30 have the same temperature on the left and right, and the focal axis 37 is shifted due to the thermal effect. It is possible to reduce the error and to reduce the error in the focal length h. In this way, it was possible to prevent the components of the optical system inside the two-field camera 30 from being tilted due to the temperature difference and the accuracy becoming unstable.

In addition, when there is no temperature difference between the temperature sensors 40a and 40b, the temperature of the entire two-field camera 30 is kept constant by supplying the air alternately from the air supply path end portions 38a and 38b in a certain time. I was able to do it.

In addition, the air is blown from the P port by the control valve 39, and then returned to the control valve 39 and then guided to the outside of the device and released to the atmosphere, so a filter is attached to clean the air. There is no need to do so and it is economical. Further, if the air blown into the two-field camera 30 is cooled to a constant temperature, the temperature management effect is further improved. Further, the air returned to the control valve 39 can be discharged to the vicinity of the gantry 2 and the control unit 3 by adding piping, and can be reused for cooling these parts.

Next, a bonding tool 51 for adsorbing the semiconductor chip 20 and a heater 52 for heating the semiconductor chip 20 are provided at the lower end of the bonding head unit 50. The heater mounting portion 53 includes a heater cooling air blowing port 53a and a heater cooling air blowing port 532.

When the heater 52 is generating heat, the air blowing from the heater cooling air blowing port 53a is stopped, and the bonding tool 51 is heated by the heat generated by the heater 52, the semiconductor chip 20 is heated, and the bumps 201 are melted to form a semiconductor. The chip 20 and the circuit board 18 are joined. Immediately after bonding, an air is blown from the heater cooling air blowing port 53a to cool the heater 52, and at the same time, the bonding tool 51 and the semiconductor chip 20 are cooled.
The air blown from the heater cooling air blowing port 53a is blown from the heater cooling air blowing port 532 immediately above the heater 52, and the bumps 201 which are melted by cooling the vicinity of the semiconductor chip 20 are solidified and rapidly solidified. Can be completed.

Furthermore, there is a heat insulating part 55 above the heat insulating material 54, and air is always blown from the heat insulating part cooling air blowing port 551, air is blown from the heat insulating part air blowing port 552, and the heat of the heater 52 is transmitted to the force sensor 56. It insulates so as not to be diffused and diffuses the ambient atmosphere heated by the bonding stage 60.
All of the air blown from the heater cooling air blowout port 532 and the heat insulating section cooling air blowout port 552 passes through the filter and is blown from the heater cooling blowout port 53a and the heat insulation cooling air blowout port 551. It can be prevented that a cleaned air always flows into the substrate 18 and dust adheres to it and wiring defects do not occur.

Further, the bonding stage 60 is heated by the bonding stage heater 62 so that the bumps 201 can be easily attached to the circuit board 18. A bonding stage heat insulating material 61 is interposed between the bonding stage 60 and the XY table 63 so that the heat of the bonding stage heater 62 is transmitted to the XY table 63 and is not thermally expanded.

The present invention relates to a flip-chip bonder that can only have an error of about several μm, and the optical system components of the two-field camera 30 used for final positioning are tilted due to a temperature difference, even though a heat source is nearby. In order to prevent the accuracy from becoming unstable, temperature sensors 40a and 40b are provided, and an air supply path 38 configured in a closed circuit state that is not opened in the two-field camera 30 is provided.
In addition, by releasing air that has been cleaned outward from the bonding head 50, the ambient temperature of the place where the two-field camera 30 advances is reduced, and air that is free of dust is released in the vicinity of the joint. It is intended to prevent contact failure.
FIG. 1 is an overall view of the flip chip bonder device 1 and shows a state where the reversing head 17 has taken the semiconductor chip 20 onto the wafer 19.
FIG. 2 is an overall view of the flip chip bonder device 1 and shows a state in which the semiconductor chip 20 is delivered from the reversing head 17 to the bonding head 50.

