JPS576424A - Magnetic head and its manufacture - Google Patents
Magnetic head and its manufactureInfo
- Publication number
- JPS576424A JPS576424A JP7848680A JP7848680A JPS576424A JP S576424 A JPS576424 A JP S576424A JP 7848680 A JP7848680 A JP 7848680A JP 7848680 A JP7848680 A JP 7848680A JP S576424 A JPS576424 A JP S576424A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- groove
- magnetic head
- front gap
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/1272—Assembling or shaping of elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
PURPOSE:To manufacture a magnetic head which is large in bonding strength and excellent in gap accuracy, by providing a notched part and an alloy bonded layer between the lower end of a front gap of a magnetic head core, and the winding window. CONSTITUTION:To the inside surface 16 of a front gap side of a winding groove 12 provided on one surface of a sendast wafer 11 made of an alloy magnetic material, and the inside of a bonding material filling groove 13, bonding materials 14, 15 are made to stick so as to be heaped up from one surface of wafer 11, and after that, a groove 17 is provided on the front gap side of the winding groove 12. Subsequently, the inside of this groove 17 is filled with a heat-resisting inorganic adhesive agent 18, and after is has become dry, the adhesive agent 18 is solidified by means of heat treatment. Subsequently, one surface of this wafer 11 is polished to a mirror surface, and after that, it is butted with the other wafer 19, is heated up to a temperature of a melting point of higher of the bonding materials 14, 15, the wafers are made to adhere so as to be unified, are brought to slicing, and the processing for prescribed thickness and the surface processing for contacting with a tape are executed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7848680A JPH0227725B2 (en) | 1980-06-10 | 1980-06-10 | JIKIHETSUDOOYOBISONOSEIZOHOHO |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7848680A JPH0227725B2 (en) | 1980-06-10 | 1980-06-10 | JIKIHETSUDOOYOBISONOSEIZOHOHO |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS576424A true JPS576424A (en) | 1982-01-13 |
JPH0227725B2 JPH0227725B2 (en) | 1990-06-19 |
Family
ID=13663303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7848680A Expired - Lifetime JPH0227725B2 (en) | 1980-06-10 | 1980-06-10 | JIKIHETSUDOOYOBISONOSEIZOHOHO |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0227725B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59161508U (en) * | 1983-04-12 | 1984-10-29 | パイオニア株式会社 | magnetic head |
-
1980
- 1980-06-10 JP JP7848680A patent/JPH0227725B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59161508U (en) * | 1983-04-12 | 1984-10-29 | パイオニア株式会社 | magnetic head |
Also Published As
Publication number | Publication date |
---|---|
JPH0227725B2 (en) | 1990-06-19 |
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