JPS5128485A - - Google Patents

Info

Publication number
JPS5128485A
JPS5128485A JP49100877A JP10087774A JPS5128485A JP S5128485 A JPS5128485 A JP S5128485A JP 49100877 A JP49100877 A JP 49100877A JP 10087774 A JP10087774 A JP 10087774A JP S5128485 A JPS5128485 A JP S5128485A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP49100877A
Other languages
Japanese (ja)
Inventor
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP49100877A priority Critical patent/JPS5128485A/ja
Publication of JPS5128485A publication Critical patent/JPS5128485A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP49100877A 1974-09-04 1974-09-04 Pending JPS5128485A (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49100877A JPS5128485A (enExample) 1974-09-04 1974-09-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49100877A JPS5128485A (enExample) 1974-09-04 1974-09-04

Publications (1)

Publication Number Publication Date
JPS5128485A true JPS5128485A (enExample) 1976-03-10

Family

ID=14285539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49100877A Pending JPS5128485A (enExample) 1974-09-04 1974-09-04

Country Status (1)

Country Link
JP (1) JPS5128485A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (en) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp Fushigatahandotaisochinoseizohoho

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104262A (en) * 1975-03-11 1976-09-14 Mitsubishi Electric Corp Fushigatahandotaisochinoseizohoho

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