FIG. 3 is an enlarged view showing a state in which the two-field camera 30 advances and measures between the bonding head portion 50 holding the semiconductor chip 20 by suction and the circuit board 18.
FIG. 4 is an enlarged view showing a state in which the semiconductor chip 20 is heated and pressed and bonded to the circuit board 18 by the bonding head unit 50 holding the semiconductor chip 20 by suction.
FIG. 5 is an enlarged view of the bonding head unit 50, and allows the outside of the heat insulating unit 55 and the heater mounting unit 53 to be seen through.
FIG. 6 is an enlarged view of the two-field camera 30.
FIG. 7 is a diagram in which the outside of the two-field camera 30 is made transparent and a drafting symbol of the control valve 39 is described so that the air passage 38 can be easily understood.
FIG. 8 is a view depicting the vicinity of a conventional camera 94, a bonding head 91, and a bonding stage 90. FIG.

The semiconductor chip 20 is configured to be installed on the wafer table 16 and moved in the X direction by the motor 161 in the state of the wafer 19 adhered to the adhesive sheet.

The semiconductor chip 20 is sucked and held by the reversing head 17 as shown in FIG. Next, the semiconductor chip 20 is moved to the bonding head 50 at a predetermined position by moving in the Y direction by driving the motor 171 and turning the reversing head 17 upward by driving the motor 172 as shown in FIG. It is configured to deliver.

The semiconductor chips 20 on the wafer 19 are sequentially sucked and held by the reversing head 17 under the control of the control unit 3 by the movement of the wafer 19 in the X direction and the movement of the reversing head in the Y direction.
The motors used in the present application are all servo motors and are equipped with an encoder (rotation detector). The rotation angle and the rotation speed of the motor shaft are detected and controlled by the control unit 3 so as to be reversed. All the movable parts such as the head 17 and the wafer stage 16 are positioned accurately under the control of the control unit 3.

  The bonding head unit 50 (semiconductor chip transfer bonding means) receives the semiconductor chip 20 from the reversing head 17. As shown in FIGS. 1 and 5, the bonding head unit 50 is configured to move in the X direction by driving the motor 501 and to move in the Z direction by driving the motor 502. Further, the bonding head rotating motor 59 is configured to rotate the bonding head portion 50 in the R direction. A bonding tool 51 is attached to the lower end portion of the bonding head portion 50, and is sucked and held by the heater 52 by being sucked from the bonding tool air suction passage 53b.

  Therefore, the bonding tool 51 is configured to be replaceable according to the shape of the semiconductor chip 20. In addition, a hole is formed in the central portion of the bonding tool 51, and the semiconductor chip 20 is sucked and held below the bonding tool 51 by suction from the chip suction passage 53C. The bonding tool 51 can raise the temperature of the semiconductor chip 20 to 200 ° C. to 300 ° C. when the heater 52 is heated.

The heater 52 has a built-in electrode for heat generation and a temperature sensor for temperature management, which are wired by an electrode cable 52b and a temperature sensor cable 52a, respectively.
A bonding tool suction passage 53b and a chip suction passage 53c are piped to the heater mounting portion 53. Further, the air blown from the heater cooling air blowing port 53a is blown out from the heater cooling air blowing port 532 to rapidly cool the heater 52 and cool the heater mounting portion 53 so that heat is not transmitted to the force sensor 56. ing.
Further, the heated air in the vicinity of the bonding head 50 is configured to be blown out and diffused from the heater cooling air outlet 532.

In addition, a heat insulating material 54 is attached to the upper part of the heater attachment portion 53, and a heat insulating part 55 is installed on the upper portion of the heat insulating material 54. The heat insulation portion 55 has two cooling air inlets 551. The heat insulation portion 55 completely blocks the rise in the heat generated by the heater 52, and the force sensor 56 is configured so that the heat does not cause an error in the measured value. ing.
The force sensor 56 is configured to measure and memorize how much load is applied to the semiconductor chip 20 by the bonding head unit 50 via the force sensor cable 561 by the control unit 3. However, the heat of the heater 52 is transferred to the force sensor 56, and an accurate load measurement value may not be detected due to the thermal effect. Further, if the shaft 57 above the force sensor 56 is also thermally expanded, there is a risk that an error occurs in the controlled height of the bonding tool 51.

