JPS63228038A - Semiconductor pressure transducer - Google Patents

Semiconductor pressure transducer

Info

Publication number
JPS63228038A
JPS63228038A JP28012286A JP28012286A JPS63228038A JP S63228038 A JPS63228038 A JP S63228038A JP 28012286 A JP28012286 A JP 28012286A JP 28012286 A JP28012286 A JP 28012286A JP S63228038 A JPS63228038 A JP S63228038A
Authority
JP
Japan
Prior art keywords
pedestal
stress
collar
clamping
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28012286A
Other languages
Japanese (ja)
Inventor
Osamu Ina
Osamu Ito
Yukihiro Katou
Hiroshi Okada
Yoshifumi Watanabe
Iwao Yokomori
Original Assignee
Nippon Denso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP26698785 priority Critical
Application filed by Nippon Denso Co Ltd filed Critical Nippon Denso Co Ltd
Publication of JPS63228038A publication Critical patent/JPS63228038A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To fix a pedestal and to reduce the cost of a semiconductor pressure transducer by clamping and fixing the pedestal through a metallic collar and pressing it from below with an O ring.
CONSTITUTION: The pedestal 2 is formed in a projection shape to weaken a stress from a pedestal fixation side to a sensor chip 3. Further, the collar 6 is pressed from the top surface of the bottom part 2A of the pedestal 2 and a clearance 7 is provided between the bottom part 2A and collar 6. Then a stress due to clamping is applied only to the bottom part 2A perpendicularly to eliminate a radial stress. Consequently, an external stress and a thermal stress applied to the chip 3 are reduced in combination with the projection structure. Further, the squeezing margin of the O ring 4 can be prescribed by the size and shape of the collar 6, and sealing performance by the ring 4 is obtained. Further, when a clamping part 1c is clamped, no impact force is applied to the pedestal 2, which is prevented from breaking. The pedestal 2 is therefore fixed and the cost in mass-production is reducible.
COPYRIGHT: (C)1988,JPO&Japio
JP28012286A 1985-11-26 1986-11-24 Semiconductor pressure transducer Pending JPS63228038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26698785 1985-11-26

Publications (1)

Publication Number Publication Date
JPS63228038A true JPS63228038A (en) 1988-09-22

Family

ID=17438484

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28012286A Pending JPS63228038A (en) 1985-11-26 1986-11-24 Semiconductor pressure transducer

Country Status (1)

Country Link
JP (1) JPS63228038A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925826A (en) * 1997-07-23 1999-07-20 Mitsubishi Denki Kabushiki Kaisha Integrated pressure sensor unit and solenoid valve unit
US7627943B2 (en) 2004-03-29 2009-12-08 Nagano Keiki Co., Ltd. Method of manufacturing a pressure sensor
US10451512B2 (en) 2017-03-27 2019-10-22 Nidec Tosok Corporation Oil pressure sensor attachment structure
US10591378B2 (en) * 2016-08-03 2020-03-17 Nidec Tosok Corporation Pressure sensor attachment structure
US10648878B2 (en) 2017-03-30 2020-05-12 Nidec Tosok Corporation Oil pressure sensor attachment structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58731A (en) * 1981-06-25 1983-01-05 Matsushita Electric Ind Co Ltd Electrostatic capacity type pressure sensor
JPS58102124A (en) * 1981-12-15 1983-06-17 Toshiba Corp Semiconductor pressure sensor
JPS5979825A (en) * 1982-10-29 1984-05-09 Matsushita Electric Ind Co Ltd Pressure sensor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58731A (en) * 1981-06-25 1983-01-05 Matsushita Electric Ind Co Ltd Electrostatic capacity type pressure sensor
JPS58102124A (en) * 1981-12-15 1983-06-17 Toshiba Corp Semiconductor pressure sensor
JPS5979825A (en) * 1982-10-29 1984-05-09 Matsushita Electric Ind Co Ltd Pressure sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5925826A (en) * 1997-07-23 1999-07-20 Mitsubishi Denki Kabushiki Kaisha Integrated pressure sensor unit and solenoid valve unit
US7627943B2 (en) 2004-03-29 2009-12-08 Nagano Keiki Co., Ltd. Method of manufacturing a pressure sensor
US10591378B2 (en) * 2016-08-03 2020-03-17 Nidec Tosok Corporation Pressure sensor attachment structure
US10451512B2 (en) 2017-03-27 2019-10-22 Nidec Tosok Corporation Oil pressure sensor attachment structure
US10648878B2 (en) 2017-03-30 2020-05-12 Nidec Tosok Corporation Oil pressure sensor attachment structure

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