JPS5752197A - Method of insulating through hole of metal core printed board - Google Patents

Method of insulating through hole of metal core printed board

Info

Publication number
JPS5752197A
JPS5752197A JP11203281A JP11203281A JPS5752197A JP S5752197 A JPS5752197 A JP S5752197A JP 11203281 A JP11203281 A JP 11203281A JP 11203281 A JP11203281 A JP 11203281A JP S5752197 A JPS5752197 A JP S5752197A
Authority
JP
Japan
Prior art keywords
insulating
hole
printed board
metal core
core printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11203281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243558B2 (enrdf_load_stackoverflow
Inventor
Noiberuto Kurausu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS5752197A publication Critical patent/JPS5752197A/ja
Publication of JPS6243558B2 publication Critical patent/JPS6243558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
JP11203281A 1980-07-18 1981-07-17 Method of insulating through hole of metal core printed board Granted JPS5752197A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803027336 DE3027336A1 (de) 1980-07-18 1980-07-18 Verfahren zur bohrungsisolierung bei metallkernleiterplatten

Publications (2)

Publication Number Publication Date
JPS5752197A true JPS5752197A (en) 1982-03-27
JPS6243558B2 JPS6243558B2 (enrdf_load_stackoverflow) 1987-09-14

Family

ID=6107560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11203281A Granted JPS5752197A (en) 1980-07-18 1981-07-17 Method of insulating through hole of metal core printed board

Country Status (2)

Country Link
JP (1) JPS5752197A (enrdf_load_stackoverflow)
DE (1) DE3027336A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299197A (ja) * 1987-05-29 1988-12-06 Denki Kagaku Kogyo Kk 金属箔張り金属基板の製造方法
JPH02223436A (ja) * 1988-12-15 1990-09-05 Internatl Business Mach Corp <Ibm> 誘電体による充填方法
JPH06206178A (ja) * 1992-11-13 1994-07-26 Illinois Tool Works Inc <Itw> ファスナの内燃式打込み工具用燃料系統

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4700474A (en) * 1986-11-26 1987-10-20 Multitek Corporation Apparatus and method for temporarily sealing holes in printed circuit boards
US4777721A (en) * 1986-11-26 1988-10-18 Multitek Corporation Apparatus and method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material
US5208068A (en) * 1989-04-17 1993-05-04 International Business Machines Corporation Lamination method for coating the sidewall or filling a cavity in a substrate
DE69023382T2 (de) * 1989-04-17 1996-06-20 Ibm Laminierungsverfahren zum Überdecken der Seitenwände einer Höhlung in einem Substrat sowie zur Füllung dieser Höhlung.
US5932289A (en) * 1991-05-28 1999-08-03 Trikon Technologies Limited Method for filling substrate recesses using pressure and heat treatment
CH687490A5 (de) * 1992-03-25 1996-12-13 Dyconex Ag Leiterplattenverstaerkung.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681171A (en) * 1968-08-23 1972-08-01 Hitachi Ltd Apparatus for producing a multilayer printed circuit plate assembly
NL166171C (nl) * 1971-06-07 1981-01-15 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van, uit meerdere lagen opgebouwde, gedrukte schakelingen en inrichting ter realisering van deze werkwijze.
DE2739494B2 (de) * 1977-08-30 1980-10-16 Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen Verfahren zum Herstellen elektrischer Leiterplatten

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63299197A (ja) * 1987-05-29 1988-12-06 Denki Kagaku Kogyo Kk 金属箔張り金属基板の製造方法
JPH02223436A (ja) * 1988-12-15 1990-09-05 Internatl Business Mach Corp <Ibm> 誘電体による充填方法
JPH06206178A (ja) * 1992-11-13 1994-07-26 Illinois Tool Works Inc <Itw> ファスナの内燃式打込み工具用燃料系統

Also Published As

Publication number Publication date
JPS6243558B2 (enrdf_load_stackoverflow) 1987-09-14
DE3027336C2 (enrdf_load_stackoverflow) 1988-06-09
DE3027336A1 (de) 1982-02-18

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