JPS575887Y2 - - Google Patents
Info
- Publication number
- JPS575887Y2 JPS575887Y2 JP1976113137U JP11313776U JPS575887Y2 JP S575887 Y2 JPS575887 Y2 JP S575887Y2 JP 1976113137 U JP1976113137 U JP 1976113137U JP 11313776 U JP11313776 U JP 11313776U JP S575887 Y2 JPS575887 Y2 JP S575887Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976113137U JPS575887Y2 (US20100056889A1-20100304-C00004.png) | 1976-08-23 | 1976-08-23 | |
| US06/039,820 US4536786A (en) | 1976-08-23 | 1979-05-17 | Lead electrode connection in a semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976113137U JPS575887Y2 (US20100056889A1-20100304-C00004.png) | 1976-08-23 | 1976-08-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5330873U JPS5330873U (US20100056889A1-20100304-C00004.png) | 1978-03-16 |
| JPS575887Y2 true JPS575887Y2 (US20100056889A1-20100304-C00004.png) | 1982-02-03 |
Family
ID=14604485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976113137U Expired JPS575887Y2 (US20100056889A1-20100304-C00004.png) | 1976-08-23 | 1976-08-23 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4536786A (US20100056889A1-20100304-C00004.png) |
| JP (1) | JPS575887Y2 (US20100056889A1-20100304-C00004.png) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619632A (en) * | 1979-07-26 | 1981-02-24 | Seiko Epson Corp | Lead terminal |
| JPS6142842U (ja) * | 1985-07-31 | 1986-03-19 | シャープ株式会社 | 半導体装置の位置合せ装置 |
| US4795077A (en) * | 1988-05-23 | 1989-01-03 | Motorola Inc. | Bonding method and apparatus |
| US4948030A (en) * | 1989-01-30 | 1990-08-14 | Motorola, Inc. | Bond connection for components |
| DE69114217T2 (de) * | 1990-08-22 | 1996-04-11 | Nec Corp | Träger für filmmontierte Halbleiter-Vorrichtung. |
| JPH04307943A (ja) * | 1991-04-05 | 1992-10-30 | Mitsubishi Electric Corp | 半導体装置 |
| US5907187A (en) * | 1994-07-18 | 1999-05-25 | Kabushiki Kaisha Toshiba | Electronic component and electronic component connecting structure |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3374537A (en) * | 1965-03-22 | 1968-03-26 | Philco Ford Corp | Method of connecting leads to a semiconductive device |
| US3450965A (en) * | 1966-05-28 | 1969-06-17 | Sony Corp | Semiconductor having reinforced lead structure |
| US3871014A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform solder wettable areas on the substrate |
| US3871015A (en) * | 1969-08-14 | 1975-03-11 | Ibm | Flip chip module with non-uniform connector joints |
| BE755950A (fr) * | 1969-09-11 | 1971-03-09 | Philips Nv | Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation |
| GB1363431A (en) * | 1970-11-24 | 1974-08-14 | Lucas Industries Ltd | Method of electrically connecting a semiconductor chip to a sub strate |
| US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
| US3689803A (en) * | 1971-03-30 | 1972-09-05 | Ibm | Integrated circuit structure having a unique surface metallization layout |
| FR2299724A1 (fr) * | 1975-01-29 | 1976-08-27 | Honeywell Bull Soc Ind | Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres |
| US4010488A (en) * | 1975-11-21 | 1977-03-01 | Western Electric Company, Inc. | Electronic apparatus with optional coupling |
-
1976
- 1976-08-23 JP JP1976113137U patent/JPS575887Y2/ja not_active Expired
-
1979
- 1979-05-17 US US06/039,820 patent/US4536786A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5330873U (US20100056889A1-20100304-C00004.png) | 1978-03-16 |
| US4536786A (en) | 1985-08-20 |