The heat insulation part 55 is configured to blow air from the heat insulation air blowing port 551 and blow it out from the heat insulation part air blowing port 552 so that the temperature of the heat insulation part 55 is kept constant and the surrounding warm atmosphere is quickly diffused. It has become.
The air blown into the heat insulating portion 55 uses cold air that is cooled by a cooling device and controlled at a constant temperature.

  The two-field camera 30 will be described with reference to FIGS. As shown in FIG. 6, the main body of the two-field camera 30 has a square shape, and a photographing hole 33 is vertically opened through the center of the front portion. Two cameras, a CCD camera 31 and a CCD camera 32, are connected to the rear of the two-field camera 30, and lenses and prisms (not shown) installed in the photographing circuit 34 configured inside the two-field camera 30 body. ), One CCD camera captures an image of the upper focal point 35, and the other CCD camera captures an image of the lower focal point 36. That is, it is configured to be able to simultaneously image in the vertical direction by two imaging means.

  The captured video is sent to the control unit 3 through the camera cables 311 and 321 and collated with the video stored in the control unit 3. If the captured video differs from the video stored in advance in the control unit 3, bonding is performed. The stage 60 (substrate mounting part), bonding head 50 (semiconductor chip transfer bonding means), etc. are controlled to move, and each motor is driven and adjusted so that the captured image and the stored image are the same. .

In the control unit 3, if the images of the upper focal point 35 and the lower focal point 36 are the same as the stored images, a predetermined position of the circuit board 18 is disposed at the lower focal point 36, and the semiconductor chip 20 is disposed at the upper focal point 35. It is determined that it is arranged at a predetermined position. That is, if the image picked up by the two-field camera 30 matches the image stored in the control unit 3, it can be determined that the circuit board 18 and the semiconductor chip 20 are precisely arranged on the focal axis 37 at a distance h.
If the image captured by the two-field camera 30 does not match the image stored in the control unit 3, the control unit 3 analyzes the image that does not match and calculates the deviation between the XYZ direction and the R direction and stores it in the control unit 3. The bonding head unit 50 and the bonding stage 60 are moved under the control of the control unit 3 so as to coincide with the image.

  After the control unit 3 determines that the circuit board 18 and the semiconductor chip 20 are arranged at predetermined positions in this way, the two-field camera 30 moves backward in the Y2 direction as shown in FIG. 4 to drive the motor 502. Then, the bonding head 50 can be lowered in the Z direction to bond the semiconductor chip 20 to the circuit board 18 by heat and pressure. When the bonding head 50 is lowered, the guide 501 moves along the side plate 503 so that it does not rotate in the R direction.

  With the above configuration, the control unit 3 controls the final positioning of the semiconductor chip 20 sucked and held by the bonding head 50 (semiconductor chip transfer bonding means) and the circuit board 18 placed on the bonding stage 60 (substrate mounting part). Is done. However, as shown in FIG. 7, when the two-field camera 30 changes the angle of the lens or the prism due to the thermal effect, the upper focal point 35 may become the upper focal point 351 moved due to the thermal effect.

Similarly, the lower focal point 36 may become the lower focal point 361 that has been moved by the influence of heat. Then, the control unit 3 moves the semiconductor chip 20 and the circuit board 18 to the positions of the upper and lower focal points 351 and 361 that have been erroneously recognized and moved due to the thermal effect, and lowers the bonding head 50 in the Z direction so as to perform heat and pressure bonding. As a result, it becomes impossible to bond the semiconductor chips 20 that allow only an error of about several μm, resulting in defective products.
In order to avoid such a state, the two-field camera 30 must be temperature-controlled so that the entire main body has a constant temperature.

