JPS5764944A - Forming and bonding methods for ball of metallic wire - Google Patents

Forming and bonding methods for ball of metallic wire

Info

Publication number
JPS5764944A
JPS5764944A JP13983280A JP13983280A JPS5764944A JP S5764944 A JPS5764944 A JP S5764944A JP 13983280 A JP13983280 A JP 13983280A JP 13983280 A JP13983280 A JP 13983280A JP S5764944 A JPS5764944 A JP S5764944A
Authority
JP
Japan
Prior art keywords
ball
wire
arc
forming
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13983280A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161534B2 (enExample
Inventor
Hiroshi Miyake
Akira Sato
Motoji Taki
Satoshi Ogura
Tomio Iizuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13983280A priority Critical patent/JPS5764944A/ja
Publication of JPS5764944A publication Critical patent/JPS5764944A/ja
Publication of JPS6161534B2 publication Critical patent/JPS6161534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP13983280A 1980-10-08 1980-10-08 Forming and bonding methods for ball of metallic wire Granted JPS5764944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13983280A JPS5764944A (en) 1980-10-08 1980-10-08 Forming and bonding methods for ball of metallic wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13983280A JPS5764944A (en) 1980-10-08 1980-10-08 Forming and bonding methods for ball of metallic wire

Publications (2)

Publication Number Publication Date
JPS5764944A true JPS5764944A (en) 1982-04-20
JPS6161534B2 JPS6161534B2 (enExample) 1986-12-26

Family

ID=15254525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13983280A Granted JPS5764944A (en) 1980-10-08 1980-10-08 Forming and bonding methods for ball of metallic wire

Country Status (1)

Country Link
JP (1) JPS5764944A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60110471A (ja) * 1983-11-21 1985-06-15 Konishiroku Photo Ind Co Ltd 感熱記録ヘッド
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
JPS61231726A (ja) * 1985-04-05 1986-10-16 Mitsubishi Electric Corp ワイヤボンデイング用ボ−ルの形成方法
US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
WO2002027781A1 (en) * 2000-09-29 2002-04-04 Asm Technology Singapore Pte Ltd. A ball forming process
CN114643394A (zh) * 2022-05-19 2022-06-21 深圳市大族封测科技股份有限公司 球焊电流控制方法、控制器及efo系统

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
JPS60110471A (ja) * 1983-11-21 1985-06-15 Konishiroku Photo Ind Co Ltd 感熱記録ヘッド
JPS61231726A (ja) * 1985-04-05 1986-10-16 Mitsubishi Electric Corp ワイヤボンデイング用ボ−ルの形成方法
US5095187A (en) * 1989-12-20 1992-03-10 Raychem Corporation Weakening wire supplied through a wire bonder
WO2002027781A1 (en) * 2000-09-29 2002-04-04 Asm Technology Singapore Pte Ltd. A ball forming process
CN114643394A (zh) * 2022-05-19 2022-06-21 深圳市大族封测科技股份有限公司 球焊电流控制方法、控制器及efo系统

Also Published As

Publication number Publication date
JPS6161534B2 (enExample) 1986-12-26

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