JPS5753952A - Method and device for wire bonding of semiconductor device - Google Patents

Method and device for wire bonding of semiconductor device

Info

Publication number
JPS5753952A
JPS5753952A JP55128529A JP12852980A JPS5753952A JP S5753952 A JPS5753952 A JP S5753952A JP 55128529 A JP55128529 A JP 55128529A JP 12852980 A JP12852980 A JP 12852980A JP S5753952 A JPS5753952 A JP S5753952A
Authority
JP
Japan
Prior art keywords
bonding
dynamic load
sensor
regulation
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55128529A
Other languages
Japanese (ja)
Other versions
JPS6225257B2 (en
Inventor
Takao Fujizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55128529A priority Critical patent/JPS5753952A/en
Publication of JPS5753952A publication Critical patent/JPS5753952A/en
Publication of JPS6225257B2 publication Critical patent/JPS6225257B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enhance stability and to reduce generation of inferiority in wire bonding of semiconductor device by a method wherein a sensor to neasure dynamic load at every bonding is fixed to a bonding device and a closed loop system to regulate and control dynamic load according to the measured results in sequential order is provided. CONSTITUTION:For example, in a device of plate spring method to operated an arm 2 in the vertical direction, the sensor 4 for measurement of dynamic strain is fixed to a plate spring 3. And in a device of cam method, the sensor 4' is fixed to the rotation supporting part 5 of an arm 2'. Bonding is performed measuring dynamic load in sequential order by the sensor 4, 4' about one IC. When bonding of next IC is to be performed, regulation is performed to hold dynamic load at a constant confoming to the previous data, and dynamic load after regulation is measured as the next data. For regulation and control by this closed loop, microcomputor, etc., for example, is used. Accordingly dynamic load can be held at a constant, and damage, etc., to be caused by high speed bonding can be prevented.
JP55128529A 1980-09-18 1980-09-18 Method and device for wire bonding of semiconductor device Granted JPS5753952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55128529A JPS5753952A (en) 1980-09-18 1980-09-18 Method and device for wire bonding of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55128529A JPS5753952A (en) 1980-09-18 1980-09-18 Method and device for wire bonding of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5753952A true JPS5753952A (en) 1982-03-31
JPS6225257B2 JPS6225257B2 (en) 1987-06-02

Family

ID=14986997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55128529A Granted JPS5753952A (en) 1980-09-18 1980-09-18 Method and device for wire bonding of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5753952A (en)

Also Published As

Publication number Publication date
JPS6225257B2 (en) 1987-06-02

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