The two-field camera 30 is provided with a plurality of temperature sensors 40a and 40b, and the temperature of each part is measured and sent to the control unit 3. If there is a temperature difference, cool air is blown from the air supply path (wind flow path) 38 in the vicinity of the temperature sensor 40 that senses a high temperature so that a cooling airflow is generated at the cooling outlet in the vicinity of the temperature sensor 40 where the sensed temperature is low. Controlled by the control unit 3.
That is, when the temperature sensor 40a senses a temperature higher than the temperature sensor 40b, the air is blown from the air supply path (wind flow port) 38a, and the control valve (control means) 39 from the air supply path end (wind flow port) 38b. It is constituted so that air may be emitted through.
These air supply path end portions 38a and 38b are control means for controlling the air flow direction by the control unit 3 controlling the control valve 39. .

FIG. 7 is constructed so that the states of the temperature sensors 40a, 40b photographing circuit 34 and air supply path 38 can be seen through. The air supply path 38 is created in a piped state as shown in FIG. 7, but the entire interior of the two-field camera 30 main body is a gap so that the air supply path end portions 38a and 38b are provided so that the entire air flow flows. You may comprise.
In addition, air blown from the P port of the control valve and passed through the two-field camera 30 is discharged through the control valve 39, or the discharge port is located near the control unit 3 in the lower part of the flip chip bonder body 1 or on the gantry 2 It can also be applied to cool other parts by discharging inside.

  Note that the two-field camera 30 is moved in the Y direction by the camera table 45, and advances between the circuit board 18 and the semiconductor chip 20 to take an image. Further, the camera table 46 can be moved in the X direction by driving the motor 461.

  In addition, the bonding stage 60 is heated to a constant temperature by the bonding stage heater 62, and the portion on which the circuit board 18 is precisely placed must maintain a constant height and level. Therefore, a bonding stage heat insulating material 61 is attached to the lower part of the bonding heater 62 so that heat is not transmitted, and the XY table 63 is configured to be deformed by the influence of heat so that no error occurs.

  The operation of the flip chip bonder device 1 configured as described above will be described. As shown in FIG. 2, the semiconductor chip 20 sucked and held by the reversing head 17 is reversed and sucked by the bonding tool 51 of the bonding head unit 50 and delivered. At this time, the bump 201 surface of the semiconductor chip 20 faces downward.

The bonding head unit 50 moves the semiconductor chip 20 to a predetermined position by driving the motor 501. At the same time, the XY table 63 is moved to move the substrate 18 so that a predetermined position of the substrate 18 is directly below the bonding head unit 50.
Next, the two-field camera 30 advances between the substrate 18 and the bonding tool 51 in the Y1 direction, the semiconductor chip 20 is imaged at the upper focal point 35, and the substrate 18 is imaged at the lower focal point 36.
When the semiconductor chip 20 is transferred from the reversing head 17 to the bonding tool 51, a fine deviation often occurs. Therefore, the direction of the semiconductor chip 20 can be corrected by rotating the bonding head portion 50 in the R direction by the bonding head rotating motor 59.

A predetermined position of the substrate 18 is imaged at the lower focal point 36 of the two-field camera 30, and the position and directionality of the semiconductor chip 20 are imaged at the upper focal point 35. If the images of the two focal points 35 and 36 are the same as those previously stored in the control unit 3, it is confirmed that the substrate 18 and the semiconductor chip 20 are correctly transferred at a predetermined distance h in a predetermined mounting state. .
If the image captured by the two-field camera 30 does not match the image stored in the control unit 3, the control unit 3 analyzes the image that does not match and calculates the deviation between the XYZ direction and the R direction and stores it in the control unit 3. The bonding head unit 50 and the bonding stage 60 are moved under the control of the control unit 3 so as to coincide with the image.

