GB2081029A - Method of Contacting Electrical Components - Google Patents

Method of Contacting Electrical Components Download PDF

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Publication number
GB2081029A
GB2081029A GB8123100A GB8123100A GB2081029A GB 2081029 A GB2081029 A GB 2081029A GB 8123100 A GB8123100 A GB 8123100A GB 8123100 A GB8123100 A GB 8123100A GB 2081029 A GB2081029 A GB 2081029A
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United Kingdom
Prior art keywords
contacting
wire
connection member
contacting wire
component
Prior art date
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Withdrawn
Application number
GB8123100A
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Siemens AG
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Siemens AG
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Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of GB2081029A publication Critical patent/GB2081029A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Led Device Packages (AREA)

Abstract

A method of contacting an electrical component (particularly a semiconductor component) by means of a contacting wire (6) to a connecting member (2), wherein the connecting wire is connected in form- locking manner by pinching, clamping or wedging. The wire may be pinched, clamped or wedged in a cut or groove (7) in a surface of the member (2) by the application of force (8, 9) to the sides of the cut or groove (7), or between the member (2) and a folded- over part thereof. The contacting wire (6) is preferably pinched so as to produce a cold weld to the member (2). <IMAGE>

Description

SPECIFICATION Method of Contacting Electrical Components The present invention relates to a method of contacting electrical components particularly semiconductor components, in which a contacting wire leads between the component, e.g. a semiconductor body and an electrical contact, particularly an electrical connection member.
Previously semiconductor components which are arranged on metal surfaces which have been electroplated with a nobler metal, for example, with gold, silver, nickel or aluminium, or have been otherwise specially prepared (for example freed from oxide) have been electrically connected by thermo-compression or by the application of ultrasonics. In such processes, high requirements are made as regards the surface of the connection member in the region of the connection point: this surface has to be as flat as possible and should not exhibit any striations; in addition the surface must be free from any impurities.
It is, therefore an object of the present invention to provide a method of contacting electrical components which allows a contacting wire to be electrically connected to an electrical connection member without incurring any special expense.
According to the invention, there is provided a method of contacting an electrical component by means of a contacting wire leading between the body of the component and an electrical contact, wherein the contacting wire at or near its end remote from the component is connected to the contact in form-locking manner by a pinching, clamping or jamming action.
The term "pinching" as applied to the connecting wire is intended to mean a method in which the contacting wire is gripped so hard that deformation of the wire takes place, whilst "clamping" is intended to mean a method in which the wire is gripped without any appreciable deformation occurring.
Preferably, the electrical contact is in the form of a metal terminal member.
Thus, in the preferred form of the invention the contacting wire is pinched, clamped or jammed into the connection member. This may form a socalled cold weld in which case, a good electrical and mechanical connection is ensured between the contacting wire and the connection member.
The connection member can consist of a nonnoble metal.
Preferably, the connection point of the connection member into which the contacting wire is pinched, clamped or jammed is in the form of a groove, or like incision, the walls of which are inclined wedgewise at an angle to one another, either in the longitudinal or the transverse direction. This facilitates the introduction of the contacting wire into the connection member before the gripping thereof. The pinching, clamping or jamming of the wire into such a groove ensures that in the neighbourhood of the connection point, the contacting wire is provided with a smoothly changing cross-section, so that no mechanical weakening of the contacting wire or increase in its electrical resistance, occasioned by an abrupt change in its cross-section occurs.
In order to ensure a particularly good contact at the connection point between the contacting wire and the connection member, it is possible to use additional connecting methods, for example welding, soldering, sticking with an adhesive.
Welding, when used, may be ultrasonic welding or resistance welding.
