JPS56101797A - Method of insulating printed circuit board with metal core as substrate - Google Patents

Method of insulating printed circuit board with metal core as substrate

Info

Publication number
JPS56101797A
JPS56101797A JP417180A JP417180A JPS56101797A JP S56101797 A JPS56101797 A JP S56101797A JP 417180 A JP417180 A JP 417180A JP 417180 A JP417180 A JP 417180A JP S56101797 A JPS56101797 A JP S56101797A
Authority
JP
Japan
Prior art keywords
substrate
circuit board
printed circuit
metal core
insulating printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP417180A
Other languages
Japanese (ja)
Inventor
Eiichi Satou
Tetsurou Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akai Electric Co Ltd
Original Assignee
Akai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akai Electric Co Ltd filed Critical Akai Electric Co Ltd
Priority to JP417180A priority Critical patent/JPS56101797A/en
Publication of JPS56101797A publication Critical patent/JPS56101797A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
JP417180A 1980-01-17 1980-01-17 Method of insulating printed circuit board with metal core as substrate Pending JPS56101797A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP417180A JPS56101797A (en) 1980-01-17 1980-01-17 Method of insulating printed circuit board with metal core as substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP417180A JPS56101797A (en) 1980-01-17 1980-01-17 Method of insulating printed circuit board with metal core as substrate

Publications (1)

Publication Number Publication Date
JPS56101797A true JPS56101797A (en) 1981-08-14

Family

ID=11577280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP417180A Pending JPS56101797A (en) 1980-01-17 1980-01-17 Method of insulating printed circuit board with metal core as substrate

Country Status (1)

Country Link
JP (1) JPS56101797A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122556A (en) * 1973-03-30 1974-11-22
JPS524543A (en) * 1975-06-30 1977-01-13 Mitsubishi Electric Corp Formation of coating layers bymeans of electrophoretic deposition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49122556A (en) * 1973-03-30 1974-11-22
JPS524543A (en) * 1975-06-30 1977-01-13 Mitsubishi Electric Corp Formation of coating layers bymeans of electrophoretic deposition

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