JPS58115779A - Electrically connecting structure and method of electrically connecting same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a novel and improved
2) The connection method ≦ 2.

Conventionally, one of the methods is to connect the connecting terminals of a flat wire cable to the connecting terminals of two printed circuit boards by making a T-connection between the pull-out sustaining terminals of two printed circuit boards of the same type or different types, or to connect the connecting terminals of a flat wire cable to the connecting terminals of the printed circuit boards. As a result, a layer of a conductive organic polymer material made of a dispersed mixture of various conductive particles and short fibers (generally oriented) is interposed between the connection terminal portions consisting of parallel conductive paths. There is a known method for making a connection.

However, it is impossible to make all of the above-mentioned particles and short fibers the same particle size or the same length. Evil counter contact WjA
Between the terminal electrodes, conductive particles or conductive fibers with the lowest content of 10,000 C in the particle size or length distribution, or with large particle sizes or long lengths, are used.
Because of this, a highly reliable electrical connection can only be obtained where the density per connection is small and the area for connection between FtX1 is large, and as a result, the above-mentioned connection method does not increase the packaging density. It is unsuitable for small-gap terminal arrangement because there is a thermal expansion difference between the organic polymer material after curing and the conductive particles or AM short fibers contained therein.

The l# contact state was extremely unstable with respect to black change, and the reliability of the electrical connection was low.

The present invention relates to a new and improved dragon joint structure proposed to solve these disadvantages and shortcomings,
This #; between the distributing M terminal part on the circuit board and/or the connecting terminal part of the #;
Connection structure C, which is electrically connected through an insulating material made of a dispersed mixture of powder and granular material C: At least -1 of the above connection terminal parts can be connected to each other. The terminal electrode is made of a material having flexibility and/or a thermal transformation point of 250°C or less, and conductive powder contained in the organic polymer substance is embedded into the surface of the opposing terminal electrode. The present invention also provides a connection method for obtaining the electrical connection structure as described above,
This means that the terminal electrodes of at least one connection terminal part are made of a flexible material or a material having a thermal transformation point of 250°C or less. Between the parts, there is an insulating film made by dispersing conductive powder and granules in a sacrificial organic polymeric substance.
, the sheet-shaped molded body is arranged, and the temperature between the connecting terminals is 250°C.
Pressure is applied to the following temperature to cause the insulating material to plastically flow,
The method is characterized in that the toden powder is bitten into the surfaces of the opposing terminal electrodes and then cooled and hardened.

In the following, the present invention will be described in detail. The connection *a of the present invention is not only the connection on the same type of printed circuit board or different type of printed circuit board, but also the connection of each type of circuit component to these printed circuit boards @1: and the dissemination of components. Part 2 can also be applied to CH, IO packages, IC carriers, various other semiconductor devices or elements, or so-called circuit parts 1 circuit elements such as ceramic elements, among the parts referred to in the present invention. 2. Each N display f! of liquid crystal, EL, LED, etc. W1 or element, and even)? ``21 wire cables, etc. are included, and these components include those that have multiple lead wires or single poles, as well as those that consist of parallel conductive paths on the surface of the component. Both are included.

First, in the present invention, the lead-out connection terminal electrodes on various printed circuit boards and the discontinuous terminal electrodes of components are made of copper, aluminum, or nickel.

Phenolic resin, epoxy resin, bodaamide resin, composite reinforced with metal foil, paper, glass fiber and other fillers, etc.
Reinforced resin plates made of diallyl phthalate resin, polyimide resin, or modified cypress resin made by adding or combining other compounds, and laminated with films of triazine resin, polyimide, polyethylene terephthalate, etc. The conductive path obtained by etching or the g required for this conductive path
2. According to the above, tin, solder, metal plating is applied to the fortune of the Tokyo tramway, and the above-mentioned reinforced synthetic resin plate or film is etched with aluminum, copper, etc. after steaming to form a conductive path, or this conductive path l2. 8 made by plating similar to
$1 (=4) Consists of a conductive path coated with a conductive paste or conductive ink mixed with gold powder, carbonoplasty, graphite powder, etc. instead of the above plating.゛ □ ゛Usually, this is connected to the above connection terminal electrode on the surface of the circuit board or component. If it is made of paint film or copper foil, etc. and has a thickness of lG~40 pitch, if the adjacent gap is 100μ or more, it will be 'D'O.
It has a dielectric strength of 2000 Mg for 1 minute when -500 V is applied.

- 10,000,'X Invention 1: The electrically conductive organic polymer substance in

For example, bodaamide, polyethylene, polypropylene, polyvinyl acetate 4R trimethyl metaagurilate, -polyester, polyurethane, or copolymerization, copolymerization, or epoxy resin of these, etc.)~1
Enol resin, fI rylene resin, nitrile rubber, rubber
Chill rubber - rubber, νg non-rubber, thermoplastic resin, thermosetting resin, rubber-like material, etc. □21
1 or more of modified resins containing 1 or more, holatomeruto (selected from cosmetic compositions, viscous compositions, compositions, etc., and optionally hardening agents, stiffening agents, auxiliary agents thereof, % reinforcing fillers, pigments) .

