JPS5775446A - Microwave device module - Google Patents

Microwave device module

Info

Publication number
JPS5775446A
JPS5775446A JP55152506A JP15250680A JPS5775446A JP S5775446 A JPS5775446 A JP S5775446A JP 55152506 A JP55152506 A JP 55152506A JP 15250680 A JP15250680 A JP 15250680A JP S5775446 A JPS5775446 A JP S5775446A
Authority
JP
Japan
Prior art keywords
terminal
resistor
electrode
brazed
ground surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55152506A
Other languages
Japanese (ja)
Other versions
JPS6043022B2 (en
Inventor
Kinshiro Kosemura
Eiji Yamamura
Norio Hidaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55152506A priority Critical patent/JPS6043022B2/en
Publication of JPS5775446A publication Critical patent/JPS5775446A/en
Publication of JPS6043022B2 publication Critical patent/JPS6043022B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)

Abstract

PURPOSE:To obtain stable gain characteristics over the broad range by connecting a DC terminal of the module to a circuit that absorbs a microwave signal which is induced on said terminal. CONSTITUTION:At a location adjacent to a DC bias terminal 9 which is formed on an insulating substrate 3, a chip shaped resistor 10 comprising a film resistor R which is insulated from a ground surface G by a dielectric substrate C is brazed on said ground surface G comprising a metal substrate 2. A chip shaped capacitor 12 is brazed 13 via a lower electrode 12. The terminal 9 and one electrode 14 of the resistor 10 are connected by a thin wire 17 and the other electrode 15 of the resistor 10 and one electrode 16 of a capacitor 12 are connected by the thin wire 17. The AC at the terminal 19 is grounded.
JP55152506A 1980-10-30 1980-10-30 Microwave device module Expired JPS6043022B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152506A JPS6043022B2 (en) 1980-10-30 1980-10-30 Microwave device module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152506A JPS6043022B2 (en) 1980-10-30 1980-10-30 Microwave device module

Publications (2)

Publication Number Publication Date
JPS5775446A true JPS5775446A (en) 1982-05-12
JPS6043022B2 JPS6043022B2 (en) 1985-09-26

Family

ID=15541939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152506A Expired JPS6043022B2 (en) 1980-10-30 1980-10-30 Microwave device module

Country Status (1)

Country Link
JP (1) JPS6043022B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196631A2 (en) * 1985-04-01 1986-10-08 Yu Zhiwei Integrable high frequency, wide band and superlinear amplifier and its fabrication
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
GB2389458A (en) * 2002-03-27 2003-12-10 Toshiba Kk Microwave integrated circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196631A2 (en) * 1985-04-01 1986-10-08 Yu Zhiwei Integrable high frequency, wide band and superlinear amplifier and its fabrication
EP0196631A3 (en) * 1985-04-01 1988-08-03 Yu Zhiwei Integrable high frequency, wide band and superlinear amplifier and its fabrication
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
GB2389458A (en) * 2002-03-27 2003-12-10 Toshiba Kk Microwave integrated circuit
GB2389458B (en) * 2002-03-27 2004-08-11 Toshiba Kk Microwave integrated circuit

Also Published As

Publication number Publication date
JPS6043022B2 (en) 1985-09-26

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