JPS5769770A - Preliminary soldering method of outside leads - Google Patents

Preliminary soldering method of outside leads

Info

Publication number
JPS5769770A
JPS5769770A JP14574880A JP14574880A JPS5769770A JP S5769770 A JPS5769770 A JP S5769770A JP 14574880 A JP14574880 A JP 14574880A JP 14574880 A JP14574880 A JP 14574880A JP S5769770 A JPS5769770 A JP S5769770A
Authority
JP
Japan
Prior art keywords
semiconductor device
solder
outside leads
supporting arm
fulcrum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14574880A
Other languages
Japanese (ja)
Inventor
Shinichi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14574880A priority Critical patent/JPS5769770A/en
Publication of JPS5769770A publication Critical patent/JPS5769770A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To perform preliminary soldering of outside leads of a semiconductor device by immersion soldering generating no defect of bridge or lump, etc., by a method wherein the semiconductor device is drawn up from the liquid surface of solder shaking off solder applying vibration to the semiconductor device. CONSTITUTION:The semiconductor device 10 is holded by a supporting arm 21. The supporting arm 21 is made to move upward and downward by action of a fulcrum 22, a Z axis pulse motor 23 and an up-and-down motion cam 24, and the outside leads 11 are immersed in the melted solder 13 and are drawn up. Vibration to be applied to the semiconductor device is given by coupling a sliding plate 25 supporting the supporting arm 21 by the fulcrum 22 to a vibrator 26. The method to draw up the semiconductor device from the solder liquid surface scraping off the solder between the outside leads using a comb type plate, or to draw up the device blowing off the solder blasting heated inert gas may be also used.
JP14574880A 1980-10-20 1980-10-20 Preliminary soldering method of outside leads Pending JPS5769770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14574880A JPS5769770A (en) 1980-10-20 1980-10-20 Preliminary soldering method of outside leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14574880A JPS5769770A (en) 1980-10-20 1980-10-20 Preliminary soldering method of outside leads

Publications (1)

Publication Number Publication Date
JPS5769770A true JPS5769770A (en) 1982-04-28

Family

ID=15392234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14574880A Pending JPS5769770A (en) 1980-10-20 1980-10-20 Preliminary soldering method of outside leads

Country Status (1)

Country Link
JP (1) JPS5769770A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937747U (en) * 1982-08-31 1984-03-09 富士通株式会社 semiconductor equipment
JPS61232650A (en) * 1985-04-09 1986-10-16 Tamura Seisakusho Co Ltd Soldering method and device thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5937747U (en) * 1982-08-31 1984-03-09 富士通株式会社 semiconductor equipment
JPS6334286Y2 (en) * 1982-08-31 1988-09-12
JPS61232650A (en) * 1985-04-09 1986-10-16 Tamura Seisakusho Co Ltd Soldering method and device thereof

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