JPS5750073B2 - - Google Patents
Info
- Publication number
- JPS5750073B2 JPS5750073B2 JP51066407A JP6640776A JPS5750073B2 JP S5750073 B2 JPS5750073 B2 JP S5750073B2 JP 51066407 A JP51066407 A JP 51066407A JP 6640776 A JP6640776 A JP 6640776A JP S5750073 B2 JPS5750073 B2 JP S5750073B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Thyristors (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19752525390 DE2525390A1 (de) | 1975-06-06 | 1975-06-06 | Steuerbares halbleiterbauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5231678A JPS5231678A (en) | 1977-03-10 |
| JPS5750073B2 true JPS5750073B2 (OSRAM) | 1982-10-25 |
Family
ID=5948506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6640776A Granted JPS5231678A (en) | 1975-06-06 | 1976-06-07 | Controllable semiconductor element |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4041523A (OSRAM) |
| JP (1) | JPS5231678A (OSRAM) |
| DE (1) | DE2525390A1 (OSRAM) |
| ES (1) | ES448545A1 (OSRAM) |
| FR (1) | FR2313776A1 (OSRAM) |
| GB (1) | GB1502066A (OSRAM) |
| IT (1) | IT1060796B (OSRAM) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5563650A (en) * | 1978-11-02 | 1980-05-13 | Nitsupi Kousan Kk | Full automatic sterilizer |
| US4263607A (en) * | 1979-03-06 | 1981-04-21 | Alsthom-Atlantique | Snap fit support housing for a semiconductor power wafer |
| JPS55160437A (en) * | 1979-05-31 | 1980-12-13 | Hitachi Ltd | Semiconductor device |
| DE3221794A1 (de) * | 1982-06-09 | 1983-12-15 | Brown, Boveri & Cie Ag, 6800 Mannheim | Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente |
| JPS5951852A (ja) * | 1982-09-17 | 1984-03-26 | 三洋電機株式会社 | 蒸気式滅菌器 |
| US4587377A (en) * | 1984-09-21 | 1986-05-06 | Illinois Tool Works Inc. | Electrically insulating fastener for heat sinks of different thicknesses |
| JP2988589B2 (ja) * | 1995-12-14 | 1999-12-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 比較的高い電圧に適した表面実装用半導体装置及びその製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3513361A (en) * | 1968-05-09 | 1970-05-19 | Westinghouse Electric Corp | Flat package electrical device |
| US3525910A (en) * | 1968-05-31 | 1970-08-25 | Westinghouse Electric Corp | Contact system for intricate geometry devices |
| US3636419A (en) * | 1969-07-11 | 1972-01-18 | Siemens Ag | Pressure-biased semiconductor component free from damage to semiconductor body |
| BE790502A (fr) * | 1971-10-26 | 1973-04-25 | Westinghouse Electric Corp | Dispositif semiconducteur encapsule a l'aide d'un elastomere |
| US3962719A (en) * | 1974-12-05 | 1976-06-08 | Plastronics, Inc. | Mounting pad and semiconductor encapsulation device combination |
-
1975
- 1975-06-06 DE DE19752525390 patent/DE2525390A1/de not_active Withdrawn
-
1976
- 1976-06-01 US US05/691,622 patent/US4041523A/en not_active Expired - Lifetime
- 1976-06-02 GB GB2274176A patent/GB1502066A/en not_active Expired
- 1976-06-03 IT IT2388276A patent/IT1060796B/it active
- 1976-06-04 ES ES448545A patent/ES448545A1/es not_active Expired
- 1976-06-04 FR FR7617005A patent/FR2313776A1/fr not_active Withdrawn
- 1976-06-07 JP JP6640776A patent/JPS5231678A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5231678A (en) | 1977-03-10 |
| ES448545A1 (es) | 1977-07-01 |
| DE2525390A1 (de) | 1976-12-16 |
| IT1060796B (it) | 1982-09-30 |
| GB1502066A (en) | 1978-02-22 |
| FR2313776A1 (fr) | 1976-12-31 |
| US4041523A (en) | 1977-08-09 |