JPS5760096A - Injection plating device - Google Patents
Injection plating deviceInfo
- Publication number
- JPS5760096A JPS5760096A JP13596380A JP13596380A JPS5760096A JP S5760096 A JPS5760096 A JP S5760096A JP 13596380 A JP13596380 A JP 13596380A JP 13596380 A JP13596380 A JP 13596380A JP S5760096 A JPS5760096 A JP S5760096A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- plating
- flow
- plated
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- 238000002347 injection Methods 0.000 title abstract 3
- 239000007924 injection Substances 0.000 title abstract 3
- 230000000873 masking effect Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To provide an injection plating device which does not particularly require masking on a material to be plated by disposing a guide body serving also as a restrictor with apertures between a nozzle and the plating object of leaving a slight distance from both.
CONSTITUTION: Only the necessary soln. flow out of the injection plating soln. flow 14 ejected from a nozzle 1a is passed through the 1st aperture 16 and is applied onto the surface 13 of a plating object 4a opposite to the nozzle. This soln. flow 14 is applied onto the 13 and at this same instant, its direction is changed and is flowed out in a laminar state toward the direction A on the top surface of a guide body 15 serving also as a restrictor along said body 15. Next, the stable liquid surface 19 of the plating soln. 18 changed of the flow is brought in contact with the surface 13 alone, and is flowed without contact with a side face 20. Hence, only the part 5a to be plated of the object 4a is plated without masking the side face 20.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13596380A JPS5760096A (en) | 1980-09-30 | 1980-09-30 | Injection plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13596380A JPS5760096A (en) | 1980-09-30 | 1980-09-30 | Injection plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5760096A true JPS5760096A (en) | 1982-04-10 |
JPS6332877B2 JPS6332877B2 (en) | 1988-07-01 |
Family
ID=15163938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13596380A Granted JPS5760096A (en) | 1980-09-30 | 1980-09-30 | Injection plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5760096A (en) |
-
1980
- 1980-09-30 JP JP13596380A patent/JPS5760096A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6332877B2 (en) | 1988-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57163576A (en) | Ink jet exciter | |
JPS5760096A (en) | Injection plating device | |
GB1388468A (en) | Atomizing nozzle | |
ATE118373T1 (en) | DEVICE FOR RELEASING A LIQUID. | |
JPS5760095A (en) | Method and device for injection plating | |
DE3361952D1 (en) | Orifice valve for an ultrasonic liquid atomizer | |
JPS57101657A (en) | Apparatus for wiping molten plating | |
JPS55107481A (en) | Liquid jet recording device | |
JPS51120414A (en) | Spray nozzle | |
JPS5516725A (en) | Soldering device | |
JPS5710927A (en) | Cleaning device | |
JPS56164872A (en) | Nozzle for ink jet device | |
JPS5730570A (en) | Injector for two-liquid adhesive | |
JPS52145809A (en) | Variable flux nozzle | |
JPS5345238A (en) | Ink supply device for ink jet printer | |
JPS5710364A (en) | Nozzle suited for spraying of high viscosity liquid | |
JPS5310112A (en) | Supersonic atomizer | |
JPS53110372A (en) | Resin dispenser nozzle | |
JPS57110691A (en) | Spot plating device | |
ES8403215A1 (en) | Particle-analysing device | |
JPS5640713A (en) | Electromagnetic type flowmeter | |
JPS5516491A (en) | Semiconductor device | |
JPS56150833A (en) | Method for application of solder | |
JPS57140886A (en) | Partial plating device | |
JPS53122650A (en) | Soldering method and device therefor |