  Thereafter, as shown in FIG. 45, when the two-field camera 30 is pulled back in the Y2 direction, the bonding head unit 50 moves by a predetermined distance by driving the motor 502 and pressurizes the semiconductor chip 20 against the substrate 18. The pressure at the time of pressurization is measured by the force sensor 56 and controlled by the control unit 3 so as to be a predetermined pressure.

At the same time as the pressure is applied, the heater 52 is heated, and the temperature of the semiconductor chip 20 is increased from 200 ° C. to 300 ° C. via the bonding tool 51 to melt the bumps 201 and join them to predetermined positions on the substrate 18.
Next, air is blown from the heater cooling air blowing port 53a to rapidly cool the heater 52, and at the same time, the bonding tool 51 and the semiconductor chip 20 are cooled to complete the bonding of the semiconductor chip 20. Then, the suction from the chip suction air passage 53c is stopped, the semiconductor chip 20 is opened, the bonding head 20 is raised, and then the reversing head 17 moves to hold the next semiconductor chip 20 by suction.

  The above operations are repeated. After the circuit board 18 is accurately placed on the bonding stage 60, the circuit board 18 is kept at a constant temperature by the bonding stage heater 62 and heated. As a result, the atmosphere above the bonding stage 60 rises to a certain temperature.

  At the same time, the temperature of the XY table 63 and the like below the bonding stage 60 may rise, causing an error in the position of the bonding stage 60. In order to prevent this, a bonding stage heat insulating material 61 is installed under the bonding stage 60 so that the thermal effect is not conducted to the XY table 63.

Further, when the semiconductor chip 20 is bonded to the circuit board 18 by heat and pressure, the bonding tool 51 and the semiconductor chip 20 are heated to 200 ° C. or higher.
Therefore, the upper part of the bonding stage 60 is always in a constant temperature atmosphere. The two-field camera 20 that repeatedly advances into such a constant temperature atmosphere and repeats imaging is eventually affected by heat and becomes high temperature.
The two-field camera 20 is equipped with a plurality of temperature sensors 40a, 40b, and the temperature of each part of the two-field camera 20 is measured and transmitted to the control unit 3.

An air supply path 38 is formed inside the two-field camera 20, and the air supply path 38 (air circuit) forms a closed circuit coupled to the air supply path end portions 38a and 38b.
When the temperature sensors 40a and 40b are at the same temperature, the control unit 3 determines that air is blown from one of the air supply path end portions 38a and 38b and discharged from the other.

However, when the temperature sensor 40a is higher than the temperature sensor 40b, the control unit 3 controls the control valve 39 to connect the air supply path end 38a flowing in the vicinity of the temperature sensor 40a to the P port, and from the air supply path end 38a to the air The air is supplied so as to flow into the supply path step portion 38b.

Then, cold air hits the vicinity of the high temperature sensor 40a and the vicinity of the temperature sensor 40a is cooled. As described above, by controlling the air flow to the air supply path 38 (air circuit) so that the cold air first passes in the vicinity of the high temperature sensors 40a and 40b as described above, there is a temperature difference in the entire two-field camera 30. The lens and the prism provided in the photographing circuit 34 are configured not to be thermally changed by air cooling so as not to occur.
Conversely, when the temperature sensor 40b is higher than the temperature sensor 40a, air is supplied from the air supply path step part 38b to the air supply path step part 38a.

As a result, the entire two-field camera 30 is uniformly cooled and is not easily affected by heat, and prevents deformation due to a temperature difference. The movement of the shaft and the occurrence of fluctuation are prevented, and the upper focus 35 and the lower focus 36 which are initially set are always imaged, so that the production of defective products can be prevented.

Further, the heat generated by the bonding stage heater 62 of the bonding stage 60 and the heater 52 of the bonding head unit 50 creates a high-temperature atmosphere above the bonding stage 60. It is preferable to remove this atmosphere because it causes the largest influence on the two-field camera 30 that advances to the upper part of the bonding stage 60.

