JPS5750456A - Resin sealed-type semiconductor device - Google Patents

Resin sealed-type semiconductor device

Info

Publication number
JPS5750456A
JPS5750456A JP12669880A JP12669880A JPS5750456A JP S5750456 A JPS5750456 A JP S5750456A JP 12669880 A JP12669880 A JP 12669880A JP 12669880 A JP12669880 A JP 12669880A JP S5750456 A JPS5750456 A JP S5750456A
Authority
JP
Japan
Prior art keywords
heat sink
groove
dampproofness
linear groove
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12669880A
Other languages
Japanese (ja)
Inventor
Yuzaburo Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12669880A priority Critical patent/JPS5750456A/en
Publication of JPS5750456A publication Critical patent/JPS5750456A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the warping of a heat sink and to perform resin sealing having superior dampproofness, by a method wherein a heat sink is provided with a linear groove along the longitudinal direction of the side adhering a semiconductor element and at least a semicircular curved groove to enclose the semiconductor element in a right angular direction. CONSTITUTION:A linear groove 12 is formed along the longitudinal direction of a heat sink 11. This is effective to prevent the warp of the heat sink 11 caused by resin material contracting action after sealing the heat sink with a resin material. An oval groove 13 is formed contacting with the linear groove 12 and crossing the linear groove 12 at right angles. This method is effective for dampproofness as a semiconductor element 3 is enclosed by the oval groove 13. This method prevents the warping of the heat sink and improves dampproofness and forms a resin sealed- type semiconductor device of high quality and high reliability.
JP12669880A 1980-09-12 1980-09-12 Resin sealed-type semiconductor device Pending JPS5750456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12669880A JPS5750456A (en) 1980-09-12 1980-09-12 Resin sealed-type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12669880A JPS5750456A (en) 1980-09-12 1980-09-12 Resin sealed-type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5750456A true JPS5750456A (en) 1982-03-24

Family

ID=14941627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12669880A Pending JPS5750456A (en) 1980-09-12 1980-09-12 Resin sealed-type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5750456A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0183024A2 (en) * 1984-11-30 1986-06-04 Degussa Aktiengesellschaft Apparatus for the avoidance of local overheating of measuring transducers
JPH0685432U (en) * 1993-05-25 1994-12-06 日本プロジェクト株式会社 Anchor fixture
US6512674B1 (en) * 1999-07-26 2003-01-28 Nec Corporation Package for semiconductor device having radiating substrate and radiator fin

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0183024A2 (en) * 1984-11-30 1986-06-04 Degussa Aktiengesellschaft Apparatus for the avoidance of local overheating of measuring transducers
JPH0685432U (en) * 1993-05-25 1994-12-06 日本プロジェクト株式会社 Anchor fixture
US6512674B1 (en) * 1999-07-26 2003-01-28 Nec Corporation Package for semiconductor device having radiating substrate and radiator fin

Similar Documents

Publication Publication Date Title
BR7900110A (en) PROCESS OF FORMING A DERIVATION SEAL, APPROPRIATE CLAMP FOR EMPLOYMENT IN THE PROCESS AND DERIVATION SET
AR226957A1 (en) METHOD FOR PRODUCING A SUBSTANTIALLY TORQUE-FREE THREAD, A DEVICE TO PUT IT INTO PRACTICE, AND THE THREAD PRODUCED BY THOSE
BE872286A (en) ARMED SEMICONDUCTOR FLEXIBLE HOSE AND METHOD FOR MANUFACTURING IT
BR8103993A (en) THYRISTOR MANUFACTURING PROCESS BY REDUCING THE REVERSE RECOVERY LOAD WITHOUT INCREASING THE DIRECT VOLTAGE FALL
DE3381811D1 (en) FIELD EFFECT TRANSISTOR WITH INSULATED GATE WITH A SILATE GATE.
BR8205892A (en) PROCESS AND ARRANGEMENT FOR SEALING BY PACKAGE LAMINATE HEAT
DE3485822T2 (en) SEMICONDUCTOR STORAGE DEVICE WITH FLOATING GATE ELECTRODE.
ES278464Y (en) POWER SEMI-CONDUCTOR COMPONENT ELEMENT.
JPS5750456A (en) Resin sealed-type semiconductor device
EP0106305A3 (en) Double heterostructure semiconductor laser with periodic structure formed in guide layer
ES520310A0 (en) PROCEDURE FOR PROCESSING GUAYULE RESIN MATERIAL.
BR8402085A (en) SELF-PROTECTED THYRISTOR AND MANUFACTURING PROCESS
JPS5797659A (en) Lead frame
BR8401082A (en) SEMICONDUCTOR ELEMENT
DE3381695D1 (en) SEMICONDUCTOR COMPONENT WITH CONTACT HOLE.
FR2546334B1 (en) ALLOY CONTACT FOR SEMICONDUCTOR MATERIAL WITH N-CONDUCTIVE GALLIUM-ALUMINUM ARSENIDE
JPS5617025A (en) Semiconductor device
JPS5326667A (en) Clamp chip of wire bonder
JPS55154118A (en) Heat sealing method and device for stuck member
JPS5752156A (en) Lead frame for semiconductor device
EP0101739A4 (en) Heterojunction transistor and method of fabricating the same.
DE3368153D1 (en) Asymmetrical thyristor for high inverse biasing
DE3363482D1 (en) Cap for pressing a compress provided for the therapeutic cooling treatment of the scalp
BR8108635A (en) SEMICONDUCTOR ELEMENT STACK
JPS5516439A (en) Resin seal semiconductor device