The wedge-shaped tapering of the connection point in the connection member can be achieved by the use of a groove with a wedge-shaped taper and/or the use of clamping jaws inclined at an angle to one another. As previously stated, the deformation of the terminal wire during pinching thereof can result in a cold weld. The surface of the semiconductor body, the contacting wire arranged on this semiconductor body, and the groove can run in different planes and directions.
The contacting wire can moreover extend from the semiconductor body to the connection point in the connection member in the form of a curve.
The direction of contacting can therefore be selected at will.
The contacting wire can be inserted into a vertical slot or incision in the top of the connection member in which case the contacting wire is connected to the connection member within in the slot or incision by the application of lateral force. Alternatively, it is possible to bend the connection member itself around the contacting wire in which case force is applied to the bent portion of the connection member in order to connect the latter to the contacting wire.
It is also possible to insert the contacting wire into a lateral slot or incision in the connection member and then to connect the connection member to the contacting wire by the application of force to the connection member in the direction normal to the incision. The pinching, clamping or jamming of the contacting wire in the connection member allows the contacting wire to be welded to this member. The incision may be in the form of a groove. The connection member can alternatively be provided with a projection which is bent around the contacting wire in which case the force is applied at right angles to the bent-over projection in order to connect the connection member to the contacting wire.
The electrical connection between the semiconductor body and the connection member may conveniently be effected by means of a groove having a wedge-shaped cross-section, into which contacting wire already connected to the semiconductor body, in pinched or clamped.
The contacting method of the invention and the electrical connections formed by the method are particularly suitable for the contacting of luminescence diodes, electro-optical displays, photo-diodes, and the like. However, they can of course be used generally for any semiconductor components, including integrated circuits, and even to electrical components in general.
By the method of the invention, the contacting wire is securely attached to the connection member. For this purpose, the contacting wire is preferably clamped or pinched into the connection member so as to produce a cold weld.
The method of the invention allows the contacting direction to be freely selectable.
Moreover, there is no weakening of the crosssection of the contacting wire if a wedge-section connection point is used to which force can be applied, either mechanically or ultrasonically. It is also possible to use materials for the connection member without any special surface finishing. It is moreover possible to use all contacting wires having a relatively precise cross-section within a wide range of diameters and without the necessity for any noble metal coating. In addition, it is possible to re-equip existing contacting devices to make use of the contacting method of the invention without it being necessary to use any special measures. The dimensions of the contacting wire and of the connection member can vary within specific limits. The contacting wire can be of curved formation.In addition, the connection member can be securely anchored in the synthetic resinous material of a housing.
Instead of a connection member formed of metal, the component can be connected in accordance of metal, the component can be connected in accordance with the present invention to any other form of contact, e.g. a contact mounted on a printed circuit board.
The invention will now be further described with reference to the drawings, in which~ Figures 1 to 6 are schematic perspective views of various forms of semiconductor component connection member arrangements, to illustrate different methods of connecting the component to the connection member in accordance with the invention; Figures 7, 8 and 9 are similar perspective views of part of a connection member to illustrate three successive stages in a method according to the invention; Figures 10 and 1 1 are similar views of part of a connection member to illustrate two successive stages in another form of method according to the invention; and Figures 12 and 13 are similar schematic side views of part of a connection member to illustrate two successive stages in yet another form of method according to the invention.
In the various figures, like parts are indicated by the same reference numeral.
