JPS5799358A - Film-forming device for semiconductor wafer - Google Patents
Film-forming device for semiconductor waferInfo
- Publication number
- JPS5799358A JPS5799358A JP17425280A JP17425280A JPS5799358A JP S5799358 A JPS5799358 A JP S5799358A JP 17425280 A JP17425280 A JP 17425280A JP 17425280 A JP17425280 A JP 17425280A JP S5799358 A JPS5799358 A JP S5799358A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- head
- side wall
- scattered
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE: To exactly prevent a semiconductor wafer from readherence of scattered liquid by inclining at a specific angle the side wall part of a receiving plate to collect liquid scattered from the upper end part of the wafer by centrifugal force resulting from the rotation of spinner head.
CONSTITUTION: A semiconductor wafer 11 is horizontally placed on a spinner head 12 and then adsorbed on the head 12 by sucking air in the direction of arrow (a). Under the condition, an appropriate amount of a liquid substance, e.g.. a wax 13, is dropped on the center of the surface of the wafer 11, and then the head 12 is turned at a revolving number determined from the viscosity of the wax 13 or its desired thickness in such a way as to uniformly coat on the surface of the wafer 11. In this case, excessive wax 13 scattered about the surrounding collides with the side wall 14S of the receiving plate 14 but flows out toward an outlet port 14D without reflecting toward the wafer 11 because the inclined angle θ of the side wall 14S to the wafer 11 is 30° or less.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17425280A JPS5799358A (en) | 1980-12-10 | 1980-12-10 | Film-forming device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17425280A JPS5799358A (en) | 1980-12-10 | 1980-12-10 | Film-forming device for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5799358A true JPS5799358A (en) | 1982-06-21 |
Family
ID=15975370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17425280A Pending JPS5799358A (en) | 1980-12-10 | 1980-12-10 | Film-forming device for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5799358A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166216A (en) * | 2000-11-29 | 2002-06-11 | Shibaura Mechatronics Corp | Spin treatment apparatus and anti-scattering cup |
-
1980
- 1980-12-10 JP JP17425280A patent/JPS5799358A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002166216A (en) * | 2000-11-29 | 2002-06-11 | Shibaura Mechatronics Corp | Spin treatment apparatus and anti-scattering cup |
| JP4571299B2 (en) * | 2000-11-29 | 2010-10-27 | 芝浦メカトロニクス株式会社 | Spin processing device and splash prevention cup |
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