JPS53110372A - Resin dispenser nozzle - Google Patents
Resin dispenser nozzleInfo
- Publication number
- JPS53110372A JPS53110372A JP2477577A JP2477577A JPS53110372A JP S53110372 A JPS53110372 A JP S53110372A JP 2477577 A JP2477577 A JP 2477577A JP 2477577 A JP2477577 A JP 2477577A JP S53110372 A JPS53110372 A JP S53110372A
- Authority
- JP
- Japan
- Prior art keywords
- dispenser nozzle
- resin dispenser
- nozzle
- resin
- securing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Nozzles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a coating film of a uniform thickness, by providing a heater near the nozzle aperture part and securing an optimum coating viscosity for the resin right before jet through the nozzle.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2477577A JPS53110372A (en) | 1977-03-09 | 1977-03-09 | Resin dispenser nozzle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2477577A JPS53110372A (en) | 1977-03-09 | 1977-03-09 | Resin dispenser nozzle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53110372A true JPS53110372A (en) | 1978-09-27 |
Family
ID=12147538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2477577A Pending JPS53110372A (en) | 1977-03-09 | 1977-03-09 | Resin dispenser nozzle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53110372A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182531U (en) * | 1987-05-15 | 1988-11-24 | ||
JP2006261354A (en) * | 2005-03-17 | 2006-09-28 | Ricoh Co Ltd | Resin discharge nozzle, resin sealing method, and electronic component package body |
-
1977
- 1977-03-09 JP JP2477577A patent/JPS53110372A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63182531U (en) * | 1987-05-15 | 1988-11-24 | ||
JP2006261354A (en) * | 2005-03-17 | 2006-09-28 | Ricoh Co Ltd | Resin discharge nozzle, resin sealing method, and electronic component package body |
JP4641837B2 (en) * | 2005-03-17 | 2011-03-02 | 株式会社リコー | Resin discharge nozzle and resin sealing method |
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