JPS5753857B2 - - Google Patents

Info

Publication number
JPS5753857B2
JPS5753857B2 JP52141474A JP14147477A JPS5753857B2 JP S5753857 B2 JPS5753857 B2 JP S5753857B2 JP 52141474 A JP52141474 A JP 52141474A JP 14147477 A JP14147477 A JP 14147477A JP S5753857 B2 JPS5753857 B2 JP S5753857B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52141474A
Other languages
Japanese (ja)
Other versions
JPS5365226A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5365226A publication Critical patent/JPS5365226A/ja
Publication of JPS5753857B2 publication Critical patent/JPS5753857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
JP14147477A 1976-11-22 1977-11-22 Method for controlling nonnelectrolytic plating solution Granted JPS5365226A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74411076A 1976-11-22 1976-11-22

Publications (2)

Publication Number Publication Date
JPS5365226A JPS5365226A (en) 1978-06-10
JPS5753857B2 true JPS5753857B2 (xx) 1982-11-15

Family

ID=24991471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14147477A Granted JPS5365226A (en) 1976-11-22 1977-11-22 Method for controlling nonnelectrolytic plating solution

Country Status (14)

Country Link
JP (1) JPS5365226A (xx)
AT (1) AT354213B (xx)
AU (1) AU512805B2 (xx)
CA (1) CA1112523A (xx)
CH (1) CH637995A5 (xx)
DE (2) DE2759952C2 (xx)
ES (1) ES464266A1 (xx)
FR (1) FR2371522A1 (xx)
GB (1) GB1588758A (xx)
IL (1) IL53298A (xx)
IT (1) IT1116376B (xx)
NL (1) NL7712683A (xx)
SE (1) SE442410B (xx)
ZA (1) ZA775495B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149278U (xx) * 1987-03-19 1988-09-30

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5953348B2 (ja) * 1977-12-16 1984-12-24 株式会社日立製作所 化学銅めつき液の主成分自動管理方法並びにその装置
US4276323A (en) * 1979-12-21 1981-06-30 Hitachi, Ltd. Process for controlling of chemical copper plating solution
US4707377A (en) * 1983-10-31 1987-11-17 International Business Machines Corporation Copper plating
JPS6096767A (ja) * 1983-10-31 1985-05-30 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 銅めつき方法
JPS61110799A (ja) * 1984-10-30 1986-05-29 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属めつき槽の制御装置
US4623554A (en) * 1985-03-08 1986-11-18 International Business Machines Corp. Method for controlling plating rate in an electroless plating system
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
US4842886A (en) * 1987-11-04 1989-06-27 International Business Machines Corporation Method for electroless plating
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB2225026A (en) * 1988-11-22 1990-05-23 American Chem & Refining Co Electroless gold plating composition
JP2005206931A (ja) 2003-12-26 2005-08-04 Sumitomo Electric Ind Ltd 金属粉末の製造方法
JP5116068B2 (ja) * 2004-09-07 2013-01-09 Ｊｘ日鉱日石金属株式会社 無電解金めっき液の安定化方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124429A (en) * 1976-04-13 1977-10-19 Tokyo Shibaura Electric Co Method of automatically controlling plating speed in nonnelectrolytic plating

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3375178A (en) * 1964-05-28 1968-03-26 Continental Oil Co Method of confirming the occurrence of plating in electroless nickel-plating
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124429A (en) * 1976-04-13 1977-10-19 Tokyo Shibaura Electric Co Method of automatically controlling plating speed in nonnelectrolytic plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63149278U (xx) * 1987-03-19 1988-09-30

Also Published As

Publication number Publication date
DE2751104A1 (de) 1978-05-24
GB1588758A (en) 1981-04-29
FR2371522A1 (fr) 1978-06-16
IL53298A (en) 1981-02-27
FR2371522B1 (xx) 1980-02-15
ES464266A1 (es) 1978-08-01
NL7712683A (nl) 1978-05-24
AT354213B (de) 1979-12-27
IT1116376B (it) 1986-02-10
CA1112523A (en) 1981-11-17
JPS5365226A (en) 1978-06-10
SE7713192L (sv) 1978-05-23
IL53298A0 (en) 1978-01-31
ATA827777A (de) 1979-05-15
DE2759952C2 (de) 1984-03-08
CH637995A5 (en) 1983-08-31
ZA775495B (en) 1978-07-26
SE442410B (sv) 1985-12-23
AU3076077A (en) 1979-05-24
AU512805B2 (en) 1980-10-30

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