JPS51104262A - FUSHIGATAHANDOTAISOCHINOSEIZOHOHO - Google Patents

FUSHIGATAHANDOTAISOCHINOSEIZOHOHO

Info

Publication number
JPS51104262A
JPS51104262A JP2970175A JP2970175A JPS51104262A JP S51104262 A JPS51104262 A JP S51104262A JP 2970175 A JP2970175 A JP 2970175A JP 2970175 A JP2970175 A JP 2970175A JP S51104262 A JPS51104262 A JP S51104262A
Authority
JP
Japan
Prior art keywords
fushigatahandotaisochinoseizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2970175A
Other languages
Japanese (ja)
Other versions
JPS5751731B2 (en
Inventor
Makoto Shimanuki
Hiroshi Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2970175A priority Critical patent/JPS51104262A/en
Publication of JPS51104262A publication Critical patent/JPS51104262A/en
Publication of JPS5751731B2 publication Critical patent/JPS5751731B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2970175A 1975-03-11 1975-03-11 FUSHIGATAHANDOTAISOCHINOSEIZOHOHO Granted JPS51104262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2970175A JPS51104262A (en) 1975-03-11 1975-03-11 FUSHIGATAHANDOTAISOCHINOSEIZOHOHO

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2970175A JPS51104262A (en) 1975-03-11 1975-03-11 FUSHIGATAHANDOTAISOCHINOSEIZOHOHO

Publications (2)

Publication Number Publication Date
JPS51104262A true JPS51104262A (en) 1976-09-14
JPS5751731B2 JPS5751731B2 (en) 1982-11-04

Family

ID=12283406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2970175A Granted JPS51104262A (en) 1975-03-11 1975-03-11 FUSHIGATAHANDOTAISOCHINOSEIZOHOHO

Country Status (1)

Country Link
JP (1) JPS51104262A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118658A (en) * 1981-12-07 1982-07-23 Hitachi Ltd Lead frame
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS60167346U (en) * 1984-04-13 1985-11-06 新日本無線株式会社 lead frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128485A (en) * 1974-09-04 1976-03-10 Hitachi Ltd PERETSUTO BONDEINGUSOCHI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5128485A (en) * 1974-09-04 1976-03-10 Hitachi Ltd PERETSUTO BONDEINGUSOCHI

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57118658A (en) * 1981-12-07 1982-07-23 Hitachi Ltd Lead frame
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS60167346U (en) * 1984-04-13 1985-11-06 新日本無線株式会社 lead frame

Also Published As

Publication number Publication date
JPS5751731B2 (en) 1982-11-04

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