JPS5753953A - - Google Patents

Info

Publication number
JPS5753953A
JPS5753953A JP56116286A JP11628681A JPS5753953A JP S5753953 A JPS5753953 A JP S5753953A JP 56116286 A JP56116286 A JP 56116286A JP 11628681 A JP11628681 A JP 11628681A JP S5753953 A JPS5753953 A JP S5753953A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56116286A
Inventor
Herumuuto Kuno Hansu
Haidaa Aruberuto
Waitoru Gyuntaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5753953A publication Critical patent/JPS5753953A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H—ELECTRICITY
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
    • H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Led Device Packages (AREA)
JP56116286A 1980-07-28 1981-07-24 Pending JPS5753953A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803028570 DE3028570A1 (de) 1980-07-28 1980-07-28 Verfahren zum kontaktieren von halbleiterbauelementen

Publications (1)

Publication Number Publication Date
JPS5753953A true JPS5753953A (ja) 1982-03-31

Family

ID=6108284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56116286A Pending JPS5753953A (ja) 1980-07-28 1981-07-24

Country Status (4)

Country Link
JP (1) JPS5753953A (ja)
DE (1) DE3028570A1 (ja)
FR (1) FR2487578B1 (ja)
GB (1) GB2081029A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147073A (ja) * 1983-02-12 1984-08-23 Tokuo Saito 帯電防止剤
US5338062A (en) * 1991-09-11 1994-08-16 Toyota Jidosha Kabushiki Kaisha Side collision sensor system for side airbag apparatus
US5392024A (en) * 1991-06-14 1995-02-21 Toyota Jidosha Kabushiki Kaisha Collision detection system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248695A1 (de) * 1982-12-30 1984-07-05 Siemens AG, 1000 Berlin und 8000 München Elektrisches bauelement mit insbesondere zwei drahtfoermigen zuleitungen
DE4143006A1 (de) * 1991-12-24 1993-07-01 Minnesota Mining & Mfg Kontaktanordnung fuer ein elektrisches bauteil und verfahren zur herstellung
DE19602591A1 (de) * 1996-01-25 1997-07-31 Braun Ag Kontaktelement für einen elektrischen Leiter

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4419720Y1 (ja) * 1966-02-24 1969-08-23
JPS5036703U (ja) * 1973-07-27 1975-04-17
JPS5019359B2 (ja) * 1971-11-24 1975-07-05
JPS5418374A (en) * 1977-07-12 1979-02-10 Teijin Ltd Frozen food wrapper

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3096136A (en) * 1957-10-31 1963-07-02 Kent Mfg Corp Wire-gripping part of electric terminal member
NL297690A (ja) * 1962-10-09
DE6607090U (de) * 1966-08-05 1971-02-04 Hitachi Ltd Elektrode
DE1966001C3 (de) * 1967-09-12 1974-06-06 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement. Ausscheidung aus: 1911915
US3562404A (en) * 1968-12-31 1971-02-09 Rca Corp Semiconductor device
GB1397399A (en) * 1971-12-09 1975-06-11 Lucas Electrical Co Ltd Semi-conductor devices
US4143936A (en) * 1977-12-01 1979-03-13 Bunker Ramo Corporation Electrical contact

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4419720Y1 (ja) * 1966-02-24 1969-08-23
JPS5019359B2 (ja) * 1971-11-24 1975-07-05
JPS5036703U (ja) * 1973-07-27 1975-04-17
JPS5418374A (en) * 1977-07-12 1979-02-10 Teijin Ltd Frozen food wrapper

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147073A (ja) * 1983-02-12 1984-08-23 Tokuo Saito 帯電防止剤
US5392024A (en) * 1991-06-14 1995-02-21 Toyota Jidosha Kabushiki Kaisha Collision detection system
US5338062A (en) * 1991-09-11 1994-08-16 Toyota Jidosha Kabushiki Kaisha Side collision sensor system for side airbag apparatus

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FR2487578A1 (fr) 1982-01-29
DE3028570A1 (de) 1982-03-04
GB2081029A (en) 1982-02-10
FR2487578B1 (fr) 1986-01-10
DE3028570C2 (ja) 1990-05-17

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