JPS5763833A - Fabrication of semicondutor device - Google Patents

Fabrication of semicondutor device

Info

Publication number
JPS5763833A
JPS5763833A JP13937380A JP13937380A JPS5763833A JP S5763833 A JPS5763833 A JP S5763833A JP 13937380 A JP13937380 A JP 13937380A JP 13937380 A JP13937380 A JP 13937380A JP S5763833 A JPS5763833 A JP S5763833A
Authority
JP
Japan
Prior art keywords
lead frame
wire bonding
atmosphere
bonding process
during
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13937380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410092B2 (enrdf_load_stackoverflow
Inventor
Toshihiro Kato
Kazuhide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13937380A priority Critical patent/JPS5763833A/ja
Publication of JPS5763833A publication Critical patent/JPS5763833A/ja
Publication of JPS6410092B2 publication Critical patent/JPS6410092B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP13937380A 1980-10-07 1980-10-07 Fabrication of semicondutor device Granted JPS5763833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13937380A JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13937380A JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Publications (2)

Publication Number Publication Date
JPS5763833A true JPS5763833A (en) 1982-04-17
JPS6410092B2 JPS6410092B2 (enrdf_load_stackoverflow) 1989-02-21

Family

ID=15243805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13937380A Granted JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Country Status (1)

Country Link
JP (1) JPS5763833A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JPS63314839A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JPS63314839A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置

Also Published As

Publication number Publication date
JPS6410092B2 (enrdf_load_stackoverflow) 1989-02-21

Similar Documents

Publication Publication Date Title
IE831279L (en) Resin-sealed semiconductor devices
JPS5623759A (en) Resin-sealed semiconductor device and manufacture thereof
JPS5763833A (en) Fabrication of semicondutor device
JPS57112055A (en) Integrated circuit package
JPS57173948A (en) Manufacture of semiconductor device
JPS5724554A (en) Semiconductor device
JPS57133653A (en) Resin sealed type semiconductor device
JPS54129880A (en) Manufacture for semiconductor device
JPS54161271A (en) Semiconductor device
JPS54134560A (en) Resin-sealed semiconductor device
JPS5753951A (ja) Handotaisochinokumitatehoho
JPS57178352A (en) Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JPS53135579A (en) Liquid sealing semiconductor device
JPS56148852A (en) Semiconductor device
JPS5710253A (en) Semiconductor device
JPS5742152A (en) Resin sealed type semiconductor and manufacture thereof
JPS5624956A (en) Resin-sealed semiconductor device
JPS5772337A (en) Semiconductor device
JPS6435921A (en) Manufacture of semiconductor device
JPS567453A (en) Manufacture of semiconductor device
JPS57194553A (en) Semiconductor device
JPS6481254A (en) Package for semiconductor device
JPS6480031A (en) Manufacture of resin sealed semiconductor device
JPS57133639A (en) Manufacture of semiconductor device
JPS5793553A (en) Semiconductor device