JPS5775299A - Joining solder for copper pipe - Google Patents

Joining solder for copper pipe

Info

Publication number
JPS5775299A
JPS5775299A JP15084480A JP15084480A JPS5775299A JP S5775299 A JPS5775299 A JP S5775299A JP 15084480 A JP15084480 A JP 15084480A JP 15084480 A JP15084480 A JP 15084480A JP S5775299 A JPS5775299 A JP S5775299A
Authority
JP
Japan
Prior art keywords
solder
temp
copper pipe
titled
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15084480A
Other languages
Japanese (ja)
Other versions
JPS5754238B2 (en
Inventor
Takashi Saito
Seiichi Kaneko
Hiroaki Sawahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AOKI METAL
AOKI METAL KK
AOKI METARU KK
Original Assignee
AOKI METAL
AOKI METAL KK
AOKI METARU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AOKI METAL, AOKI METAL KK, AOKI METARU KK filed Critical AOKI METAL
Priority to JP15084480A priority Critical patent/JPS5775299A/en
Publication of JPS5775299A publication Critical patent/JPS5775299A/en
Publication of JPS5754238B2 publication Critical patent/JPS5754238B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

PURPOSE:To prevent deterioration of strength and a separation or a generation of cracks in a part joined with titled solder, even if the environmental temp. changed, by preparing a specific composition consisting of an Sb, an In and an Sn for said solder. CONSTITUTION:Titled joining solder for copper pipes has a composition consisting of 1.0-6.0% Sb, 0.05-2.0% In, and residue Sn. In the case of using said solder, the deterioration of mechanical strength and the separation or generation of crack in jointed parts are prevented, even if the temp. is changed from low temp. environment (about -50 deg.C) up to high temp. environment. And, further, the workability of joint operation for copper pipe has not great difference in comparison with the general Sn-Pb solder.
JP15084480A 1980-10-29 1980-10-29 Joining solder for copper pipe Granted JPS5775299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15084480A JPS5775299A (en) 1980-10-29 1980-10-29 Joining solder for copper pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15084480A JPS5775299A (en) 1980-10-29 1980-10-29 Joining solder for copper pipe

Publications (2)

Publication Number Publication Date
JPS5775299A true JPS5775299A (en) 1982-05-11
JPS5754238B2 JPS5754238B2 (en) 1982-11-17

Family

ID=15505608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15084480A Granted JPS5775299A (en) 1980-10-29 1980-10-29 Joining solder for copper pipe

Country Status (1)

Country Link
JP (1) JPS5775299A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6283430U (en) * 1985-11-15 1987-05-28

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869871A (en) * 1988-03-17 1989-09-26 Toyota Motor Corporation Pb-Sn-Sb-In solder alloy

Also Published As

Publication number Publication date
JPS5754238B2 (en) 1982-11-17

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