JPS5858357U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5858357U
JPS5858357U JP15239981U JP15239981U JPS5858357U JP S5858357 U JPS5858357 U JP S5858357U JP 15239981 U JP15239981 U JP 15239981U JP 15239981 U JP15239981 U JP 15239981U JP S5858357 U JPS5858357 U JP S5858357U
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor equipment
lead
heat sink
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15239981U
Other languages
Japanese (ja)
Inventor
明 山岸
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP15239981U priority Critical patent/JPS5858357U/en
Publication of JPS5858357U publication Critical patent/JPS5858357U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は従来及び本案の一実施例をパ　示す
横断面図である。 図中、１は放熱板、２４ま半導体素子、３はリー：　　
ド、３□〜３３はリード片、３ｓａは一端、４，５は：
　　金属細線である。FIGS. 1 and 2 are cross-sectional views showing a conventional example and an example of the present invention. In the figure, 1 is a heat sink, 24 is a semiconductor element, and 3 is a Lee:
3□~33 are lead pieces, 3sa is one end, 4 and 5 are:
It is a thin metal wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板に半導体素子を固定すると共に、半導体素子の電
極と一端が半導体素子の近傍に位置するリードとを金属
細線にて接続し、かつ半導体素子を含む主要部分を外装
したものにおいて、上記リードのうち、少なくとも１つ
のリードの端部を半導体素子上に延在させたことを特徴
とする牟導抹装置。A semiconductor element is fixed to a heat sink, an electrode of the semiconductor element is connected to a lead whose one end is located near the semiconductor element with a thin metal wire, and the main part including the semiconductor element is covered with an exterior. A wiping device characterized in that an end of at least one lead extends above a semiconductor element.
JP15239981U 1981-10-14 1981-10-14 semiconductor equipment Pending JPS5858357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15239981U JPS5858357U (en) 1981-10-14 1981-10-14 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15239981U JPS5858357U (en) 1981-10-14 1981-10-14 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5858357U true JPS5858357U (en) 1983-04-20

Family

ID=29945049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15239981U Pending JPS5858357U (en) 1981-10-14 1981-10-14 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5858357U (en)

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