JPS5775456A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5775456A
JPS5775456A JP55152547A JP15254780A JPS5775456A JP S5775456 A JPS5775456 A JP S5775456A JP 55152547 A JP55152547 A JP 55152547A JP 15254780 A JP15254780 A JP 15254780A JP S5775456 A JPS5775456 A JP S5775456A
Authority
JP
Japan
Prior art keywords
layer
pad
connecting metal
metal layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55152547A
Other languages
Japanese (ja)
Other versions
JPS6322470B2 (en
Inventor
Shusaku Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55152547A priority Critical patent/JPS5775456A/en
Publication of JPS5775456A publication Critical patent/JPS5775456A/en
Publication of JPS6322470B2 publication Critical patent/JPS6322470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To avoid generation of unnecessary electric resistance even though the surface of a metal layer is oxidized, by forming the semiconductor to which opposing connecting metal layers are connected by a metal which can be readily alloyed with the connecting metal layer. CONSTITUTION:On a connecting metal pad 7 comprising Al which is formed on an Si substrate 4, the connecting metal layer 8 comprising In is formed via a metal layer 11 comprising Zn. Said metal layer 8 and a connecting metal pad 6 comprising In formed on the compound semiconductor substrate 1 are formed. The pad 7 and the layer 11 are connected, and the layer 11 and the layer 8 formed thereon are connected, with the alloy state being formed, respectively. In this case, Zn is readily alloyed with Al even though the surface of the Al pad is oxidized, and the electric resistance becomes much lower than that in the case In is directly deposited on the Al layer.
JP55152547A 1980-10-29 1980-10-29 Semiconductor device Granted JPS5775456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152547A JPS5775456A (en) 1980-10-29 1980-10-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152547A JPS5775456A (en) 1980-10-29 1980-10-29 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5775456A true JPS5775456A (en) 1982-05-12
JPS6322470B2 JPS6322470B2 (en) 1988-05-12

Family

ID=15542839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152547A Granted JPS5775456A (en) 1980-10-29 1980-10-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5775456A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336744A (en) * 1989-07-03 1991-02-18 Matsushita Electric Ind Co Ltd Packaging of radiation detector

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375766A (en) * 1976-12-16 1978-07-05 Sharp Corp Mounting construction for semiconductor element
JPS53141575A (en) * 1977-05-17 1978-12-09 Seiko Epson Corp Semiconductor device
JPS5430787A (en) * 1977-08-12 1979-03-07 Fujitsu Ltd Infrared-ray detector

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375766A (en) * 1976-12-16 1978-07-05 Sharp Corp Mounting construction for semiconductor element
JPS53141575A (en) * 1977-05-17 1978-12-09 Seiko Epson Corp Semiconductor device
JPS5430787A (en) * 1977-08-12 1979-03-07 Fujitsu Ltd Infrared-ray detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0336744A (en) * 1989-07-03 1991-02-18 Matsushita Electric Ind Co Ltd Packaging of radiation detector

Also Published As

Publication number Publication date
JPS6322470B2 (en) 1988-05-12

Similar Documents

Publication Publication Date Title
GB1526717A (en) Process for forming an aluminium containing conductor structure
JPS5548954A (en) Manufacturing of film carrier
JPS5775456A (en) Semiconductor device
JPS55108757A (en) Semiconductor device
JPS5287360A (en) Semiconductor device
JPS54146960A (en) Semiconductor device
JPS539489A (en) Production of semiconductor device
JPS56118345A (en) Tape carrier
JPS57109350A (en) Semiconductor device
JPS5732654A (en) Semiconductor integrated circuit device
JPS5726450A (en) Back surface electrode structure for semiconductor integrated circuit device
JPS56142659A (en) Semiconductor device
JPS5245270A (en) Semiconductor device
JPS5667965A (en) Semiconductor device
JPS57128039A (en) Semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS5679439A (en) Semiconductor device
JPS56148836A (en) Forming method for back electrode of semiconductor wafer
JPS57109347A (en) Semiconductor device
JPS538058A (en) Production of semiconductor device
JPS56116642A (en) Semiconductor device
JPS56100431A (en) Semiconductor device
JPS56118375A (en) Semiconductor displacement convertor
JPS5419690A (en) Electrode of semiconductor devices
JPS57106155A (en) Semiconductor device