Therefore, the heat insulating part 55 is attached to the lower part of the force sensor 56 of the bonding head 50, and the air is blown from the heat insulating cooling air blowing port 551, and the cooling air is blown out from the heat insulating part cooling air blowing port 552 in all directions. As a result, the cooling air cooled the heat insulating portion 55 and formed an air chamber in the heat insulating portion 54 to enhance the heat insulating effect, thereby preventing the force sensor 56 from being affected by heat.

Further, the cooling air diffused the high temperature atmosphere above the bonding tool 60 to prevent the two-view camera 30 from being affected by heat.
Further, while the two-field camera 30 advances between the semiconductor chip 20 and the circuit board 18 and takes an image, the cold air discharged from the heat insulating part cooling air outlet 552 is the two-field camera 30, the X direction camera table 46, and the Y The direction camera table 45 is cooled so that it is less affected by heat.

The cooling air discharged from the heat insulating portion cooling air outlet 552 can prevent dust from adhering to the circuit board 18 by using an air that has passed through a filter and has been cleaned. The cooling mechanism of the two-field camera 30 and the cooling mechanism of the heat insulating portion 55 can produce the above synergistic effect.

Furthermore, the cooler is blown from the heater cooling air blowing port 53a and discharged from the heater cooling air blowing port 532, so that the heater 52 can be cooled rapidly. As a result, the semiconductor chip 20 and the circuit board 18 can be cooled to complete the bonding in a short time.
Note that, when the heater 52 is heated, the control unit 3 controls so as to stop the blowing of cold air from the heater cooling blowing port 53a.

Further, when the cool air passes through the heater mounting portion 53, the heater mounting portion 53 is cooled, and a room filled with air is formed in the heater mounting portion 53, so that the heat insulating effect can be enhanced.
The cool air blown from the heater cooling air blowing port 53a is blown in all directions from the heater cooling air blowing port 532 to diffuse the heat generated by the heater 52 so that the atmosphere in the vicinity of the heater 52 can be quickly brought to a constant temperature. Can be returned to.

As described above, the flip chip bonder device according to the present invention changes the airflow so that the entire two-field camera 30 is maintained at a constant temperature. The temperature of the space where the two-field camera 30 repeats moving is kept constant.

As a result, the two-field camera 30 is not affected by heat and can maintain the original accuracy even if it is operated for a long time.
Further, the air for maintaining the two-view camera 30 main body at a constant temperature can be reused for cooling other parts by making it a closed circuit.

And the air to keep the space in the vicinity of the two-view camera 30 at a constant temperature is cleaned and blown out using a filter, so that dust adheres to the semiconductor chip 20 and the circuit board 18 etc. Can be prevented.

The present invention can be applied not only to a flip chip bonder device but also to a precision component assembling device composed of various heating parts.

FIG. 2 is a view showing the flip chip bonder device 1 in a state where the reversing head 17 has taken the semiconductor chip 20 on the wafer 19. The overall view of the flip chip bonder device 1 shows a state where the semiconductor chip 20 is delivered from the reversing head 17 to the bonding head 50. FIG. 3 is an enlarged view showing a state in which a two-view camera 30 advances and measures between a bonding head unit 50 that holds a semiconductor chip 20 by suction and a substrate 18; FIG. 4 is an enlarged view showing a state in which the semiconductor chip 20 is bonded to the substrate 18 by heat and pressure by the bonding head unit 50 that holds the semiconductor chip 20 by suction. FIG. 5 is an enlarged view of the bonding head portion 50, and is a view in which the outside of the heat insulating portion 55 and the heater mounting portion 53 is made transparent. 2 is an enlarged view of a two-field camera 30. FIG. FIG. 3 is a diagram showing the air passage 38 in an easy-to-understand manner by describing the drafting symbol of the control valve 39 in a diagram in which the outside of the two-field camera 30 is made transparent. FIG. 6 is a diagram depicting the vicinity of a camera 94, a bonding head 91, and a bonding stage 90 in a conventional example.

