JPS5779645A - Division of semiconductor wafer - Google Patents
Division of semiconductor waferInfo
- Publication number
- JPS5779645A JPS5779645A JP15497980A JP15497980A JPS5779645A JP S5779645 A JPS5779645 A JP S5779645A JP 15497980 A JP15497980 A JP 15497980A JP 15497980 A JP15497980 A JP 15497980A JP S5779645 A JPS5779645 A JP S5779645A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- pressed
- semicylindrical
- pelletization
- pinched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Abstract
PURPOSE:To enhance the efficiency of pelletization by a method wherein a soft and slippery sheet is provided on one side face of a semiconductor wafer with dicing lines being formed thereon, while an assembled body being pinched and held with flexible magnetic sheets is pressed with pressure against a semicylindrical jig. CONSTITUTION:On one side face of the semiconductor wafer 1 being formed with the dicing lines in mutually rectangular two directions on the surface thereof, and being formed with a functional region inside and having metalized layer providing with magnetizability on the back, the thin and soft and slippery sheet 7 of parchment paper, etc., is interposed, and after it is pinched and held with the flexible magnetic sheets 6, 8 of magnetic rubber, etc., it is pressed with pressure against the semicylindrical jig 9 using a press tool 10, and it is rotated at 90 deg. and is pressed with pressure again in succession to divide the wafer into the pellets. Accordingly, the pelletization can be performed efficiently, and when the degree of inflection is large, split of pellet can be reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15497980A JPS5779645A (en) | 1980-11-04 | 1980-11-04 | Division of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15497980A JPS5779645A (en) | 1980-11-04 | 1980-11-04 | Division of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5779645A true JPS5779645A (en) | 1982-05-18 |
Family
ID=15596050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15497980A Pending JPS5779645A (en) | 1980-11-04 | 1980-11-04 | Division of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5779645A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171717A (en) * | 1990-05-25 | 1992-12-15 | International Business Machines Corporation | Method for batch cleaving semiconductor wafers and coating cleaved facets |
-
1980
- 1980-11-04 JP JP15497980A patent/JPS5779645A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5171717A (en) * | 1990-05-25 | 1992-12-15 | International Business Machines Corporation | Method for batch cleaving semiconductor wafers and coating cleaved facets |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5779645A (en) | Division of semiconductor wafer | |
JPS5441075A (en) | Conveying device between atmospheric pressure and vacuum | |
JPS56148842A (en) | Dividing method for semiconductor wafer | |
JPS52155494A (en) | Process for w orking parallel plane of wafer | |
JPS5250344A (en) | Process for concentrating latexes | |
JPS5743811A (en) | Vacuum press adhesion apparatus | |
JPS52156551A (en) | Semiconductor wafer breaking method | |
JPS5614710A (en) | Armoring method for elastic surface wave element | |
JPS53112673A (en) | Mask alignment method in semiconductor device manufacturing process and photo mask used for its execution | |
JPS5327050A (en) | Bonding method of polarized plate to active element | |
JPS5247376A (en) | Process for production of resin sealed type semiconductor device | |
JPS5662373A (en) | Semiconductor directional pressure transformer | |
JPS5695566A (en) | Polishing device of tube inner face | |
JPS57170695A (en) | Production and apparatus for magazine with ribbon diaphragm | |
GB1035360A (en) | A method of forming patterned elastomeric sheet | |
JPS56154032A (en) | Laminating method | |
JPS5662751A (en) | Grinding device | |
JPS5494577A (en) | Device for adhering wafer | |
JPS5756214A (en) | Method and device for terminal cutting of synthetic resin molding | |
JPS57199618A (en) | Method of giving contoured pattern | |
JPS57208355A (en) | Preparation of packing or the like for duct | |
JPS5713463A (en) | Original handling device | |
JPS5734346A (en) | Division of semiconductor wafer | |
JPS55107428A (en) | Manufacture of laminated body | |
JPS57178659A (en) | Grinding method of wafer |