JPS577142A - Marking method of resin-sealed semiconductor device - Google Patents

Marking method of resin-sealed semiconductor device

Info

Publication number
JPS577142A
JPS577142A JP8015680A JP8015680A JPS577142A JP S577142 A JPS577142 A JP S577142A JP 8015680 A JP8015680 A JP 8015680A JP 8015680 A JP8015680 A JP 8015680A JP S577142 A JPS577142 A JP S577142A
Authority
JP
Japan
Prior art keywords
resin
sealed
over
releasing agent
flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8015680A
Other languages
Japanese (ja)
Other versions
JPS6245833B2 (en
Inventor
Yuji Miura
Michitoshi Sera
Tetsuo Ito
Atsushi Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8015680A priority Critical patent/JPS577142A/en
Publication of JPS577142A publication Critical patent/JPS577142A/en
Publication of JPS6245833B2 publication Critical patent/JPS6245833B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/08—Surface shaping of articles, e.g. embossing; Apparatus therefor by flame treatment ; using hot gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Duplication Or Marking (AREA)

Abstract

PURPOSE:To enhance the adhesivity between the mark ink and the surface of a sealed resin by burning a die releasing agent exuding over the surface of the sealed resin with a flame holding heat within the range of maintaining the appearance properly in a pretreatment. CONSTITUTION:In a process of marking the surface of a sealed resin, a pretreatment is used to burn a die releasing agent exuding over the surface thereof. In this process, a flame is produced from 5-10l/hr of hydrogen gas with a burner 0.1- 0.3mm. in internal diameter. This flame is moved linearly at the rate of 5-15mm./sec under the temperatue of 600-800 deg.C over the surface of the resin sealed device tilted by 45 deg. about 10mm. separated from the tip of the burner. This removes the die releasing agent such as C, H, O and N from the surface by burning, thereby permitting a mark ink to adhere to the activated resin surface. Thus, a firm marking is printed thereon.
JP8015680A 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device Granted JPS577142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8015680A JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8015680A JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS577142A true JPS577142A (en) 1982-01-14
JPS6245833B2 JPS6245833B2 (en) 1987-09-29

Family

ID=13710431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8015680A Granted JPS577142A (en) 1980-06-16 1980-06-16 Marking method of resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS577142A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178142A (en) * 1984-09-25 1986-04-21 Sanyo Electric Co Ltd Printing for molded semiconductor device
US4931853A (en) * 1986-05-20 1990-06-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140463A (en) * 1978-04-21 1979-10-31 Nec Corp Process method for resin-sealed semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54140463A (en) * 1978-04-21 1979-10-31 Nec Corp Process method for resin-sealed semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6178142A (en) * 1984-09-25 1986-04-21 Sanyo Electric Co Ltd Printing for molded semiconductor device
US4931853A (en) * 1986-05-20 1990-06-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6245833B2 (en) 1987-09-29

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