JPS5751731B2 - - Google Patents

Info

Publication number
JPS5751731B2
JPS5751731B2 JP50029701A JP2970175A JPS5751731B2 JP S5751731 B2 JPS5751731 B2 JP S5751731B2 JP 50029701 A JP50029701 A JP 50029701A JP 2970175 A JP2970175 A JP 2970175A JP S5751731 B2 JPS5751731 B2 JP S5751731B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP50029701A
Other languages
Japanese (ja)
Other versions
JPS51104262A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP50029701A priority Critical patent/JPS51104262A/ja
Publication of JPS51104262A publication Critical patent/JPS51104262A/ja
Publication of JPS5751731B2 publication Critical patent/JPS5751731B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP50029701A 1975-03-11 1975-03-11 Fushigatahandotaisochinoseizohoho Granted JPS51104262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50029701A JPS51104262A (en) 1975-03-11 1975-03-11 Fushigatahandotaisochinoseizohoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50029701A JPS51104262A (en) 1975-03-11 1975-03-11 Fushigatahandotaisochinoseizohoho

Publications (2)

Publication Number Publication Date
JPS51104262A JPS51104262A (en) 1976-09-14
JPS5751731B2 true JPS5751731B2 (enExample) 1982-11-04

Family

ID=12283406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50029701A Granted JPS51104262A (en) 1975-03-11 1975-03-11 Fushigatahandotaisochinoseizohoho

Country Status (1)

Country Link
JP (1) JPS51104262A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118658A (en) * 1981-12-07 1982-07-23 Hitachi Ltd Lead frame
JPS6080262A (ja) * 1983-10-07 1985-05-08 Nec Corp 半導体装置
JPS60167346U (ja) * 1984-04-13 1985-11-06 新日本無線株式会社 リ−ドフレ−ム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128485A (enExample) * 1974-09-04 1976-03-10 Hitachi Ltd

Also Published As

Publication number Publication date
JPS51104262A (en) 1976-09-14

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