JPS5764945A - Inspecting device for electronic parts - Google Patents
Inspecting device for electronic partsInfo
- Publication number
- JPS5764945A JPS5764945A JP55140452A JP14045280A JPS5764945A JP S5764945 A JPS5764945 A JP S5764945A JP 55140452 A JP55140452 A JP 55140452A JP 14045280 A JP14045280 A JP 14045280A JP S5764945 A JPS5764945 A JP S5764945A
- Authority
- JP
- Japan
- Prior art keywords
- inspecting
- drum
- temperature
- fed
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To enhance the reliability of an inspection for an electronic part and to prevent the variation in the directivity of the part and the damaging the mark of the part by containing the part on a plurality of rails laid on the peripheral surface of a truncated drum in a constant-temperature bath, heating the path therein and inspecting the characteristics of the part in the bath and sorting the parts. CONSTITUTION:A drum 2 radially arranged with part containing rails 3 is supported at the center by a rotationary shaft 22 in an operating temperature inspecting device, and is arranged together with an inspecting mechanism 20 and a sorting mechanism 34 in a constant-temperature bath 1. The part 5 in a magazine 7 is fed from an opening 5 slidably into a supply chute 4 in the oven 1, and the parts 5 are separated and contained by an isolating mechanism 12 in the amount on each rail. When the drum 1 rotates approximately one revolution, the part 5 is heated to the prescribed temperature, and when it is fed to the position before one pitch from the supply unit, a stopper 29 is opened, and the part is fed to the inspecting mechanism 20. The part 5 is sorted to the mechanism 34 in accordance with the propriety of the inspected result of the characteristics of the part, and is sorted to any of the chutes 35, 36 out of the oven to be conveyed. Since it is inspected at the treating temperature, the inspecting reliability can be enhanced, and since the part is not inverted by the rotation of the drum, it can prebent the damage of the mark and the variation in the directivity of the part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55140452A JPS5764945A (en) | 1980-10-09 | 1980-10-09 | Inspecting device for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55140452A JPS5764945A (en) | 1980-10-09 | 1980-10-09 | Inspecting device for electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5764945A true JPS5764945A (en) | 1982-04-20 |
Family
ID=15268943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55140452A Pending JPS5764945A (en) | 1980-10-09 | 1980-10-09 | Inspecting device for electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5764945A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122378A (en) * | 1983-12-05 | 1985-06-29 | Toshiba Corp | Testing device for temperature cycle of semiconductor device |
-
1980
- 1980-10-09 JP JP55140452A patent/JPS5764945A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122378A (en) * | 1983-12-05 | 1985-06-29 | Toshiba Corp | Testing device for temperature cycle of semiconductor device |
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