JPS58110687A - 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法 - Google Patents

無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法

Info

Publication number
JPS58110687A
JPS58110687A JP57218241A JP21824182A JPS58110687A JP S58110687 A JPS58110687 A JP S58110687A JP 57218241 A JP57218241 A JP 57218241A JP 21824182 A JP21824182 A JP 21824182A JP S58110687 A JPS58110687 A JP S58110687A
Authority
JP
Japan
Prior art keywords
bath
gold
acid
plated
per
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57218241A
Other languages
English (en)
Japanese (ja)
Other versions
JPS614919B2 (https=
Inventor
オ−ガスタス・フレツチヤ−
ウイリアム・エル・モリア−テイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
American Chem & Refining Co
AMERIKAN CHEM ANDO RIFUAININGU CO Inc
Original Assignee
American Chem & Refining Co
AMERIKAN CHEM ANDO RIFUAININGU CO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Chem & Refining Co, AMERIKAN CHEM ANDO RIFUAININGU CO Inc filed Critical American Chem & Refining Co
Publication of JPS58110687A publication Critical patent/JPS58110687A/ja
Publication of JPS614919B2 publication Critical patent/JPS614919B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP57218241A 1981-12-14 1982-12-13 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法 Granted JPS58110687A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/330,706 US4396471A (en) 1981-12-14 1981-12-14 Gold plating bath and method using maleic anhydride polymer chelate
US330706 1994-10-28

Publications (2)

Publication Number Publication Date
JPS58110687A true JPS58110687A (ja) 1983-07-01
JPS614919B2 JPS614919B2 (https=) 1986-02-14

Family

ID=23290963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57218241A Granted JPS58110687A (ja) 1981-12-14 1982-12-13 無水マレイン酸重合体のキレ−トを使用する金めつき浴及び金めつき方法

Country Status (7)

Country Link
US (1) US4396471A (https=)
JP (1) JPS58110687A (https=)
CA (1) CA1211410A (https=)
CH (1) CH652150A5 (https=)
DE (1) DE3244092A1 (https=)
FR (1) FR2519031B1 (https=)
GB (1) GB2112397B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038337A (ja) * 1989-06-06 1991-01-16 Fujitsu Ltd 半導体装置の製造方法
WO2017175428A1 (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
HU191879B (en) * 1983-09-09 1987-04-28 Videoton Elekt Vallalat Processor fot the galvanic speretaion of hard gold plating for electronic purposes
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4758630A (en) * 1986-10-27 1988-07-19 Richardson-Vicks Inc. Denture stabilizing zinc and strontium salts of ave/ma copolymer
US4857159A (en) * 1987-03-25 1989-08-15 The Standard Oil Company Electrodeposition recovery method for metals in polymer chelates
DE10340197B3 (de) * 2003-08-27 2004-09-23 Siemens Ag Verfahren zum elektrochemischen Abscheiden von Metallen aus einem Elektrolyt
JP4945193B2 (ja) * 2006-08-21 2012-06-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 硬質金合金めっき液
EP2848714B1 (en) * 2008-04-22 2016-11-23 Rohm and Haas Electronic Materials LLC Method of replenishing indium ions in indium electroplating compositions
DE102013109400A1 (de) * 2013-08-29 2015-03-05 Harting Kgaa Kontaktelement mit Goldbeschichtung
WO2023041972A1 (en) 2021-09-16 2023-03-23 Galvasols P & S High-speed pure gold electroforming/electroplating bath

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE23514E (en) * 1930-06-26 1952-06-24 Artificial resins and process of
DE801312C (de) * 1949-05-05 1950-11-23 Pforzheimer Elektrizitäts - Gesellschaft m. b. H., Pforzheim Verfahren zur elektrolvtischen Abscheidung von Gold und Goldlegierungen
US2752281A (en) * 1953-06-01 1956-06-26 Rohm & Haas Iodine dissolved in aqueous solutions of maleic anhydride-vinyl ether copolymers
US3087853A (en) * 1956-07-02 1963-04-30 Gen Aniline & Film Corp Water soluble compositions consisting essentially of iodine and a water soluble oxygen containing polymer
BE570261A (https=) * 1957-08-13
US3149057A (en) * 1959-04-27 1964-09-15 Technic Acid gold plating
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
GB1052380A (https=) * 1964-09-08
FR1478334A (fr) * 1965-05-06 1967-04-28 Inst Francais Du Petrole Catalyseur à base de métaux bivalents, sa préparation et ses applications, en particulier pour la polymérisation d'éthers cycliques
US3407126A (en) * 1965-12-23 1968-10-22 Ibm Electrodeposition of magnetic thin films
US3424597A (en) * 1966-04-08 1969-01-28 Shipley Co Electroless nickel plating
US3672969A (en) * 1970-10-26 1972-06-27 Lea Ronal Inc Electrodeposition of gold and gold alloys
US3856638A (en) * 1971-08-20 1974-12-24 Auric Corp Bright gold electroplating bath and method of electroplating bright gold
US3716463A (en) * 1971-08-30 1973-02-13 Auric Corp Bright gold alloy electroplating bath and process
BE791401A (fr) * 1971-11-15 1973-05-14 Monsanto Co Compositions et procedes electrochimiques
US3787463A (en) * 1972-02-24 1974-01-22 Oxy Metal Finishing Corp Amine gold complex useful for the electrodeposition of gold and its alloys
US3770596A (en) * 1972-07-21 1973-11-06 Auric Corp Gold plating bath for barrel plating operations
CH555894A (fr) * 1972-08-10 1974-11-15 Oxy Metal Industries Corp Utilisation de derives organophosphores dans les bains sulfitiques pour l'electrodeposition de l'or et des alliages d'or.
US3864222A (en) * 1973-03-26 1975-02-04 Technic Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore
US3902977A (en) * 1973-12-13 1975-09-02 Engelhard Min & Chem Gold plating solutions and method
US4076598A (en) * 1976-11-17 1978-02-28 Amp Incorporated Method, electrolyte and additive for electroplating a cobalt brightened gold alloy
US4186064A (en) * 1977-07-20 1980-01-29 Technic, Inc. Method and electrolyte for electrodeposition of bright gold and gold alloys
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH038337A (ja) * 1989-06-06 1991-01-16 Fujitsu Ltd 半導体装置の製造方法
WO2017175428A1 (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液
JP2017186627A (ja) * 2016-04-07 2017-10-12 小島化学薬品株式会社 硬質金めっき溶液

Also Published As

Publication number Publication date
FR2519031B1 (fr) 1986-05-23
DE3244092A1 (de) 1983-06-23
DE3244092C2 (https=) 1989-03-02
US4396471A (en) 1983-08-02
GB2112397A (en) 1983-07-20
GB2112397B (en) 1985-09-18
CH652150A5 (de) 1985-10-31
JPS614919B2 (https=) 1986-02-14
CA1211410A (en) 1986-09-16
FR2519031A1 (fr) 1983-07-01

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