JPS58102124A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPS58102124A
JPS58102124A JP20183981A JP20183981A JPS58102124A JP S58102124 A JPS58102124 A JP S58102124A JP 20183981 A JP20183981 A JP 20183981A JP 20183981 A JP20183981 A JP 20183981A JP S58102124 A JPS58102124 A JP S58102124A
Authority
JP
Japan
Prior art keywords
glass
bonding layer
filler
glass bonding
130mum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20183981A
Other languages
Japanese (ja)
Inventor
Shozo Sato
Shunji Shiromizu
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP20183981A priority Critical patent/JPS58102124A/en
Publication of JPS58102124A publication Critical patent/JPS58102124A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14Housings
    • G01L19/147Details about the mounting of the sensor to support or covering means

Abstract

PURPOSE:To prevent poor hermetical sealing and adverse effect of strain due to residual stress, by using a glass material which includes a filler and has a reversible property with respect to the repetition of the heating and fusing, as a bonding agent which bonds a pressure sensitive pellet and a seat. CONSTITUTION:The pressure sensitive pellet 11 comprising a piezoelectric resistance gage 13 and a diaphragm 12 is bonded to the silicon seat 14 by a glass bonding layer 15. A filler is mixed in the glass bonding layer 15. The glass bonding layer 15 comprises a glass material which has reversible property with respect to repetition of heating and fusing and has a thickness of 50mum-130mum. In this constitution, the thickness l of the glass bonding layer 15a is specified within the range of 50mum-130mum. Therefore decrease in bonding force due to the size of the filler element and the breakdown of the diaphragm due to the rise T of the glass bonding layer can be prevented.
JP20183981A 1981-12-15 1981-12-15 Semiconductor pressure sensor Pending JPS58102124A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20183981A JPS58102124A (en) 1981-12-15 1981-12-15 Semiconductor pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20183981A JPS58102124A (en) 1981-12-15 1981-12-15 Semiconductor pressure sensor

Publications (1)

Publication Number Publication Date
JPS58102124A true JPS58102124A (en) 1983-06-17

Family

ID=16447741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20183981A Pending JPS58102124A (en) 1981-12-15 1981-12-15 Semiconductor pressure sensor

Country Status (1)

Country Link
JP (1) JPS58102124A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266930A (en) * 1985-05-22 1986-11-26 Omron Tateisi Electronics Co Pressure sensor
JPS63228038A (en) * 1985-11-26 1988-09-22 Nippon Denso Co Ltd Semiconductor pressure transducer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61266930A (en) * 1985-05-22 1986-11-26 Omron Tateisi Electronics Co Pressure sensor
JPS63228038A (en) * 1985-11-26 1988-09-22 Nippon Denso Co Ltd Semiconductor pressure transducer

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