Explanation of symbols

1
Flip chip bonder body
2
Stand
Three
Control unit
16 Wafer stand
161
motor
17
Reversing head
171
motor
172
motor
18
Circuit board
19
Wafer
20 Semiconductor chip
201 bump
30 2-field camera
31 CCD camera
311 Camera cable
32 CCD camera
321 camera cable
33 Shooting hole
34 Shooting circuit
35 Top focus
351 Upper focus moved
36 Bottom focus
361 Lower focal point moved
37 Focal axis
38 Air supply path
38a Air supply end
38b Air supply path end
39 Control valve
40a temperature sensor
40b temperature sensor
45
Y direction camera table
46
X direction camera table
461
motor
50
Bonding head
501 motor
502
motor
503
Side plate
504
guide
51 Bonding tool
52 Heater
52a Temperature sensor cable
52b electrode cable
53 Heater mounting
53a Heater cooling air inlet
53b Bonding tool suction inlet
53c Chip suction passage
532
Heater cooling air outlet
54 Insulation
55
Heat insulation
551
Heat insulation cooling air inlet
552
Insulation section cooling air outlet
56
Force sensor
561
Force sensor cable
57
shaft
58
belt
59
Bonding head rotation motor
60
Bonding stage
61
Bonding stage insulation
62
Bonding stage heater
63
XY table
90
Bonding stage (conventional)
91
Bonding head (conventional)
92
Chip (conventional)
93
Substrate (conventional)
94
Camera (conventional)
95
Supply path (conventional)

Claims (4)

A circuit board mounting part for mounting a circuit board and managing the circuit board at a constant temperature by means of constant temperature;
A semiconductor chip bonding means for heating and pressure bonding the semiconductor chip to the circuit board;
When the semiconductor chip bonding means is located at a mounting position, the semiconductor chip bonding means moves so as to be positioned between the substrate mounting portion and the semiconductor chip bonding means, and recognizes the mutual positional relationship between the circuit board and the semiconductor chip, 2 In a flip chip bonding apparatus equipped with a two-field camera configured to be able to simultaneously image in the vertical direction by two imaging means,
A plurality of temperature sensors provided in the two-field camera;
Air blowing means for air-cooling the two-field camera;
A wind passage with a plurality of doorways for cooling the two-field camera;
Cooling control means for controlling the flow direction of the cooling air flowing through the wind flow path, wherein the cooling control means has an air flow in the vicinity of the temperature sensor having a lower sensed temperature than an air flow outlet in the vicinity of the temperature sensor having a higher sensed temperature. A flip chip bonder characterized in that the temperature of the entire two-field camera is made uniform by controlling so that a cooling airflow is generated in the mouth. Air blown into the semiconductor chip bonding means, a heating means the cooling air passage which is configured to heat portion through the vicinity emitted from the vicinity of the lower end portion of the semiconductor chip bonding means of said heating means of said semiconductor chip joining means ,
A heat insulating air chamber that is attached to the semiconductor chip bonding means and has been blown to block the heat generated by the heating means of the semiconductor chip bonding means with the blown air,
The heating part overheated by the heating means is cooled by the heating means cooling passage, and the heat generated by the heating means by the heat insulating air chamber is prevented from conducting heat to the other part of the semiconductor chip bonding means and thermally expanding. In addition, the air blown into the heating means cooling air passage and the heat insulating air chamber was discharged from the semiconductor chip joining means , thereby causing air flow to diffuse the heat generated from the substrate mounting portion and the heating means. 2. The flip chip bonder device according to claim 1, wherein: 3. The flip chip bonder device according to claim 1, wherein the substrate mounting portion is heat-treated so that heat is not conducted downward. The air cleaned by the filter is blown into the heating means cooling air passage and the heat insulating air chamber and discharged from the semiconductor chip joining means so as to become an air flow, so that dust is generated on the circuit board and the semiconductor chip. 3. The flip chip bonder according to claim 1, wherein the flip chip bonder is prevented from adhering.

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