It can contain stabilizers, titanium organic compounds 1, fogging agents, thickeners, etc. such as Vy compounds. Gold, silver, copper, aluminum 6, nickel, tungsten, titanium, cobalt, or alloys containing cholera, tungsten powder, titanium carbide, 1'; A thermosetting resin or a high-melting point thermoplastic is prepared by using powder or granules of a single conductive metal compound such as tsuke, rubor, carbonyl, or tin dioxide, or using the above-mentioned gold cormorant powder/granules or carbon black as an electrical property imparting agent. For example, 100% resin, 100% resin, epoxy resin, 6-1+ nylon resin, 6-1+ nylon resin, 6-1+ nylon resin, 6-1+ nylon resin, etc.

Reethylenete lefta”re”snoring, bokuamidoimide,
°.

Boda carbonate, bo, rear 7 tar, bog ether 6 le, boria relay, to, polyage g mouth 2 or 2 conductor etc. 2.

It is dispersed and blended to form an unformed body having a conductivity of 1O-6 to 10'' Ω, which is then crushed to form a π-shaped body.
Moreover, Kanji is -0.5 to 2 of powder or granular materials such as conductive organometallic compounds, conductive organic polymer substances, and artificial graphite.
From the particle size of 0007 g, for example, a 400 mesh bath average particle size of 7 m, xpm or more to a 325 mesh bath average particle size of 10 μm is selected. However, when dispersing and blending the conductive powder, the molten state of the organic polymer substance, the state of the solution to which a solvent has been added, the molten state of the bath, etc. Check the compatibility of the 11C solution in advance to prevent it from dissolving and swelling, and consider combining materials with low affinity. It is advisable to be careful when choosing.

Regarding the blending ratio of the conductive powder and granular material to the organic polymeric material G2 distributed above, the dispersion of the S-conductive powder and granular material C2 is the same as that of the organic polymeric material with sliding properties and the conductive material. In order to avoid imparting properties, the organic polymer @quality Zoo volume s (2 vs. 0.05 to 40 parts by volume,
Preferably, the resistance is 0.5 to 3Ω, and preferably 2 to 25Ω.゛This is because conductive powder #1 The smaller the particle size and the larger the distribution of small particles, the lower the mixing ratio can be. If the inverse C2 capacitance exceeds 40 parts, the connected structure will be obtained (-When heating and pressurizing, C2 chains between conductive particles are likely to occur; This is based on the reason that it is difficult to maintain insulation between adjacent terminal electrodes.

How can the organic polymeric material combined with s'git powder or granules be formed into a film or sheet (2) in the form of a film or a coating? Formed on the surface of the terminal to be seeded, this film or 4 Usually, the release paper is cut into two different shapes 1, and the release paper is peeled off before use. ! The thickness of the I film is larger than the maximum particle size of the S-conductive powder contained therein, and is at most 3 times, preferably at most 2 times, and preferably at most 1.5 times the maximum particle size. However, this is because if the thickness is too thick, the layer of insulating material will easily flow out from the terminal part during heat pressure (: 41 State 1: @, the number of conductive particles between the connected terminal electrodes) This is because there is a risk of decreasing the amount.

'', 1 The present invention: A film or sheet-like molded article or coating film made of a sliding organic polymer material containing conductive powder or granules can be formed at a temperature of 60 to 250°C. -jo
It is desirable that the adhesion performance is in the most activated state under the pressure of b/- (2. ffi flow occurs, so it is desirable that the adhesive performance is in the most activated state. - High temperature test feeling: It cannot withstand, and if it is directly above 25G℃, the organic polymer material flowing from the surface during the connection work under heating and pressure will be carbonized by contact with the air, and the electrical properties This is because there is a risk that the temperature will decrease and have an adverse effect on other electrical circuits, circuit elements, or parts placed nearby.
Even better! It is preferable that L<Hloo ~220°C.

Detailed embodiments of the present invention will be described below based on the attached figures.

Figure IIl■ shows a perspective view before the connection of two connected bodies, and Figure $2 shows the parallel sii* of the second electric 710 body of the present invention C, which is made by integrating these connected bodies. Figure 3 is a cross-sectional view taken along the direction perpendicular to the parallel conductive path t, and 10 in the figure is the lead-out connection terminal portion of the printed circuit board; '20r! Possible I
30 is a # connection terminal of a flat wire cable with II properties, and 30 is a V-) shape with a bonding organic polymer material.
It is a small piece made up of two numbers.

si@J ~ 3 Figure 2 Printed circuit board 11 hidden on the surface of a synthetic resin board made of phenol or the like with a thickness of L6, for example, two parallel lead terminal electrodes made of aluminum foil such as copper foil. The flat wire cable 21 is made by arranging 12 wires to prevent heat.