Figure 1 shows a carrier 1 and for a luminescence diode a connection member 2. The semiconductor body 4 of the luminescence diode is arranged in a recess 3 formed in the carrier 1. A contacting wire 6 leads between a contact point 5 on the semiconductor body 4 and the connection member 2 and is pinched or clamped into a slot or groove 7 in the top face of connection member 2.
The end of the contacting wire 6 remote from the semiconductor component is pinched or clamped into the slot or groove 7 of the connection member 2 by the lateral application of force in the direction of arrows 8 and 9, so that that end of the contacting wire 6 remote from the semiconductor is connected in form-locking fashion to the connection member 2. As will be seen, the groove 7 is wedge-shaped in plan view, so that a smooth deformation of the end of the wire occurs, without any abrupt change in its cross-section.
Before the application of the lateral force, jhe wire 6 can be held in the groove 7 by a hook, loop, coil, or other suitable holding means.
Figure 2 illustrates the contacting of a strip shaped connection member by the method of the invention. In this embodiment, the contacting wire 6 is clamped or pinched between two upward projections 10 and 1 1 of the terminal carrier 2 so as to form contact jaws, by the application of force in the direction of the arrows 8 and 9. The opposed faces of the projections 10 and 11 may run at an acute angle to one another, either in the horizontal or the vertical direction.
The upward projections 10 and 11 can be replaced by a single upward projection or by an upturned flange at the end of a lateral projection of the member 2, in which case a notch 7 is formed in the top face of the upward projection or flange, as illustrated in Figure 3.
As shown in Figure 3, the longitudinal direction of the notch 7 can, if desired, be arranged to run at an acute angle to the side surface of the semiconductor body 4 which faces the connection member 2.
Figure 4 illustrates another embodiment of the invention in whichthe end of the contacting wire 6 which is remote from the semiconductor body is clamped between a bent over end portion of the connection member 2 and the surface of the rest of the member 2.
Figure 5 illustrates an embodiment in which a base plate 15 is provided on which the semiconductor body 4 is arranged. In this embodiment, the contacting wire 6 leads to a groove or slot 7 provided in the upper end of a terminal pin 16 which is electrically insulated from the base plate 15 by an insulating meals 17. Here again, the contacting wire 6 is pinched or clamped into the groove or slot 7 of the terminal pin 16 by the lateral application of force in the direction of the arrows 8 and 9. As shown in Figure 5, the end of the wire 6 may project beyond the slot 7, attachment being effected ata part of the wire 6 close to its end, provided, of course, that there is no danger of the free end of the wire producing a short-circuit.
Figure 6 illustrates an embodiment which differs from that of Figure 5, in that the groove or slot 7 is arranged in the side surface of the pin 16 so that the pinching or clamping of the wire can be effected by the application of force to the top of the pin 1 6 at right angles to the surface of the semiconductor body 4 in the direction of an arrow 18.
Figure 7 is a detailed view of the groove 7 in the member 2, with the contacting wire 6 in position therein. As can be seen the groove 7 has a V-shaped cross-section and the contacting wire 6 is inserted into the bottom of the groove 7.
Force is then applied in the direction of the arrows 8 and 9. This serves to close the upper end of the groove 7 so that the contacting wire 6 is pinched into the groove 7, as shown in Figure 8. As shown in Figure 8, the lateral force may be applied eccentrically so that the groove is closed from one bend, thus arriding an abrupt change in the crosssection of the wire on deformation. The same effect can be obtained by the use of a groove having a wedge-shaped plan view. If even greater force is applied the groove 7 can be completely closed and the contacting wire 6 cold welded to the connection member 2 in the groove 7, as illustrated in in Figure 9.
Figure 10 illustrates another embodiment of the invention in which a projecting portion 20 of a flat connection member 2 is bent upwardly to form a U with the remainder of the member 2.
The contacting wire 6 is inserted below this projection 20. Force is then applied in the direction of the arrows 8 and 9 so that the wire 6 is pinched between the projection 20 and the remainder of the connection member 2 and is preferably cold welded to the member, as illustrated in Figure 11.
In Figure 12 a strip-shaped connection member 2 is provided with a V-shaped groove 7 in which a contacting wire 6 is arranged. A ram 21 having two rim tips applies force to both sides of the groove 7. As a result, the contacting wire 6 is joined to the connecting member 2 within the groove 7 by a wedging or jamming action.