Surface C of a flexible film made of bodaester and boimide: Parallel conductive path (connection terminal electrode) 22'e made of gold 1III. Therefore, this connection terminal electrode 22 can be easily deformed by ≦2 deformations. It has flexibility. ml! IWJ ~ 11! Obtain the electrical connection structure shown in Figure 3 C2tz, si From the state shown in Figure mJ12! of the flat wire cable. The terminal 1120 is brought into close contact with the drawer connecting terminal portion 10 of the circuit board, and then a gold-plated lateral hotper is pressed and heated while the wire is heated to about 250°C. When the hot powder is π and the thermal conductivity is 78: hardness (JX8 K 6301) 20 par, the small piece of organic polymer material 30 plastically flows and the SS diagram Between the connecting terminal electrodes 120 as shown in C2,
Under the pressure of the trowel, an electric current is applied to the conductive powder 32 which is densely filled and bidispersed in the organic polymer material 31. The flat wire cable 21 and its connecting terminal electrode 22 are easily deformed due to their flexibility, and the above-mentioned conductive powder particles Despite the difference in particle size C2 of the bodies 32, more conductive powder can be involved in the electrical connection between the opposing connection terminal electrodes 12.22.

Press the heated iron over the upper part of the upper part.

After confirming the plastic flow of the organic polymer material after a certain period of time, check whether the trowel is the correct one. The adhesive organic polymer can be cooled and hardened to obtain the electrical connection structure of the present invention.

1j14I8I shows another embodiment of the electrical connection structure according to the X invention, which also has C on a hard substrate 11.
2. Output terminal electrode 12a made of copper foil or the like with conductive paste or ink coating 12b? The connecting terminal portion 10 of the printed circuit board provided and the
Printing of the printed circuit board 21 made by printing the connecting terminal electrodes 22'b made of 1-conductor ink! It is formed by adhesively connecting terminal wires 20, and here, more lW powder particles 82 having different particle sizes bite into both of the opposing disseminated terminal electrodes 12b and 22b to establish an electrical connection. has been achieved.

Figure 5 further shows two other embodiments.
In this case, a lead-out terminal electrode 12b made of a portable paste or ink is provided on a flexible substrate 11 made of Bossesterlade, etc., and a connection terminal s10 made of a flexible printed circuit grade and may be made of polyimide or the like. On a flexible base - a flexible printed base with flexible connection terminals 22 made of copper foil or the like? l! This is a connection structure with the 210 connection terminal section 20.

As explained above, in the connection structure of the present invention, C conductive powder is dispersed in an adhesive organic polymer material between the mm terminal portion on the printed circuit board and/or between the connection terminal portions of the eleven components. A connection structure C2 is electrically connected through an insulating material 1Ilit-.

Inside the surface of the connecting terminal electrode facing the 2N electric powder and granules
Since it is made of two pieces, even if the mini-particle size of each of the above conductive powder particles is different, is it more? Its practical value is great because it can participate in the electrical connection and thus achieve more reliable electrical dissemination.・

[Brief explanation of drawings]

The first cause ~ @31! ! J shows a typical implementation 8 of the survival structure of the present invention, and FIG. 1 is a perspective view of two membranes of the connection. A is a cross-sectional view along the parallel #1 conductor section 2 after the connection, and Figure s3 is a cross-sectional view along the direction intersecting the parallel conductive path fm. FIG. 4 is a cross-sectional view of another representative embodiment. 10.20--Connection terminal section. 11.21...Substrate. 12.22... Connection terminal electrode, 30... Heat sensitive organic polymer molded body. 31... Organic polymer substance, 82... Conductive powder. Figure 1 Figure 2 Figure 1 Figure 5

Claims (1)

[Claims] 1. Dissemination on the circuit board! Electrical conductivity is provided between the terminal portion and/or the connection terminal portion of the #1 component through a layer of an insulating material made by dispersing conductive powder in an adhesive organic polymer material.
3. In the connection structure formed by two disseminations, at least 10,000 connection terminal electrodes of the connection terminal portion are made of a flexible material and/or a material having a thermal transformation point of 250°C or less, and the above-mentioned organic An electrical connection structure characterized in that the terminal electrode surface area facing the sit-like powder particles contained in the polymeric substance is inlaid with two casings. □ 2. At least -10,000 terminal electrodes of the connecting terminals are made of a flexible material and/lπ is a material having a thermal transformation point of 250°C or less, and/or t; between the connecting terminals of the components. An insulating film or sheet-like molded body consisting of a dispersed mixture of ax molecular substance g:lI conductive powder and granules is disposed, and the temperature between the connecting terminals is t-2so℃.
Is the insulating material subjected to two pressurizations at a temperature above? Let it flow plastically. A method for continuous air dissemination, characterized in that the upper gripping powder is bitten into the surface of the opposing terminal electrode and then cooled and hardened.