Claims (23)

Claims
1. A method of contacting an electrical component by means of a contacting wire leading between the body of the component and an electrical contact, wherein the contacting wire at or near its end remote from the component is connected to the contact in form-locking manner by a pinching, clamping or jamming action.
2. A method as claimed in Claim 1, wherein said component is a semiconductor component.
3. A method as claimed in Claim 1 or Claim 2 wherein said electrical contact is an electrical connection member.
4. A method as claimed in Claim 3, wherein said connection member is provided with two faces tapering in wedge-shaped manner at the connection point, between which faces the contacting wire is pinched, clamped or jammed.
5. A method as claimed in Claim 2, wherein said contact,i,ng wire after pinching in the connection point has a smoothly changing crosssection.
6. A method as claimed in any one of Claims 3 to 5, wherein the material of said connection member is not subjected to any special surface treatment.
7. A method as claimed in any one of Claims 3 to 6, wherein said connection member consists of a non-noble metal.
8. A method as claimed in one of the preceding Claims, wherein the contacting wire is further connected to the electrical contact by an additional welding step.
9. A method as claimed in Claim 8, wherein the additional welding step is an ultrasonic welding or resistance welding step.
10. A method as claimed in any one of the preceding Claims, wherein during pinching of the contacting wire, deformation thereof results in a cold weld.
11. A method as claimed in Claim 4 or any one of Claims 5 to 10 as dependent thereon, wherein said tapering faces at the connection point are provided by a groove having a wedge-shaped plan or section, and/or by means of clamping members having opposed faces running at an acute angle to one another.
12. A method as claimed in Claim 1 wherein the surface of the component body and said groove lie in different planes and/or directions.
13. A method as claimed in any one of the preceding Claims, wherein the connection point on the electrical contact in the form of a curve.
14. A method as claimed in Claim 3, or any one of Claims 4 to 13 as dependent thereon, wherein the contacting wire is inserted into an incision in the upper surface of said connecting member and the contacting wire is thereafter connected to the connecting member within the incision by the application of lateral force.
1 5. A method as claimed in Claim 3, or any one of Claims 4 to 13 as dependent thereon, wherein said connecting member is bent around the contacting wire, the latter is then connected to the bent connecting member by the application of force thereto.
16. A method as claimed in Claim 3, or any one of Claims 4 to 13 as dependent thereon, wherein the contacting wire is inserted into a lateral incision in said connection member and is thereafter connected to the latter by the application of force to the upper surface thereof.
17. A method as claimed in Claim 3 or any one of Claims 4 to 13 as dependent thereon, wherein said connection member is provided with a projection which is bent around the contacting wire, and wherein force is thereafter applied at right angles to the bent over projection to connect the latter to the contacting wire.
18. A method as claimed in any one of the preceding Claims, wherein, prior to the actual contacting, the contacting wire is held in position by a hook, loop, coil, or other holding means.
19. A method of contacting an electrical component substantially as hereinbefore described with reference to any one of Figures 1 to 6, or to Figures 7 to 9, or Figures 10 and 11,or Figures 12 and 13 of the drawings.
20. An electrical component when contacted by a method as claimed in any one of Claims 1 to 19.
21. A luminescence diode as claimed in Claim
22. An electro-optical display as claimed in Claim 20.
23. A photo-diode as claimed in Claim 20.
GB8123100A 1980-07-28 1981-07-27 Method of Contacting Electrical Components Withdrawn GB2081029A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803028570 DE3028570A1 (en) 1980-07-28 1980-07-28 METHOD FOR CONTACTING SEMICONDUCTOR COMPONENTS

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GB2081029A true GB2081029A (en) 1982-02-10

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GB8123100A Withdrawn GB2081029A (en) 1980-07-28 1981-07-27 Method of Contacting Electrical Components

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JP (1) JPS5753953A (en)
DE (1) DE3028570A1 (en)
FR (1) FR2487578B1 (en)
GB (1) GB2081029A (en)

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EP0548584A2 (en) * 1991-12-24 1993-06-30 Minnesota Mining And Manufacturing Company Contact device for an electrical component and method for manufacture
WO1997027647A1 (en) * 1996-01-25 1997-07-31 Braun Aktiengesellschaft Contact for an electrical conductor

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JP2876363B2 (en) * 1991-09-11 1999-03-31 トヨタ自動車株式会社 Side impact sensor system for side airbag device

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Publication number Priority date Publication date Assignee Title
EP0548584A2 (en) * 1991-12-24 1993-06-30 Minnesota Mining And Manufacturing Company Contact device for an electrical component and method for manufacture
EP0548584A3 (en) * 1991-12-24 1994-07-06 Minnesota Mining & Mfg Contact device for an electrical component and method for manufacture
WO1997027647A1 (en) * 1996-01-25 1997-07-31 Braun Aktiengesellschaft Contact for an electrical conductor

Also Published As

Publication number Publication date
FR2487578B1 (en) 1986-01-10
JPS5753953A (en) 1982-03-31
DE3028570C2 (en) 1990-05-17
DE3028570A1 (en) 1982-03-04
FR2487578A1 (en) 1982-01-29

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